H05K2201/0248 - CPC Classification Index

ClassID:

234354 ⎘

H05K2201/0248 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles; Shape of an individual particle Needles or elongated particles; Elongated cluster of chemically bonded particles

Recent Application in this class:

20200315019

2020-10-01

Method for fabrication of a soft-matter printed circuit board

20190215965

2019-07-11

Method for fabrication of a soft-matter printed circuit board

20190153177

2019-05-23

Resin composition, prepreg, metal foil-clad laminate, resin sheet and printed circuit board

20170062373

2017-03-02

Electronic apparatus and method for fabricating the same

20170012013

2017-01-12

Electronic apparatus and method for fabricating the same

20160353570

2016-12-01

Resin composition for packaging and printed circuit board using the same

20160247776

2016-08-25

Electronic apparatus and method for fabricating the same

20160192501

2016-06-30

Method of manufacturing a flexible and/or stretchable electronic device

20150162312

2015-06-11

Electronic apparatus and method for fabricating the same

#10

20150136219

2015-05-21

Conductive paste, method for forming wiring, electronic component, and silicon solar cell

#11

20140338735

2014-11-20

Nanowire-based transparent conductors and applications thereof

#12

20130220677

2013-08-29

Thermosetting adhesive composition, and heat resistant adhesive film and wiring film using the same

#13

20130199034

2013-08-08

Methods and apparatuses of using metal needle arrays for specimen lift-out and circuit edit

#14

20130168841

2013-07-04

Programmable interposer with conductive particles

#15

20130107485

2013-05-02

Interconnect structures and methods of making the same

#16

20120281362

2012-11-08

Silicon nitride substrate, circuit substrate and electronic device using the same

#17

20120152135

2012-06-21

Gravure printing of transparent conductive films containing networks of metal nanoparticles

#18

20120119626

2012-05-17

Conductive film, and transducer and flexible wiring board using the same

#19

20120067619

2012-03-22

CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

#20

20110297642

2011-12-08

Nanowire-based transparent conductors and applications thereof

#21

20110256342

2011-10-20

FILM ADHESIVE AND ANISOTROPIC CONDUCTIVE ADHESIVE

#22

20110234363

2011-09-29

Electronic device for voltage switchable dielectric material having high aspect ratio particles

#23

20110147048

2011-06-23

Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same

#24

20110088770

2011-04-21

Nanowire-based transparent conductors and applications thereof

#25

20110031001

2011-02-10

COMPOSITE METAL FINE PARTICLE MATERIAL, METAL FILM AND MANUFACTURING METHOD OF THE METAL FILM, AND PRINTED WIRING BOARD AND CABLE

#26

20100301709

2010-12-02

Piezoelectric vibrator with hermetically closed casing and filler comprising non-spherical conductive particles

#27

20100288534

2010-11-18

Printable composition with nanostructures of first and second types

#28

20100271831

2010-10-28

Light-emitting diode device for voltage switchable dielectric material having high aspect ratio particles

#29

20100243295

2010-09-30

Nanowire-based transparent conductors and applications thereof

#30

20100239851

2010-09-23

Nano and meso shell-core control of physical properties and performance of electrically insulating composites

#31

20100230141

2010-09-16

Structure of connecting printed wiring boards, method of connecting printed wiring boards, and adhesive having anisotropic conductivity

#32

20100147697

2010-06-17

Method for electroplating a substrate

#33

20100141376

2010-06-10

Electronic device for voltage switchable dielectric material having high aspect ratio particles

#34

20100139956

2010-06-10

Device applications for voltage switchable dielectric material having high aspect ratio particles

#35

20090233117

2009-09-17

Method for soldering electronic component and soldering structure of electronic component

#36

20090175019

2009-07-09

CIRCUIT-BOARD MODULE AND MANUFACTURING METHOD

#37

20090050856

2009-02-26

VOLTAGE SWITCHABLE DIELECTRIC MATERIAL INCORPORATING MODIFIED HIGH ASPECT RATIO PARTICLES

#38

20080206553

2008-08-28

Dispersion for Application of a Metal Layer

#39

20080143906

2008-06-19

Nanowire-based transparent conductors and applications thereof

#40

20070164349

2007-07-19

CIRCUIT BOARD, CIRCUIT APPARATUS, AND METHOD OF MANUFACTURING THE CIRCUIT BOARD

#41

20070158824

2007-07-12

Hybrid composite material substrate

#42

20070132098

2007-06-14

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

#43

20070114704

2007-05-24

Treatment of micropores in mica materials

#44

20070084629

2007-04-19

Low stress conductive polymer bump

#45

20070072425

2007-03-29

Substrate and method for producing same

#46

20070054104

2007-03-08

Spin-printing of electronic and display components

#47

20070026221

2007-02-01

Morphological forms of fillers for electrical insulation

#48

20060280873

2006-12-14

Seeding of HTC fillers to form dendritic structures

#49

20060197064

2006-09-07

Printable composition with nanostructures of first and second types

#50

20060113680

2006-06-01

Microelectronic packages with solder interconnections

#51

20060043608

2006-03-02

Low stress conductive polymer bump

#52

20050277351

2005-12-15

Structured resin systems with high thermal conductivity fillers

#53

20050074589

2005-04-07

Printable compositions having anisometric nanostructures for use in printed electronics

#54

20050062168

2005-03-24

Bonded structure using conductive adhesives, and a manufacturing method thereof