Layout of a circuit board with stacked signal and reference layers and an opening in the reference layer

APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR

Method of making a circuit subassembly

SIGNAL TRANSMISSION STRUCTURE AND LAYOUT METHOD FOR THE SAME

MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE FOR USE IN IC INSPECTION DEVICE AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing component-embedded printed circuit board

Flexible printed circuit board

CTS and inspecting method thereof

PRINTED WIRING BOARD

Electronic Module Expansion Bridge

Control device and method for producing a control device

Circuit connection structure and printed circuit board

Producing method of suspension board with circuit

Printed circuit board having impedance-matched strip transmission line

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Wiring board and method for making the same

Electromagnetic bandgap structure and printed circuit board

Skew Compensation by Changing Ground Parasitic For Traces

Printed wiring board

Pin grid array package substrate including pins having anchoring elements

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

FLEXIBLE CIRCUIT

Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density

Lamp electrode printed circuit board and backlight unit including the same

PRINTED CIRCUIT BOARD

Wiring board connection method

Wired circuit board

SURFACE LIGHT EMITTING DIODE MODULE WITH A SURFACE LIGHT EMITTING DIODE CONNECTED TO A CONDUCTIVE SUBSTRATE TIGHTLY

Method of manufacturing a wired circuit board

Electromagnetic bandgap structure and printed circuit board

Metal wiring plate

Printed circuit board, method of manufacturing the same, and apparatus for perforating via holes

Apparatus for balancing power plane pin currents in a printed wiring board using collinear slots

Multi-layer board manufacturing method thereof

Gas venting component mounting pad

Method for manufacturing a circuit board structure

Method for manufacturing a circuit board

TEST MARK STRUCTURE, SUBSTRATE SHEET LAMINATE, MULTILAYERED CIRCUIT SUBSTRATE, METHOD FOR INSPECTING LAMINATION MATCHING PRECISION OF MULTILAYERED CIRCUIT SUBSTRATE, AND METHOD FOR DESIGNING SUBSTRATE SHEET LAMINATE

Interconnect assemblies, and methods of forming interconnects, between conductive contact bumps and conductive contact pads

Motherboard

VENTS WITH SIGNAL IMAGE FOR SIGNAL RETURN PATH

Printed circuit board having closed vias

Method for fabricating closed vias in a printed circuit board

Information handling system utilizing circuitized substrate with split conductive layer

Printed circuit board able to suppress simultaneous switching noise

Method of producing printed circuit board incorporating resistance element

iTFC with optimized C(T)

iTFC with optimized C(T)

Printed circuit board and electronic component device

Method for mating flexure to flex-print circuit and flexure therefor

Complementary mirror image embedded planar resistor architecture

METHOD FOR FORMING AN ELECTRICAL INTERCONNECT TO A SPRING LAYER IN AN INTEGRATED LEAD SUSPENSION

Skew compensation by changing ground parasitic for traces

DISPLAY APPARATUS AND METHOD OF FABRICATING THE SAME

Computer program for balancing power plane pin currents in a printed wiring board

Coaxial cable connecting board, converter, and high frequency apparatus

Printed circuit board having reliable bump interconnection structure, method of fabricating the same, and semiconductor package using the same

Substrate having blind hole and method for forming blind hole

Circuit board having configurable ground link and with coplanar circuit and ground traces

METHOD FOR PCB FUSING TRACE ARRANGEMENT FOR MOTOR DRIVE APPLICATIONS

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Wired circuit board

Capacitor having adjustable capacitance, and printed wiring board having the same

Wiring board, multilayer wiring board, and method for manufacturing the same

Marking apparatus used in a process for producing multi-layered printed circuit board

Composite multi-layer substrate and module using the substrate

Reference layer openings

Printed circuit board

Power plane to reduce voltage difference between connector power pins

Image sensor module

Printed circuit board with coextensive electrical connectors and contact pad areas

Circuit board

SUBSTRATE AND LAYOUT METHOD

Printed circuit board and semiconductor package using the same

Signal transmission assembly and display device applied with the same

Tailoring impedances of conductive traces in a circuit board

Printed circuit board

Wired circuit board assembly sheet

Direct power delivery into an electronic package

WIRING STRUCTURE, MULTILAYER WIRING BOARD, AND ELECTRONIC DEVICE

TAPE

Soldering nest for a bus bar

Differential signal transmission structure, wiring board, and chip package

Method of manufacturing a wiring substrate

Wired-circuit-board assembly sheet

Multi-layer printed circuit board, and method for detecting errors in laminating order of layers thereof

Differential transmission line structure and wiring substrate

Connector having a cut-out for reduced crosstalk between differential conductors

Plating bar design for high speed package design

Method of making circuitized substrate with split conductive layer and information handling system utilizing same

Wide web laser ablation

Electrical connector having a circuit board with controlled impedance

Printed wiring board and fabrication method for printed wiring board

Circuit Board Manufacturing Technique and Resulting Circuit Board

Internally shielded energy conditioner

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Printed wiring board and printed circuit board using the same

Printed wiring board with a plurality of pads and a plurality of conductive layers offset from the pads

Systems and methods for electromagnetic noise suppression using hybrid electromagnetic bandgap structures

