234350 ⎘
Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles; Materials Plating catalyst as filler in insulating material
METHOD OF MAKING A MOLDED INTERCONNECT DEVICE
#2Electroless and electrolytic deposition process for forming traces on a catalytic laminate
#3Catalytic laminate with conductive traces formed during lamination
#4Thermosetting resin composition for LDS, resin molded article, and three-dimensional molded interconnect device
#5Catalytic laminate with conductive traces formed during lamination
#6Molded interconnect device
#7Process for forming traces on a catalytic laminate
#8Selective metallization of an integrated circuit (IC) substrate
#9Component carrier and method for manufacturing the same
#10Embedded circuit patterning feature selective electroless
#11Composition for forming conductive pattern and resin structure having conductive pattern
#12Package structure and manufacturing method of package structure
#13Polymer product and method for selectively metallizing polymer substrate
#14Semiconductor structure
#15Package structure
#16Via in a printed circuit board
#17Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#18Package structure
#19Light source unit
#20Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#21Via in a printed circuit board
#22Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon
#23Doped tin oxide and method for selective metallization of insulating substrate
#24Laser activatable polymer composition
#25Package substrate structure
#26Via in a printed circuit board
#27Method for forming traces of a printed circuit board
#28Methods for forming embedded traces
#29Core-shell composite inorganic metal oxides and method of preparing for prevention of thermal oxidative degradation in polymer and resin compositions
#30Embedded circuit patterning feature selective electroless copper plating
#31Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layer
#32High modulus laser direct structuring polycarbonate composites with enhanced plating performance and broad laser window and methods for the manufacture and use thereof
#33Metal compound, method for preparing the same, selective metallization of surface of substrate with the metal compound
#34Process for electroless copper deposition on laser-direct structured substrates
#35Plug and method for producing same
#36Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layer
#37Electronic device housing and method for manufacturing the same
#38Method for improving plating on non-conductive substrates
#39CIRCUIT BOARD AND FABRICATION METHOD THEREOF
#40Method of manufacturing embedded wiring board
#41METHOD FOR SELECTIVELY METALLIZING A SUBSTRATE AND INTERCONNECT DEVICE PRODUCED BY THIS METHOD
#42EMBEDDED STRUCTURE OF CIRCUIT BOARD
#43Molded Interconnect Device (MID) with Thermal Conductive Property and Method for Production Thereof
#44Manufacturing Method for Forming Circuit Structure on Non-Conductive Carrier
#45Method of fabricating circuit board structure
#46Compositions and methods for creating electronic circuitry
#47METHOD FOR ELECTRIC CIRCUIT DEPOSITION
#48MULTILAYER THREE-DIMENSIONAL CIRCUIT STRUCTURE
#49Method for improving plating on non-conductive substrates
#50COMPOSITION WITH CATALYST PARTICLES
#51CIRCUIT BOARD AND FABRICATION METHOD THEREOF
#52Method of fabricating a solder pad structure
#53Embedded wiring board and a manufacturing method thereof
#54Carrier Structure for Electronic Components and Fabrication Method of the same
#55METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF
#56METHOD FOR FORMING CIRCUIT BOARD STRUCTURE OF COMPOSITE MATERIAL
#57Substrates for Electronic Circuitry Type Applications
#58Composite circuit substrate structure
#59Multilayer three-dimensional circuit structure and manufacturing method thereof
#60Method for making an embedded structure
#61Compositions and methods for creating electronic circuitry
#62CIRCUIT BOARD STRUCTURE
#63Fabricating process of structure with embedded circuit
#64High dielectric constant laser direct structuring materials
#65COMPOSITIONS AND METHODS FOR CREATING ELECTRONIC CIRCUITRY
#66Metal Film Formation Method of Metal Film
#67Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same
#68Sensor component with a cavity housing and a sensor chip and method for producing the same
#69High-current traces on plated molded interconnect device
#70Polymer layer comprising silicone and at least one metal trace and a process of manufacturing the same
#71Polymer comprising silicone and metal trace
#72Method of manufacturing wiring substrate, and wiring substrate
#73Plating method
#74Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same
#75Gas bag module
#76Methods and systems for fabricating electronic and/or microfluidic structures on elastomeric substrates
#77Plating of multi-layer structures
#78Formation of layers on substrates