233645 ⎘
Printed circuits; Details; Electrical arrangements not otherwise provided for; Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane; Patterned shielding planes, ground planes or power planes Single or multiple openings in a shielding, ground or power plane
WIRING BOARD, ELECTRONIC COMPONENT MOUNTING PACKAGE INCLUDING WIRING BOARD, AND ELECTRONIC MODULE
#2SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC INTERFERENCE AND NOISE DURING TESTING
#3CONNECTOR AND PRINTED CIRCUIT BOARD WITH SURFACE GROUND PLANE
#4CIRCUIT BOARD
#5BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS
#6Core Resonance Suppression in Signal Integrity Optimized Package
#7FLEXIBLE WIRING BOARD, ELECTRONIC MODULE, ELECTRONIC UNIT, AND ELECTRONIC APPARATUS
#8RF FRONT-END FUNCTIONALITY INTEGRATED IN A COMPONENT CARRIER STACK
#9ENHANCED MICROSTRIP TRACE
#10PRINTED CIRCUIT BOARD FOR REDUCING POWER NOISE AND ELECTRONIC DEVICE INCLUDING THE SAME
#11CARRIER STRUCTURE
#12SEMICONDUCTOR MEMORY SYSTEM
#13ELECTRIC DEVICE
#14REDUCED BALL GRID ARRAY PAD CAPACITANCE
#15PRINTED CIRCUIT BOARDS AND SEMICONDUCTOR PACKAGES HAVING THE SAME
#16CIRCUIT BOARD AND ELECTRONIC DEVICE
#17SWITCHING POWER SUPPLY DEVICE
#18Method for shielding a printed circuit board from electromagnetic interference and noise during testing
#19Backplane footprint for high speed, high density electrical connectors
#20Techniques for reducing an eddy current in a ground plane of a coreless sensor
#21Printed flexible wiring apparatus in a cryostat
#22Circuit board
#23DISPLAY MODULE AND DISPLAY DEVICE
#24HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
#25Semiconductor memory system
#26Printed Circuit Board, Backplane Architecture System, and Communication Device
#27FLEXIBLE PCB RF CABLE
#28Ground discontinuities for thermal isolation
#29Circuit board
#30Module conductive shield including discontinuities to reduce device coupling
#31Printed circuit board for reducing power noise and electronic device including the same
#32DESIGN TECHNIQUE OF WIRING TO BE PROVIDED ON WIRING CIRCUIT BOARD TO BE MOUNTED IN ELECTRONIC APPARATUS
#33HIGH-FREQUENCY CIRCUIT
#34Backplane footprint for high speed, high density electrical connectors
#35Electronic substrate
#36Electronic module and electronic apparatus
#37Pattern-edged metal-plane resonance-suppression
#38Electronic device and circuit board thereof
#39Radio frequency filtering of printed wiring board direct current distribution layer
#40Slitted PCB for omni-directional like performance of off-center mounted antennas of passive access systems
#41FORMATION METHOD OF CHIP PACKAGE
#42Electronic device including connector
#43Ground discontinuities for thermal isolation
#44Printed circuit board and display device including the same
#45Multilayer resin substrate and electronic component
#46CONNECTOR AND PRINTED CIRCUIT BOARD WITH SURFACE GROUND PLANE
#47Systems for shielding bent signal lines
#48Backplane footprint for high speed, high density electrical connectors
#49Multipolar connector set including multiple connectors mounted to substrates having conductor patterns
#50Electronic apparatus
#51Semiconductor memory system
#52PCB RF noise grounding for shielded high-speed interface cable
#53Power delivery system
#54Backplane footprint for high speed, high density electrical connectors
#55Wiring board and method of manufacturing the same
#56Printed circuit board and electronic device including the same
#57Wiring substrate and electronic device
#58Common mode noise suppression filter
#59Waveguide launch system for coupling to a waveguide channel through a probe member on a first lamina and an integrated back-short on a second lamina
#60Method for shielding a printed circuit board from electromagnetic interference and noise during testing
#61Electromagnetic interference shields having attentuation interfaces
#62Non-directional in-line suspended PCB power sensing coupler
#63Multilayer substrate, electronic device, and method of manufacturing multilayer substrate
#64Flexible circuit board
#65Printed circuit board having a differential pair routing topology with negative plane routing and impedance correction structures
#66Printed circuit ion mirror with compensation
#67Circuit board and electronic device
#68Radio frequency filter and radio frequency module
#69System and method for ground via optimization for high speed serial interfaces
#70Fixture for shielding a printed circuit board from electromagnetic interference and noise during testing
