H05K2201/0218 - CPC Classification Index

#1

20260153804

2026-06-04

PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

#2

20250223471

2025-07-10

CONDUCTIVE ADHESIVE LAYER AND HEAT DISSIPATION STRUCTURE

#3

20220353988

2022-11-03

Metal-clad laminate and printed wiring board

#4

20220022325

2022-01-20

Barrier layer

#5

20200362169

2020-11-19

Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor

#6

20200154575

2020-05-14

Barrier layer

#7

20200040162

2020-02-06

FILLER FOR RESINOUS COMPOSITION, FILLER-CONTAINING SLURRY COMPOSITION AND FILLER-CONTAINING RESINOUS COMPOSITION

#8

20200024741

2020-01-23

MATERIAL DEPOSITION IN A MAGNETIC FIELD

#9

20190387616

2019-12-19

LIGHT EMITTING ELEMENT

#10

20190150279

2019-05-16

Prepreg, metal-clad laminated board, and printed wiring board

#11

20170253758

2017-09-07

Core-shell nanostructures and related inks, films and methods

#12

20170253757

2017-09-07

Silver nanoparticle ink

#13

20170233884

2017-08-17

Method of manufacturing cu core ball

#14

20160368105

2016-12-22

Cu core ball, solder paste, formed solder, Cu core column, and solder joint

#15

20160358688

2016-12-08

CONDUCTIVE PASTE, METHOD OF PRODUCING PATTERN, METHOD OF PRODUCING CONDUCTIVE PASTE, AND SENSOR

#16

20160316554

2016-10-27

Connection structure of circuit member, connection method, and connection material

#17

20160068964

2016-03-10

Doped tin oxide and method for selective metallization of insulating substrate

#18

20160005504

2016-01-07

Electroconductive microparticles, anisotropic electroconductive material, and electroconductive connection structure

#19

20150322276

2015-11-12

Flexible conductive ink

#20

20150248946

2015-09-03

Electrically conductive composition

#21

20150208509

2015-07-23

Component-mounted structure

#22

20150159057

2015-06-11

Curable compositions comprising composite particles

#23

20150107765

2015-04-23

UV-curable anisotropic conductive adhesive

#24

20150024120

2015-01-22

Conductive-pattern forming method and composition for forming conductive pattern by photo irradiation or microwave heating

#25

20140349030

2014-11-27

POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME

#26

20140209691

2014-07-31

Selective deposition of magnetic particles and using magnetic material as a carrier medium to deposit nanoparticles

#27

20140209366

2014-07-31

Wiring board and method of manufacturing wiring board

#28

20140183733

2014-07-03

Metal core solder ball and heat dissipation structure for semiconductor device using the same

#29

20140140030

2014-05-22

Conductive material, conductive paste, circuit board, and semiconductor device

#30

20130092423

2013-04-18

METHOD FOR FORMING CONDUCTIVE CIRCUIT

#31

20120247817

2012-10-04

CONDUCTIVE PARTICLES, CONDUCTIVE PASTE, AND CIRCUIT BOARD

#32

20120228559

2012-09-13

Conductive fine particles and anisotropic conductive material

#33

20120152455

2012-06-21

Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same

#34

20120114521

2012-05-10

Stabilized metal nanoparticles and methods for production thereof

#35

20120106111

2012-05-03

ANISOTROPIC ELECTRICALLY AND THERMALLY CONDUCTIVE ADHESIVE WITH MAGNETIC NANO-PARTICLES

#36

20120100374

2012-04-26

Metal nanoparticles and methods for producing and using same

#37

20120090882

2012-04-19

Conductive particle, and anisotropic conductive film, bonded structure, and bonding method

#38

20120058917

2012-03-08

Nucleic Acids and Libraries

#39

20120056136

2012-03-08

Conductive fine particles, anisotropic conductive element, and connection structure

#40

20110293922

2011-12-01

Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component

#41

20110267791

2011-11-03

CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL

#42

20110183128

2011-07-28

Core-shell metallic nanoparticles, methods of production thereof, and ink compositions containing same

#43

20110155430

2011-06-30

Anisotropic conductive adhesive composite and film, and circuit connecting structure including the same

#44

20110141704

2011-06-16

Circuit board, electronic device and method for manufacturing the same

#45

20110127068

2011-06-02

POLYMER PARTICLE, CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

#46

20110120759

2011-05-26

Circuit board, electronic device and method for manufacturing the same

#47

20110088935

2011-04-21

Conductive particle, anisotropic conductive film, joined structure, and joining method

