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ClassID:

234356 ⎘

H05K2201/0254 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Fillers; Particles; Fibers; Reinforcement materials; Fillers and particles; Shape of an individual particle Microballoons or hollow filler particles

Recent Application in this class:
#1
20250126708
2025-04-17

MICROPARTICLE-FILLED LAMINATE MATERIAL

 #2
20250048560
2025-02-06

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING AGENT

 #3
20240314927
2024-09-19

SHEET FOR COMPONENT CARRIER COMPRISING SEPARATE STRUCTURES WITH FILLER PARTICLES HAVING DIFFERENT HOLLOW VOLUME THEREIN

 #4
20240206061
2024-06-20

WIRING SUBSTRATE

 #5
20220124911
2022-04-21

COATING AGENT AND METHOD FOR MANUFACTURING MODULE USING THE COATING AGENT

 #6
20210291269
2021-09-23

Direct printing and writing using undercooled metallic core-shell particles

 #7
20200154565
2020-05-14

Composite with hollow nano-structures and application thereof

 #8
20180354037
2018-12-13

Direct printing and writing using undercooled metallic core-shell particles

 #9
20180332719
2018-11-15

Forming conductive vias using healing layer

 #10
20150282329
2015-10-01

Methods for assembling electronic devices with adhesive

 #11
20150156866
2015-06-04

Transparent conductor, method for preparing the same, and optical display including the same

 #12
20150030824
2015-01-29

Circuit materials, circuits laminates, and method of manufacture thereof

 #13
20140345923
2014-11-27

Reducing dielectric loss in solder masks

 #14
20140147682
2014-05-29

Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layer

 #15
20120058917
2012-03-08

Nucleic Acids and Libraries

 #16
20100222487
2010-09-02

INORGANIC HOLLOW POWDER, PROCESS FOR PRODUCING THE INORGANIC HOLLOW POWDER, AND COMPOSITION COMPRISING THE INORGANIC HOLLOW POWDER

 #17
20100159231
2010-06-24

Thermosetting resin composition and board using the same

 #18
20100144924
2010-06-10

Polymerizable composition

 #19
20100104839
2010-04-29

High-dielectric material

 #20
20090314419
2009-12-24

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF

 #21
20090120673
2009-05-14

Multilayer circuit board and electronic device

 #22
20090030134
2009-01-29

Inorganic hollow particle, process for producing the same, and composition containing the same

 #23
20080221261
2008-09-11

LOW DIELECTRIC LOSS TANGENT RESIN COMPOSITION, CURABLE FILM AND CURED PRODUCT, ELECTRICAL PART USING THE SAME AND METHOD FOR PRODUCTION THEREOF

 #24
20070148421
2007-06-28

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF

 #25
20060142424
2006-06-29

Foamable underfill encapsulant

 #26
20060062976
2006-03-23

Printed circuit board material for embedded passive devices

 #27
20050277753
2005-12-15

Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof

 #28
20050006442
2005-01-13

Electronic package having controlled height stand-off solder joint

 #29
18597541
2025-06-17

Dielectric, copper clad laminate, circuit board, method for manufacturing copper clad laminate