#71Multilayer substrate and electric element
#72Pattern-edged metal-plane resonance-suppression
#73Resin multilayer substrate, electronic component, and mounting structure thereof
#74Resin multilayer substrate, electronic component, and mounting structure thereof
#75Backplane footprint for high speed, high density electrical connectors
#76Compound via RF transition structure in a multilayer high-density interconnect
#77Semiconductor memory system
#78Structure and formation method of chip package with shielding structure
#79Backplane footprint for high speed, high density electrical connectors
#80Printed circuit board and optical transceiver with the printed circuit board
#81Radio frequency filter and radio frequency module
#82Differential transmission line formed on a wiring substrate and having a metal conductor ground layer, where a metal conductor removal block is formed in the ground layer at a location of curved sections of the differential transmission line
#83Semiconductor memory system
#84Electronic device and rigid-flexible substrate module
#85Differential trace pair system
#86Mutual inductance suppressor for crosstalk immunity enhancement
#87Magnetic shielding package structure for MRAM device and method for producing the same
#88Transmission line, flat cable, and electronic device
#89PCB apparatus and methods and computer program products for manufacturing same
#90Circuit board and conductive pattern structure
#91Radio frequency connection arrangement
#92Printed circuit board and optical transceiver with the printed circuit board
#93Backplane footprint for high speed, high density electrical connectors
#94Carrier layout for an electro-optical module, an electro optical module using the same, and interconnect structure for coupling an electronic unit to an optical device
#95PCB and signal transmission system
#96Electronic device having circuit board including third conductors insulated from first and second conductors
#97Backplane footprint for high speed, high density electrical connectors
#98Ground layer design in a printed circuit board (PCB)
#99Flexible printed circuit board
#100Device, system and method to promote the integrity of signal communications
#101Non-uniform magnetic foil embedded in component carrier
#102Electronic device
#103Method for manufacturing wiring board and wiring board
#104Compact broadband common-mode filter
#105Electrical interconnect for a flexible electronic package
#106High-frequency signal transmission line and electronic device
#107Connection structure between optical device and circuit substrate, and optical transmission apparatus using the same
#108Shield structure for a low crosstalk single ended clock distribution circuit
#109Semiconductor device and method for manufacturing the same
#110Circuit board and electronic device
#111Multi-layer circuit member with reference planes and ground layer surrounding and separating conductive signal pads
#112Flexible circuit board having three-layer dielectric body and four-layer ground layer structure
#113Flexible circuit board having enhanced bending durability
#114Multilayer substrate
#115Method for producing wiring board
#116Electronic apparatus
#117Printed circuit board with high-capacity copper circuit
#118Radio frequency connection arrangement
#119Semiconductor memory system
#120Backplane footprint for high speed, high density electrical connectors
#121Printed circuit board and method of manufacturing the same
#122Multilayer resin substrate, and method of manufacturing multilayer resin substrate
#123Signal transmission system, connector apparatus, electronic device, and signal transmission method
#124Circuits and methods providing electronic band gap (EBG) structures at memory module electrical coupling
#125Circuit board and electronic circuit module using the same
#126Defected ground structure to minimize EMI radiation
#127Patterned ground structure filter designs with improved performance
#128High-frequency signal line, method for producing same, and electronic device
#129Inductor bridge and electronic device
#130Transmission line and flat cable
#131Circuit board and conductive pattern structure
#132Circuit board for power supply, electronic apparatus including the same, and inductor device
#133Semiconductor memory system
#134High-frequency signal line and manufacturing method thereof
#135Paddle card and plug-cable assembly
#136Printed wiring board
#137High-frequency signal transmission line and electronic device