#48

20110031449

2011-02-10

CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL

#49

20100315796

2010-12-16

Conductive material, conductive paste, circuit board, and semiconductor device

#50

20100271432

2010-10-28

Nanoparticles, conductive ink and circuit line forming device

#51

20100243107

2010-09-30

Material and method of manufacturing of a solder joint with high thermal conductivity and high electrical conductivity

#52

20100209599

2010-08-19

Electrically Conductive Composition

#53

20100171064

2010-07-08

Nanoparticles, conductive ink and circuit line forming device

#54

20100108952

2010-05-06

Core-shell structure metal nanoparticles and its manufacturing method thereof

#55

20100104839

2010-04-29

High-dielectric material

#56

20100090176

2010-04-15

Voltage switchable dielectric material containing conductor-on-conductor core shelled particles

#57

20100065616

2010-03-18

Lead solder-free electronics

#58

20100059260

2010-03-11

Composite metallic particle, dispersion of a composite metallic particle, ink for making a conductive substrate, method for making a conductive substrate and a conductive substrate

#59

20090301344

2009-12-10

Photochemical synthesis of bimetallic core-shell nanoparticles

#60

20090294160

2009-12-03

METHOD OF MAKING PRINTED WIRING BOARD AND ELECTRICALLY-CONDUCTIVE BINDER

#61

20090294056

2009-12-03

Method of making printed wiring board and method of making printed circuit board unit

#62

20090233117

2009-09-17

Method for soldering electronic component and soldering structure of electronic component

#63

20090220812

2009-09-03

Solder paste

#64

20090214780

2009-08-27

Negative coefficient of thermal expansion particles

#65

20090114885

2009-05-07

Electrically conductive adhesive

#66

20090096100

2009-04-16

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

#67

20090084588

2009-04-02

Circuit board, electronic device and method for manufacturing the same

#68

20090068916

2009-03-12

Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same

#69

20090050856

2009-02-26

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL INCORPORATING MODIFIED HIGH ASPECT RATIO PARTICLES

#70

20080261049

2008-10-23

Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts

#71

20080110531

2008-05-15

Material and method of manufacture of a solder joint with high thermal conductivity and high electrical conductivity

#72

20080048009

2008-02-28

Paste for soldering and soldering method using the same

#73

20070290175

2007-12-20

Production of metal nanoparticles from precursors having low reduction potentials

#74

20070289706

2007-12-20

Process for producing multilayer board

#75

20070278456

2007-12-06

SOLDER PASTE

#76

20070245852

2007-10-25

Solder paste and electronic device

#77

20070226995

2007-10-04

SYSTEM AND METHOD FOR ADHERING LARGE SEMICONDUCTOR APPLICATIONS TO PCB

#78

20070216012

2007-09-20

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

#79

20070212562

2007-09-13

Core-shell structure metal nanoparticles and its manufacturing method

#80

20070190349

2007-08-16

Electroconductive fine particle and anisotropically electroconductive material comprising non-crystal and crystal nickel plating layers and method of making thereof

#81

20070145585

2007-06-28

Conductive particles for anisotropic conductive interconnection

#82

20070092698

2007-04-26

Conductive particle with protrusions and anisotropic conductive material therefrom

#83

20070075299

2007-04-05

Conductive adhesive, method of producing the same, and bonding method

#84

20070000967

2007-01-04

Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith

#85

20060278853

2006-12-14

Radiation curable conductive ink and manufacturing method for using the same

#86

20060267218

2006-11-30

Method for mounting an electronic part on a substrate using a liquid containing metal particles

#87

20060168803

2006-08-03

Layered board and manufacturing method of the same, electronic apparatus having the layered board

#88

20060145352

2006-07-06

Electronic device

#89

20060012460

2006-01-19

Conductive particles, conductive composition, electronic device, and electronic device manufacturing method

#90

20050266213

2005-12-01

Layered board and manufacturing method of the same, electronic apparatus having the layered board

#91

20050230667

2005-10-20

Conductive adhesive and circuit using the same

#92

20050183543

2005-08-25

Silver powder made of silver particles, each to which fine silver particles adhere and process of producing the same

#93

20050100743

2005-05-12

Negative coefficient of thermal expansion particles and method of forming the same