Substrate including wiring for transmitting signal, apparatus and system including the substrate

Submount for diode with single bottom electrode

Multilayer printed circuit board and method of manufacturing same

SURFACE MOUNT CIRCUIT BOARD, METHOD FOR MANUFACTURING SURFACE MOUNT CIRCUIT BOARD, AND METHOD FOR MOUNTING SURFACE MOUNT ELECTRONIC DEVICES

Module board

In-grid decoupling for ball grid array (BGA) devices

Electronic board incorporating a heating resistor

Use of breakouts in printed circuit board designs

Multilayer wiring board

Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

Multi-layer printed wiring board

Printed circuit board

Printed circuit board

Laterally Interconnected IC Packages and Methods

Interposer and electronic device using the same

Method and system for extracting heat from electrical components

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Semiconductor device and printed circuit board

WIRING BOARD WITH BUILT-IN CAPACITOR

Circuit module and power line communication apparatus

Circuit board including stubless signal paths and method of making same

Wiring board with built-in capacitor

Multilayered printed wiring board with a multilayered core substrate

Laminated bond of multilayer circuit board having embedded chips

Materials, structures and methods for microelectronic packaging

CHIP-ON-BOARD PACKAGE HAVING FLIP CHIP ASSEMBLY STRUCTURE AND MANUFACTURING METHOD THEREOF

Micro-via structure design for high performance integrated circuits

Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface

Interposer and method for manufacturing the same

Wiring board and method of manufacturing wiring board

Semiconductor device power interconnect striping

Printed circuit board

Layout of a printed circuit board

Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization attenuation and impedance mismatch characteristics

Pad structure for liquid crystal display and method of manufacturing thereof

METHOD FOR FORMING A PLATED MICROVIA INTERCONNECT

Interposer and electronic device using the same

Semiconductor package substrate for flip chip packaging

Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor

Method of providing a pre-patterned high-k dielectric film

Wiring board with built-in capacitor

Compliant conductive interconnects

Method for implementing enhanced wiring capability for electronic laminate packages

Stacked packages and microelectronic assemblies incorporating the same

Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system

Method for manufacturing wiring board

Circuit board including hybrid via structures

Wiring board, semiconductor device, and method for manufacturing wiring board

Electronic device substrate, electronic device and methods for fabricating the same

Wiring board

Semiconductor substrate-based interconnection assembly for semiconductor device bearing external elements

Electronic device with integrated heat distributor

Heat resistant substrate incorporated circuit wiring board

POWER SUPPLY STRUCTURE FOR HIGH POWER CIRCUIT PACKAGES

Circuit board and electronic apparatus having the same

High frequency module utilizing a plurality of parallel signal paths

Midplane with offset connectors

Multilayer printed board, electronic apparatus, and packaging method

Spread illuminating apparatus

Ball grid array package

Electronic circuit, a semiconductor device and a mounting substrate

Arrangement of non-signal through vias and wiring board applying the same

Interconnect design for reducing radiated emissions

LED Illumination Apparatus and Card-Type LED Illumination Source

Method for fabricating circuit board with conductive structure

High performance chip carrier substrate

Methods for fabricating fences on interposer substrates

Apparatus and method of via-stub resonance extinction

LAYOUT STRUCTURE OF A CONDUCTION REGION OF A CPU SOCKET

Field device incorporating circuit card assembly as environmental and EMI/RFI shield

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Camera module package

Built-in capacitor type wiring board and method for manufacturing the same

Mounting substrate, manufacturing method of mounting substrate and manufacturing method of semiconductor device

Via array capacitor, wiring board incorporating a via array capacitor, and method of manufacturing the same

Apparatus and method for mounting microelectronic devices on a mirrored board assembly

LAYOUT STRUCTURE OF BALL GRID ARRAY

Enhancing shock resistance in semiconductor packages

Bonding pad with high bonding strength to solder ball and bump

Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area

High frequency module

Printed circuit board, electronic device, and manufacturing method for printed circuit board

Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument

Assessing bypass capacitor locations in printed circuit board design

Built-in capacitor type power feed device to power pins of electrical component

Capacitor and electronic apparatus thereof

Interposer and electronic device fabrication method

Area array routing masks for improved escape of devices on PCB

Substrate structure and method for wideband power decoupling

Method of manufacturing capacitor for incorporation in wiring board, capacitor for incorporation in wiring board, and wiring board

Wiring board and ceramic chip to be embedded

Circuit substrate

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

High speed interface design

Copper substrate with feedthroughs and interconnection circuits

Electronic package connected to a substrate

Printed circuit board having embedded RF module power stage circuit

Circuit board for inkjet head

Stacked microvias and method of manufacturing same

Wiring board and method for manufacturing the same

Interposers with alignment fences and semiconductor device assemblies including the interposers

Wiring board and manufacturing method of wiring board

Zero ATE insertion force interposer daughter card

Probe pad structure in a ceramic space transformer

Technique for accommodating electronic components on a multilayer signal routing device