#138Multilayer printed wiring board, and connection structure of multilayer printed wiring board and connector
#139Transmission line member and electronic apparatus
#140Semiconductor memory system
#141PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
#142Printed circuit board
#143WIRING BOARD
#144Printed circuit board and electronic device
#145Flexible board and electronic device
#146High-frequency signal transmission line and electronic apparatus
#147Signal transmission system, connector apparatus, electronic device, and signal transmission method
#148Semiconductor device
#149Printed circuit board
#150High-frequency signal transmission line and electronic device
#151Printed circuit board
#152PACKAGE-LEVEL ELECTROMAGNETIC INTERFERENCE SHIELDING STRUCTURES FOR A SUBSTRATE
#153Stack structure of high frequency printed circuit board
#154Electrical channel including pattern voids
#155Insulating film, printed circuit board using the same, and method of manufacturing the printed circuit board
#156Multilayer resin substrate, and method of manufacturing multilayer resin substrate
#157Flexible printed circuit board and manufacturing method of flexible printed circuit board
#158Transparent conductive coatings for optoelectronic and electronic devices
#159Multi-layer resin substrate having grounding conductors configured to form triplate line sections and microstrip sections
#160Printed wiring board
#161Printed wiring board
#162Flat cable
#163Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees
#164Transmission line, a transmission line apparatus, and an electronic device
#165Staggered power structure in a power distribution network (PDN)
#166Multi-layer printed circuit board structure, connector module and memory storage device
#167High-frequency transmission line
#168Inductor bridge and electronic device
#169Rule check system, method, and non-transitory computer readable medium storing presentation program
#170Wiring board and method of manufacturing the same
#171High-frequency signal transmission line
#172Noise suppression circuit board design for an inductive heater
#173Attenuation reduction structure for high frequency signal connection pads of circuit board with insertion component
#174Electrical connection interface for connecting electrical leads for high speed data transmission
#175Electromagnetic field manipulation around vias
#176Printed circuit board
#177High-frequency signal transmission line and electronic device
#178PCB AND DISPLAY DEVICE HAVING THE PCB
#179Element housing package and mounting structure body
#180High-frequency signal transmission line, electronic device and manufacturing method of high-frequency signal transmission line
#181Printed circuit boards including strip-line circuitry and methods of manufacturing same
#182Crosstalk reduction in signal lines by crosstalk introduction
#183High-frequency signal line
#184EBG structure, semiconductor device, and circuit board
#185Composite module
#186Interconnect structure for E/O engines having impedance compensation at the integrated circuits' front end
#187Integrated circuit
#188High-frequency signal line and manufacturing method thereof
#189High-frequency signal line and electronic device including the same
#190High-frequency signal line and method for producing base layer with signal line
#191Laminated flat cable and method for producing same
#192High-frequency signal transmission line and electronic device
#193High-frequency signal line
#194High-frequency signal line
#195Semiconductor memory system
#196Circuit carrier having a conducting path and an electric shield
#197High-frequency signal transmission line and electronic device
#198PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK
#199Flat cable
#200Guarded printed circuit board islands
#201Laminated multi-conductor cable
#202Attenuation reduction grounding structure for differential-mode signal transmission lines of flexible circuit board
#203Insulation circuit and communication equipment
#204Wiring board
#205Semiconductor memory system
#206Printed circuit board and memory module including the same
#207Capacitive blind-mate module interconnection
#208High-frequency transmission line and electronic device
#209Mesh planes with alternating spaces for multi-layered ceramic packages
#210Differential passive equalizer
#211System and method for using a reference plane to control transmission line characteristic impedance
#212High-frequency signal line, method for producing same, and electronic device
#213Printed circuit board
