H05K2201/0242 - CPC Classification Index

ClassID:

234352 ⎘

H05K2201/0242 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles Shape of an individual particle

Sub-classes:

H05K2201/0245 » Flakes, flat particles or lamellar particles 118
H05K2201/0245 » Flakes, flat particles or lamellar particles 118
H05K2201/0248 » Needles or elongated particles; Elongated cluster of chemically bonded particles 54
H05K2201/0248 » Needles or elongated particles; Elongated cluster of chemically bonded particles 54
H05K2201/0251 » Non-conductive microfibers 29
H05K2201/0251 » Non-conductive microfibers 29
H05K2201/0254 » Microballoons or hollow filler particles 28
H05K2201/0254 » Microballoons or hollow filler particles 28
H05K2201/0257 » Nanoparticles 265
H05K2201/0257 » Nanoparticles 265
H05K2201/026 » Nanotubes or nanowires 341
H05K2201/026 » Nanotubes or nanowires 341

Recent Application in this class:

20260153804

2026-06-04

PHOTOSENSITIVE RESIN FILM, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE

20260143582

2026-05-21

MULTILAYER BODY AND METHOD FOR PRODUCING SAME

20250311115

2025-10-02

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

20250220813

2025-07-03

WIRING BOARD

20250203768

2025-06-19

CERAMIC WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE

20250142724

2025-05-01

WIRING BOARD

20240365468

2024-10-31

WIRING SUBSTRATE

20240324103

2024-09-26

WIRING SUBSTRATE

20240268021

2024-08-08

PRINTED WIRING BOARD

#10

20240237204

2024-07-11

WIRING SUBSTRATE

#11

20240043654

2024-02-08

RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND RESIN COATED COPPER COMPRISING SAME

#12

20230128938

2023-04-27

Coreless Component Carrier With Embedded Components

#13

20220005626

2022-01-06

Electroconductive particles and signal-transmitting connector having same

#14

20210267054

2021-08-26

CIRCUIT FORMATION METHOD AND CIRCUIT FORMATION DEVICE

#15

20200404785

2020-12-24

Circuit board using non-catalytic laminate with catalytic adhesive overlay

#16

20200325304

2020-10-15

THERMOSETTING RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING THE SAME

#17

20190239349

2019-08-01

Catalytic circuit board with traces and vias

#18

20190023960

2019-01-24

THERMALLY CONDUCTIVE BOARD

#19

20180168036

2018-06-14

Circuit board with catalytic adhesive

#20

20180054889

2018-02-22

Circuit board apparatus and method

#21

20170298218

2017-10-19

Halogen-free epoxy resin composition, prepreg, laminate and printed circuit board containing the same

#22

20160353570

2016-12-01

Resin composition for packaging and printed circuit board using the same

#23

20150124417

2015-05-07

Electronic component package

#24

15240133

2017-07-11

Catalytic laminate apparatus and method