234335 ⎘
Indexing scheme relating to printed circuits covered by; Dielectrics; Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
#2DEVICE WITH LAMINATED STRUCTURE AND METHOD OF MANUFACTURING A LAMINATED STRUCTURE COMPRISING DIELECTRIC LAYERS
#3THIN DIELECTRIC SUBSTRATE FOR LOW THERMAL RESISTANCE AND LOW PARASITIC INDUCTANCE
#4CIRCUIT BOARD
#5CIRCUIT BOARD, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE
#6Circuit signal enhancement method of circuit board and structure thereof
#7PCB WITH INTERNAL CAPACITORS AND A MULTILAYER CAPACITANCE PLANE
#8Flexible circuit board with thermally conductive connection to a heat sink
#9Multi-dielectric printed circuit board
#10Circuit board with bridge chiplets
#11MANUFACTURE OF A CURVED ELECTRONIC DEVICE USING DIFFERENTIAL HEATING AND CURVED ELECTRONIC DEVICE
#12Substrate and electronic device
#13Hybrid boards with embedded planes
#14Variable dielectric constant materials in same layer of a package
#15Stretchable substrate, method for manufacturing stretchable substrate, device for manufacturing stretchable substrate structure, and method for manufacturing stretchable substrate structure
#16Flexible circuit board with improved bending reliability and manufacturing method thereof
#17Stretchable substrate, method for manufacturing stretchable substrate, device for manufacturing stretchable substrate structure, and method for manufacturing stretchable substrate structure
#18INTERCONNECT SUBSTRATE HAVING BUFFER MATERIAL AND CRACK STOPPER AND SEMICONDUCTOR ASSEMBLY USING THE SAME
#19Vibration-damped circuit arrangement, converter, and aircraft having such an arrangement
#20Simultaneous and selective wide gap partitioning of via structures using plating resist
#21Simultaneous and selective wide gap partitioning of via structures using plating resist
#22Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
#23HIGH-FREQUENCY ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
#24Stretchable substrate, method for manufacturing stretchable substrate, device for manufacturing stretchable substrate structure, and method for manufacturing stretchable substrate structure
#25Multilayer rigid flexible printed circuit board and method for manufacturing the same
#26Printed circuit board and package having the same
#27Conductor path structure having a component received in a vibration-damped manner
#28SEMICONDUCTOR ASSEMBLY HAVING DUAL WIRING STRUCTURES AND WARP BALANCER
#29Shielded package assemblies with integrated capacitor
#30METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD
#31Simultaneous and selective wide gap partitioning of via structures using plating resist
#32Multl-phase layered busbar for conducting electric energy wherein the layers are glued together, method of manufactoring the same and switchboard cabinet including such a busbar
#33Multi-phase busbar for conducting electric energy and method of manufacturing the same
#34Multilayer rigid flexible printed circuit board and method for manufacturing the same
#35Mounting assembly with a heatsink
#36SUBSTRATE WITH STRESS RELIEVING FEATURES
#37Leadframe substrate having modulator and crack inhibiting structure and flip chip assembly using the same
#38Simultaneous and selective wide gap partitioning of via structures using plating resist
#39Circuit board, method for manufacturing circuit board, and electronic device
#40Pin array including segmented pins for forming selectively plated through holes
#41Device, system and method to promote the integrity of signal communications
#42Circuit board for reducing transmitting loss and electronic device therewith
#43Method of manufacturing a component embedded package carrier
#44Printed circuit board with built-in vertical heat dissipation ceramic block, and electrical assembly comprising the board
#45Hybrid microelectronic substrate and methods for fabricating the same
#46Production method for printed wiring board having dielectric layer
#47Selective partitioning of via structures in printed circuit boards
#48STRAIN ISOLATION STRUCTURES FOR STRETCHABLE ELECTRONICS
#49Circuit board and electronic device
#50METHOD OF MAKING THERMALLY ENHANCED WIRING BOARD HAVING ISOLATOR INCORPORATED THEREIN
#51Conductor path structure having a component received in a vibration-damped manner
#52Stretchable wiring board
#53High-frequency electronic device and manufacturing method thereof
#54Differential signal transmitting circuit board
#55Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#56Fabrication method of substrate structure
#57Multi-layer printed circuit board having first and second coaxial vias coupled to a core of a dielectric waveguide disposed in the circuit board
#58Circuit board with bridge chiplets
#59Non-planar on-package via capacitor
#60Simultaneous and selective wide gap partitioning of via structures using plating resist
#61Simultaneous and selective wide gap partitioning of via structures using plating resist
#62Shielded package assemblies with integrated capacitor
#63Light emitting device
