ClassID:

234349

H05K2201/0233 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles; Materials Deformable particles

Recent Application in this class:
#1
20210410283
2021-12-30

Biphasic material and stretchable circuit board

#2
20200321510
2020-10-08

Liquid ejection apparatus

#3
20190157541
2019-05-23

Liquid ejection apparatus

#4
20160327826
2016-11-10

Connection body, method for manufacturing a connection body, connecting method and anisotropic conductive adhesive agent

#5
20150208509
2015-07-23

Component-mounted structure

#6
20150034366
2015-02-05

Circuit board

#7
20150009633
2015-01-08

Display apparatus and circuit board module thereof

#8
20120152455
2012-06-21

Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same

#9
20120112215
2012-05-10

LED-based light source utilizing asymmetric conductors

#10
20110100683
2011-05-05

Electronic textile

#11
20100080995
2010-04-01

Method for connecting electronic part and joined structure

#12
20090068916
2009-03-12

Method of manufacturing conductive particle, anisotropic conductive adhesive having the same, and method of manufacturing display apparatus using the same

#13
20080153207
2008-06-26

Breakable interconnects and structures formed thereby

#14
20080102277
2008-05-01

Conductive particles comprising complex metal layer with density gradient, method for preparing the particles, and anisotropic conductive adhesive composition comprising the particles

#15
20080078977
2008-04-03

Conductive particles and method of preparing the same

#16
20070299159
2007-12-27

Resin particle, conductive particle, and anisotropic conductive adhesive containing the same

#17
20070252112
2007-11-01

Polymer particles, conductive particles, and an anisotropic conductive packaging materials containing the same

#18
20070145585
2007-06-28

Conductive particles for anisotropic conductive interconnection

#19
20070138649
2007-06-21

Conductive bump with a plurality of contact elements

#20
20060286721
2006-12-21

Breakable interconnects and structures formed thereby

#21
20060263581
2006-11-23

Insulated conductive particles and an anisotropic conductive film containing the particles

#22
20060154070
2006-07-13

Coated conductive particle coated conductive particle manufacturing method anisotropic conductive material and conductive connection structure

#23
20060054867
2006-03-16

Conductive particle and adhesive agent

#24
20060033873
2006-02-16

Liquid crystal device and manufacturing method therefor

#25
20050228144
2005-10-13

Resin particle, conductive particle and anisotropic conductive adhesive containing the same

#26
20050110406
2005-05-26

Interconnector, method for manufacturing a plasma display device using the same, and a plasma display device with the same