Semiconductor device with substrate having penetrating hole having a protrusion

Ball grid array assignment

Multilayer circuit board and method of manufacturing the same

Ball assignment system

Alignment fences and devices and assemblies including the same

IC package with prefabricated film capacitor

Method for increasing wiring channels/density under dense via fields

Memory module and signal line arrangement method thereof

Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs

Substrate structure for light-emitting diode module

ENHANCED HEAT SYSTEM FOR BGA/CGA REWORK

Surface-acoustic-wave-device mount substrate, high-frequency module using the same, and communication apparatus

High aspect ratio plated through holes in a printed circuit board

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Card type LED illumination source

Tile-based routing method of a multi-layer circuit board and related structure

Ballout for buffer

Multi-sheet conductive substrates for microelectronic devices and methods for forming such substrates

Electrical printed circuit board

Method for fabricating semiconductor components with conductive vias

Wiring board having connecting wiring between electrode plane and connecting pad

Semiconductor device and method of manufacture thereof, circuit board and electronic instrument

Substrate via pad structure providing reliable connectivity in array package devices

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Wired circuit board

Method for temporarily engaging electronic component for test

Chip bond layout for chip carrier for flip chip applications

Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same

Materials, structures and methods for microelectronic packaging

Routing power and ground vias in a substrate

Field device incorporating circuit card assembly as environmental and EMI/RFI shield

Wiring substrate and semiconductor device using the same

System and method for capacitive coupled via structures in information handling system circuit boards

Routing differential signal lines in a substrate

Method of manufacturing printed wiring board

Substrates including alignment fences

High wireability microvia substrate

Printed wiring board

Buried array capacitor and microelectronic structure incorporating the same

Wiring substrate and method of fabricating the same

Semiconductor package, method of production of same, and semiconductor device

Intermediate substrate

Wire bonding method and apparatus for integrated circuit

Enhanced blind hole termination of pin to PCB

Semiconductor device

Submount for diode with single bottom electrode

Package modification for channel-routed circuit boards

Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias

Semiconductor device power interconnect striping

Card-type LED illumination source

Structure for repairing or modifying surface connections on circuit boards

Card-type LED illumination source

Semiconductor device and printed circuit board

Multilayer printed board, electronic apparatus, and packaging method

LED illumination apparatus and card-type LED illumination source

Delivery regions for power, ground and I/O signal paths in an IC package

Intermediate substrate

Integrated circuit characterization printed circuit board

Stacked packages and systems incorporating the same

Multilayer wiring board

Optimized power delivery to high speed, high pin-count devices

Interconnect structure and method for connecting buried signal lines to electrical devices

Circuit board surface mount package

Surface mounting of components

Shared via decoupling for area arrays components

Printed circuit board and method for manufacturing printed circuit board

Structure of stacked vias in multiple layer electrode device carriers

Multilayer wiring board including stacked via structure

Semiconductor device and electronic equipment using the same

Apparatuses and methods to route line to line

Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device

Wiring layout of auxiliary wiring package and printed circuit wiring board

High performance chip carrier substrate

High wireability microvia substrate

Method of fabricating the routing of electrical signals

Method of forming a through-substrate interconnect

Test system with interconnect having conductive members and contacts on opposing sides

Carrier for cleaning sockets for semiconductor components having contact balls

High density microvia substrate with high wireability

Memory system and memory module

Capacitor and method of producing same

Optimization of routing layers and board space requirements for a ball grid array package

Optimization of routing layers and board space requirements for a ball grid array land pattern

Chip package with degassing holes

Apparatus for providing an integrated printed circuit board registration coupon

Method for forming ball pads of BGA substrate

Tape circuit substrate and semiconductor chip package using the same

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

High-frequency semiconductor device

Integrated circuit characterization printed circuit board, test equipment including same, method of fabrication thereof and method of characterizing an integrated circuit device

Method of manufacturing a semiconductor device by forming plating layers having differing thicknesses

Flexible tape electronics packaging and methods of manufacture

Circuit board with embedded components and method of manufacture

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Capacitor device and method of manufacturing the same

Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits

Apparatus and method for mounting microelectronic devices on a mirrored board assembly

Apparatus and method for mounting microelectronic devices on a mirrored board assembly

Rapid implementation of high-temperature analog interface electronics

Printed wiring board and memory system

Circuit board and method for manufacturing the same

Circuit board with non-plated hole interposed between plated holes to prevent formation of conductive anodic filament

Multi part plastic assembly that snaps into or is captured into existing plastic or metal junction boxes, switch boxes and receptacle boxes to simplify connection wiring to individual switches, receptacles, USB ports, GFCIS

Hybrid interconnect device and method

Electronic component

Connection pad for embedded components in PCB packaging

Optical module and optical transmission equipment

Grid array pattern for crosstalk reduction

Grid array pattern for crosstalk reduction

System and method of utilizing serpentine regions

Electronic device and electronic circuit board thereof

Multilayer structure and related method of manufacture for electronics

Flexible printed circuit and printed circuit board soldered structure

DIMM connector region vias and routing

Method of attaching electronic module on fabrics by stitching metal foil

Integrated circuit packaging system with plated copper posts and method of manufacture thereof

Removal of electrostatic charges from an interposer via a ground pad thereof for die attach for formation of a stacked die

System and method for improving isolation in high-density laminated printed circuit boards