#64Method of manufacturing a printed circuit board
#65Polymer-ceramic composites
#66Substrates for stretchable electronics and method of manufacture
#67Microwave generator for a microwave device and microwave device
#68Circuit board and method for manufacturing a circuit board
#69Wiring board and method for manufacturing the same
#70Self-decap cavity fabrication process and structure
#71Circuit board via configurations for high frequency signaling
#72Multilayer rigid flexible printed circuit board and method for manufacturing the same
#73PRINTED CIRCUIT BOARD
#74Circuit obfuscation using differing dielectric constants
#75Wiring board having isolator and bridging element and method of making wiring board
#76Radio frequency coupling and transition structure
#77Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips
#78Printed circuit board consisting of at least two printed circuit board regions
#79Printed circuit board assembly with foam dielectric material
#80Contact-distance transformer, electrical testing device, and method for producing a contact-distance transformer
#81Copper clad laminate provided with protective layer and multilayered printed wiring board
#82Image pickup apparatus and method for manufacturing image pickup apparatus
#83Printed board and electronic apparatus
#84Rigid-flex electronic module
#85Strain isolation structures for stretchable electronics
#86Dielectric waveguide core between ground planes secured in a channel
#87Flexible electronic module and manufacturing method thereof
#88Printed circuit board structure
#89Coreless multi-layer circuit substrate with minimized pad capacitance
#90Printed circuit board
#91Substrate comprising embedded elongated capacitor
#92Signal transmission board and method for manufacturing the same
#93Printed circuit board having electronic component embedded
#94Printed circuit board and method of manufacturing the same
#95Printed circuit board and method of manufacturing the same
#96Substrate structure and fabrication method thereof
#97Noise blocking printed circuit board and manufacturing method thereof
#98Capacitors for multilayer printed circuit boards
#99Strain isolation structures for stretchable electronics
#100Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#101Radio frequency coupling structure and a method of manufacturing thereof
#102Selective partitioning of via structures in printed circuit boards
#103Chip capacitors
#104Circuit substrate and method for manufacturing the same
#105Wiring board having electrical isolator and moisture inhibiting cap incorporated therein and method of making the same
#106Embedded semiconductor device package and method of manufacturing thereof
#107Component built-in board and method of manufacturing the same, and mounting body
#108Shielded package assemblies with integrated capacitor
#109Flexible printed circuits with bend retention structures
#110Circuit board having bypass pad
#111Printed circuit boards for communications connectors having openings that improve return loss and/or insertion loss performance and related connectors and methods
#112Wiring board and method of manufacturing the same
#113Reduced backdrilling with quarter wavelength transmission line stubs
#114Circuit board
#115Circuit board equipped with a high-frequency component emitting interference waves
#116Printed circuit board and method of manufacturing the same
#117Method of manufacturing printed circuit board having electronic component embedded
#118Advanced grounding scheme
#119Circuit board via configurations for high frequency signaling
#120Flex-rigid wiring board and method for manufacturing flex-rigid wiring board
#121Printed circuit board package structure and manufacturing method thereof
#122Embedded semiconductor device package and method of manufacturing thereof
#123Variable stiffness film, variable stiffness flexible display, and method of manufacturing the variable stiffness film
#124High-frequency signal line
#125Wiring board and method for manufacturing the same
#126PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#127Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate
#128Simultaneous and selective wide gap partitioning of via structures using plating resist
#129Simultaneous and selective wide gap partitioning of via structures using plating resist
#130Strain isolation structures for stretchable electronics
#131Dielectric waveguide with non-planar interface surface and mating deformable material
#132Dielectric waveguide with extending connector and affixed deformable material
#133Method of manufacturing a printed circuit board
#134Wiring board and method of manufacturing wiring board
#135Communications connectors including transmission lines having impedance discontinuities that improve return loss and/or insertion loss performance and related methods
#136Hybrid substrate with high density and low density substrate areas, and method of manufacturing the same
#137Method of manufacturing a circuit board
#138Printed Circuit Board Comprising Both Conductive Metal and Optical Elements
