H05K2201/023 - CPC Classification Index

ClassID:

234348 ⎘

H05K2201/023 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles; Materials Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode

Recent Application in this class:

20230422405

2023-12-28

CIRCUIT STRUCTURE FOR HOT-PRESS BONDING

20200077523

2020-03-05

Method for flip-chip bonding using anisotropic adhesive polymer

20190090354

2019-03-21

Anisotropic conductive film

20160316569

2016-10-27

Mounting body manufacturing method and anisotropic conductive film

20150340120

2015-11-26

Curable composition for electronic component and connection structure

20120085580

2012-04-12

Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device

20110293922

2011-12-01

Conductive resin composition, method for manufacturing electronic component using same, bonding method, bonding structure, and electronic component

20110250395

2011-10-13

Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus

20050127504

2005-06-16

Semiconductor device having insulating material dispersed with conductive particles which establish electrical connection by penetrating to both copper conductive layer and land of wiring board