#214Flex circuit, an information handling system, and a method of manufacturing a flexible circuit
#215Flat cable
#216Optimized via cutouts with ground references
#217Flexible printed circuit
#218High-frequency signal line and electronic device
#219High-frequency signal transmission line and electronic device
#220Printed circuit board
#221High-frequency signal line and electronic device including the same
#222High-frequency signal transmission line and electronic device
#223Current breaker and wireless communication device having the same
#224Multilayer circuit substrate having core layer with through-hole
#225High-frequency signal transmission line and electronic apparatus
#226High-frequency signal transmission line and electronic apparatus
#227Semiconductor device and circuit board
#228High-frequency signal transmission line
#229High-frequency signal transmission line
#230High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk
#231Circuit substrate having noise suppression structure
#232Wiring board for mounting a semiconductor element
#233Signal line and circuit substrate
#234Decoupling method, appratus for designing power feeding line, and circuit board
#235Differential mode signal transmission module
#236High-frequency module
#237PRINTED CIRCUIT BOARDS
#238Signal distribution and filtering in low noise block downconverters
#239Printed circuit board
#240PRINTED CIRCUIT BOARD
#241Single Layer Touch-Control Sensor Structure With Reduced Coupling To Proximate Ground Structures
#242Printed circuit boards including strip-line circuitry and methods of manufacturing same
#243Printed circuit boards including strip-line circuitry and methods of manufacturing same
#244Method of manufacturing a printed circuit board
#245Printed circuit board with reduced cross-talk
#246Mesh planes with alternating spaces for multi-layered ceramic packages
#247Signal transmission system, connector apparatus, electronic device, and signal transmission method
#248PRINTED CIRCUIT BOARD CAPABLE OF LIMITING ELECTROMAGNETIC INTERFERENCE
#249PRINTED CIRCUIT BOARD
#250Printed circuit board and method of manufacturing the same
#251High-frequency signal transmission line
#252Semiconductor memory system
#253Printed wiring board including first and second insulating layers having dielectric loss tangents that are different by a predetermined relationship
#254Transparent conductive coatings for optoelectronic and electronic devices
#255WIRELESS COMMUNICATIONS USING MULTI-BANDPASS TRANSMISSION LINE WITH SLOT RING RESONATORS ON THE GROUND PLANE
#256PRINTED CIRCUIT BOARD INCLUDING AT LEAST ONE LAYER
#257Printed circuit board with compound via
#258Electrical impedance precision control of signal transmission line for circuit board
#259Printed circuit board with good performance on impedance
#260Signal line and circuit substrate
#261CIRCUIT BOARD STRUCTURE WITH LOW CAPACITANCE
#262Defected ground structure with shielding effect
#263Printed circuit board
#264Method and device for differential signal channel length compensation in electronic system
#265Printed circuit board
#266Coupler apparatus
#267Method of improving isolation between circuits on a printed circuit board
#268Method of improving isolation between circuits on a printed circuit board
#269Circuit board structure employing ferrite element
#270Printed circuit board with reduced signal distortion
#271Microstrip lines with tunable characteristic impedance and wavelength
#272PCB layout structrue for suppressing EMI and method thereof
#273Printed circuit board able to suppress simultaneous switching noise
#274CIRCUIT BOARD FOR REDUCING ELECTROMAGNETIC INTERFERENCE
#275Printed wiring board including power supply layer and ground layer
#276Integral charge storage basement and wideband embedded decoupling structure for integrated circuit
#277Electrical printed circuit board
#278Package substrate for integrated circuit and method of making the substrate
#279Printed circuit board with low noise
#280Apparatus and method for improving coupling across plane discontinuities on circuit boards
#281Circuit board device
#282Printed circuit boards with meshed conductive structures
#283Circuit board including noise removing unit
#284Stripline transmission lines with cross-hatched pattern return plane, where the striplines do not overlap any intersections in the cross-hatched pattern
#285Method for manufacturing a printed circuit board with high-capacity copper circuit
#286Shielded three-layer patterned ground structure