H05K2201/0206 - CPC Classification Index

ClassID:

234340 ⎘

H05K2201/0206 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles Materials

Sub-classes:

H05K2201/0209 » Inorganic, non-metallic particles 1,2K
H05K2201/0209 » Inorganic, non-metallic particles 1,2K
H05K2201/0212 » Resin particles 217
H05K2201/0212 » Resin particles 217
H05K2201/0215 » Metallic fillers 195
H05K2201/0215 » Metallic fillers 195
H05K2201/0218 » Composite particles, i.e. first metal coated with second metal 91
H05K2201/0218 » Composite particles, i.e. first metal coated with second metal 91
H05K2201/0221 » Insulating particles having an electrically conductive coating 85
H05K2201/0221 » Insulating particles having an electrically conductive coating 85
H05K2201/0224 » Conductive particles having an insulating coating 129
H05K2201/0224 » Conductive particles having an insulating coating 129
H05K2201/0227 » Insulating particles having an insulating coating 19
H05K2201/0227 » Insulating particles having an insulating coating 19
H05K2201/023 » Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode 9
H05K2201/023 » Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode 9
H05K2201/0233 » Deformable particles 26
H05K2201/0233 » Deformable particles 26
H05K2201/0236 » Plating catalyst as filler in insulating material 78
H05K2201/0236 » Plating catalyst as filler in insulating material 78
H05K2201/0239 » Coupling agent for particles 96
H05K2201/0239 » Coupling agent for particles 96

Recent Application in this class:

20260006718

STRUCTURE BODY AND WIRING BOARD

20260006717

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

20250393132

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

20250031318

PLATED VIA-IN-VIA VERTICAL CONNECTION

20240292517

CIRCUIT CARRIER BOARD

20240284596

CIRCUIT BOARD STRUCTURE AND DISPLAY DEVICE

20240032210

CIRCUIT ASSEMBLY

20240032201

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

20230299018

PACKAGE SUBSTRATE AND COMMUNICATION DEVICE

20210273183

Flexible substrate and display device

20210235582

Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board

20180228023

ANGLED FIBERGLASS CLOTH WEAVES

20160229990

Thermosetting resin composition and uses thereof

20160163611

Laminate substrates having radial cut metallic planes

20160081189

Composition for forming a conductive film, a conductive film, a method for producing a plating film, a plating film, and an electronic device

20160066421

SOLDER PASTE AND ELECTRONIC PART

20150014030

Composition for forming silver ion diffusion-suppressing layer, film for silver ion diffusion-suppressing layer, circuit board, electronic device, conductive film laminate, and touch panel

20150014027

Wiring board and method for manufacturing the same