#139Printed circuit board having DC blocking dielectric waveguide vias
#140Wiring substrate
#141Multilayered LED printed circuit board
#142Substrate with built-in electronic component
#143Ceramic multilayer substrate and method for manufacturing the same
#144Light-emitting device
#145Printed circuit board consisting of laminated substrates and electronic device comprising the same
#146Wiring substrate and manufacturing method thereof
#147Multilayer rigid flexible printed circuit board and method for manufacturing the same
#148Implementing enhanced low loss, thin, high performance flexible circuits
#149Mount board and electronic device
#150Package substrate and die spacer layers having a ceramic backbone
#151INTERCHIP COMMUNICATION USING EMBEDDED DIELECTRIC AND METAL WAVEGUIDES
#152INTERCHIP COMMUNICATION USING AN EMBEDDED DIELECTRIC WAVEGUIDE
#153Microstrip line of different widths, ground planes of different distances
#154Ultrathin buried die module and method of manufacturing thereof
#155Embedded capacitor module
#156Printed wiring board and method for manufacturing the same
#157Printed circuit boards including strip-line circuitry and methods of manufacturing same
#158Wiring board and probe card using the same
#159Electrical connector insulator housing
#160Method of manufacturing wiring substrate having built-in component
#161ELECTROMAGNETIC FIELD COUPLING STRUCTURE, MULTI-LAYER TRANSMISSION-LINE PLATE, METHOD OF MANUFACTURING ELECTROMAGNETIC FIELD COUPLING STRUCTURE, AND METHOD OF MANUFACTURING MULTI-LAYER TRANSMISSION-LINE PLATE
#162Component-incorporated wiring substrate and method of manufacturing the same
#163Method of manufacturing printed wiring board, and printed wiring board
#164Corles multi-layer circuit substrate with minimized pad capacitance
#165Coreless multi-layer circuit substrate with minimized pad capacitance
#166Electronic control unit and method of manufacturing the same
#167High-frequency circuit board
#168Manufacturing method of printing circuit board with micro-radiators
#169Electronic circuit module and method of making the same
#170Multilayer printed wiring board
#171Circuit board having bypass pad
#172Flex-rigid wiring board and method of manufacturing the same
#173CIRCUIT BOARD
#174PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#175Method for manufacturing a circuit board
#176Package carrier and manufacturing method thereof
#177Method for producing a printed circuit board consisting of at least two printed circuit board regions, and printed circuit board
#178Circuit module
#179Method of cavity forming on a buried resistor layer using a fusion bonding process
#180Capacitor-incorporated substrate and component-incorporated wiring substrate
#181PRINTING CIRCUIT BOARD WITH MICRO-RADIATORS
#182Method of forming multilayer capacitors in a printed circuit substrate
#183Circuit obfuscation using differing dielectric constants
#184Compliant core peripheral lead semiconductor test socket
#185CORE VIA FOR CHIP PACKAGE AND INTERCONNECT
#186HIGH-SPEED SIGNAL TRANSMISSION BOARD
#187Embedded capacitor substrate module
#188Package substrate and die spacer layers having a ceramic backbone
#189Method of fabricating a circuit board
#190Wiring board, electronic component embedded substrate, method of manufacturing wiring board, and method of manufacturing electronic component embedded substrate
#191Opto-electrical hybrid wiring board and method for manufacturing the same
#192Printed wiring board with dielectric material sections having different dissipation factors
#193Chip Capacitor Precursors
#194Assembly method for converting the precursors to capacitors
#195Method for manufacturing flex-rigid wiring board
#196Circuit board and manufacturing method thereof
#197CIRCUIT BOARD
#198PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC EQUIPMENT
#199Multilayer wiring board and method for manufacturing the same
#200Flex-rigid wiring board and method of manufacturing the same
#201Method of manufacturing printed wiring board
#202Flex-rigid wiring board and method of manufacturing the same
#203Printed wiring board, electronic device, and printed wiring board manufacturing method
#204Method of manufacturing wiring board
#205FLEXIBLE WIRING BOARD AND METHOD OF MANUFACTURING SAME
#206Capacitively coupled connector using liquid dielectric for improved performance
#207WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#208WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#209Mount board and electronic device
#210Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
#211Coreless multi-layer circuit substrate with minimized pad capacitance
#212Flex-rigid wiring board and method of manufacturing the same
#213METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD
#214WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD
#215Method and structure for coaxial via routing in printed circuit boards for improved signal integrity
#216Method of fabricating cavity capacitor embedded in printed circuit board
#217MULTILAYER PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
#218Wiring board and method for manufacturing the same
#219Electronic circuit module and method of making the same
#220Multilayer rigid flexible printed circuit board and method for manufacturing the same
#221Printed wiring board with built-in semiconductor element, and process for producing the same
#222METHOD FOR MANUFACTURING AN ELECTRONIC ASSEMBLY
#223Method for fabricating a printed circuit board having differential trace profile
#224Printed circuit board having electromagnetic bandgap structure
#225Flex-rigid wiring board and method for manufacturing the same
#226Multilayer printed wiring board
#227Heat resistant substrate incorporated circuit wiring board
#228PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME
#229Method of manufacturing mounting structure and mounting structure
#230Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate
#231Circuit board having bypass pad
#232Printed circuit board and method of manufacturing the same
#233Printed circuit board
#234Electronic device
#235Core via for chip package and interconnect
#236Capacitor devices
#237Multilayer capacitors and methods for making the same
#238Method of manufacturing a rigid printed wiring board
#239Insulating aperture in printed circuit boards
#240Circuit board having bypass pad
#241HIGH IMPEDANCE TRACE
#242Plastic articles, optionally with partial metal coating
#243ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME
#244Multilayer printed wiring board
#245Differential signal transmission cable and method for compensating length offset thereof
#246Substrate for mounting semiconductor element and method for manufacturing substrate for mounting semiconductor element
#247Printed circuit board and method of manufacturing printed circuit board
#248Component-containing module
#249Opto-electrical hybrid wiring board and method for manufacturing the same
#250Electronic device
#251Rigid-flex module and manufacturing method
#252Method of manufacturing a circuit board
#253Printed wiring board and method for manufacturing the same
#254Ceramic multilayer substrate
#255Printed circuit board for optical waveguide and method of manufacturing the same
#256BURIED CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND METHOD OF CHANGING CAPACITANCE THEREOF
#257WIRING BOARD AND FABRICATION METHOD THEREFOR
#258Capacitor device and method of manufacturing the same
#259Wiring board and fabrication method therefor
#260Method of constructing inductors and transformers
#261Wiring substrate and method of manufacturing the wiring substrate
#262Interconnection assembly for printed circuit boards
#263Tunable Dielectric Compositions and Methods
#264CRYSTALLINE ENCAPSULANTS
#265Component built-in wiring substrate and manufacturing method thereof
#266Composite organic encapsulants
#267Integrated capacitors in package-level structures, processes of making same, and systems containing same
#268Circuit board with connection layer with fillet
#269Electronic Assembly and Backlight Module
#270Method of manufacturing printed wiring board with built-in electronic component
#271BOARD UNIT AND MANUFACTURING METHOD FOR THE SAME
#272Flex-rigid wiring board and method for manufacturing the same
#273Method of manufacturing a flex-rigid wiring board
#274Flex-rigid wiring board and electronic device
#275Printed circuit board
#276Printed circuit board
#277Circuit obfuscation
#278PRINTED CIRCUIT BOARD WITH EMBEDDED CAPACITORS THEREIN, AND PROCESS FOR MANUFACTURING THE SAME
#279Method for manufacturing a stretchable electronic device
#280CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS
#281Method of manufacturing a printed wiring board with built-in electronic component
#282Printed circuit board, method of fabricating printed circuit board, and semiconductor device
#283Simultaneous and selective partitioning of via structures using plating resist
#284Printed wiring board and method for manufacturing the same
#285Multilayer wiring board and method for manufacturing the same
#286Heat resistant substrate incorporated circuit wiring board
#287Heat resistant substrate incorporated circuit wiring board
#288ELECTRONIC COMPONENT MOUNTED STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#289Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
#290Method for manufacturing multilayer printed wiring board
#291Electronic component and electronic component module
#292Method for fabricating package substrate and die spacer layers having a ceramic backbone
#293Method of Manufacturing a Printed Circuit Board
#294Flexible wiring board and method of manufacturing same
#295Method of forming solid vias in a printed circuit board
#296Flexible printed circuit board and display device having the same
#297Capacitive substrate and method of making same
#298Method of manufacturing printed wiring board with built-in electronic component
#299Interconnection assembly for printed circuit boards
#300Interconnection assembly for printed circuit boards