PRINTED CIRCUIT BOARD

Printed wiring board assembly with self-compensating ground via and current diverting cutout

Multilayered circuit board design support method, program, and apparatus for suppressing thermal diffusion from solid-layer conductor to through hole

Computer-aided thermal relief pad design system and method

System to control signal line capacitance

Production method of suspension board with circuit

Lead-type electronic-part-mounted printed circuit board, method of soldering lead-type electronic part and air-conditioner

Flexible wiring board for magnetic head assembly

Printed circuit board for real-time clock IC and manufacturing method for printed circuit board for real-time clock IC

Method for making noble metal conductive leads for suspension assemblies

Tab tape for tape carrier package

Four-way lead flat package IC-mount printed circuit board, method of soldering four-way-lead flat package IC and air conditioner

Method for high-precision fixing of a miniaturized component on a support plate

Integral charge storage basement and wideband embedded decoupling structure for integrated circuit

Circuit board and circuit apparatus using the same

Multilayer printed wiring board fabrication method and multilayer printed wiring board

Wired circuit board

Printed circuit board including pads with vacancies

Tape distribution substrate having pattern for reducing EMI

Display panel and display device

Substrate warpage control and continuous electrical enhancement

Inkjet head and connection structure of wiring board

Apparatus having reduced warpage in an over-molded IC package

Electronic device

Etched capacitor laminate for reducing electrical noise

Printed circuit board and printed circuit board manufacturing method

Signal transmission structure, circuit board and connector assembly structure

Composite multi-layer substrate and module using the substrate

Wiring board, multilayer wiring board, and method for manufacturing the same

Semiconductor package board using a metal base

Substrate for producing a soldering connection to a second substrate

Printed circuit board for improving impedance of signal transmission lines

Method and system for an improved package substrate for use with a semiconductor package

Main board for backplane buses

Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein

Manufacturing process: how to construct constraining core material into printed wiring board

Multilayer circuit board and method of manufacturing the same

Via connection structure with a compensative area on the reference plane

EMI shielding package and method for making the same

System and method for manufacturing a hard disk drive suspension flexure and for preventing damage due to electrical arcing

Method to accommodate increase in volume expansion during solder reflow

Multilayer circuit board and manufacturing method thereof

Multilayer board manufacturing method

Electronic apparatus including printed circuit board

Delamination reduction between vias and conductive pads

Printed board

Method of providing printed circuit board with conductive holes and board resulting therefrom

Elongated bridge shunt formed by stretching and rupturing a conducting bridge

Conductive member, disk drive using same, and conductive member fabricating method

Ink-jet head

Method for balancing power plane pin currents in a printed wiring board using collinear slots

Wired circuit board assembly

Electronic circuit board

Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension

Method and apparatus for reducing heat absorption around solder pads on an electrical lead suspension

Printed circuit board for connection with an external connector

Circuit board for cable termination

Semiconductor device having signal line and reference potential planes separated by a vertical gap

Printed wiring board and method of manufacturing the same

Interconnect and head gimbal assembly with the same

Biaxially oriented copolyester film and laminates thereof

Transparent window with non-transparent contact surface for a soldering bonding

Printed circuit board

Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components

Vents with signal image for signal return path

Backlight module

Suspension board with circuit

Wired circuit board

Ground plane having opening and conductive bridge traversing the opening

Signal transmission structure having plural reference planes with non-overlapping openings

Printed circuit board structure

Printed circuit board unit and electronic apparatus

Wiring board providing impedance matching

Partially completed wiring circuit board assembly sheet and production method of wiring circuit board using said sheet

Head supporting mechanism for magnetic disk device and connecting method thereof

Electronic component mounted structure and optical transceiver using the same

Carriage assembly of a hard disk drive

Method of manufacturing a carriage assembly of a hard disk drive

Multiplier crystal oscillator

Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Display apparatus

Cooling-assisted, heat-generating electrical component and method of manufacturing same

Stud bump socket

Production method of suspension board with circuit

Method for providing electrical crossover in a laminated structure

Reference layer openings

Wired circuit board and connection structure of wired circuit board

Wired circuit board

Substrate for solder joint

Semiconductor device, method for mounting the same, and method for repairing the same

Printed wiring board with conductive constraining core including resin filled channels

Method of creating gold contacts directly on printed circuit boards and product thereof

Flexible printed wiring board and manufacturing method thereof

Method for making noble metal conductive leads for suspension assemblies

Suspension board with circuit

Rotating disk storage device and integrated wire head suspension assembly

Coined ground features for integrated lead suspensions

Structure of a circuit board for improving the performance of routing traces

Circuit board with mounting pads for reducing parasitic effect

Circuit carrier and package structure thereof

Production method of suspension board with circuit

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Multilayer printed circuit board including first and second signal traces and a first ground trace

Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method

Method of making multilayered printed circuit board with filled conductive holes

Suspension board having a circuit and a flying lead portion

Module structure and module comprising it

Package substrate for integrated circuit and method of making the substrate

Voltage controlled oscillator small in reduction of inductance and Q

Signal transmission structure

Method of fabricating the routing of electrical signals

Semiconductor package board using a metal base

Substrate for use in forming electronic package

Manufacturing method of a multilayer printed wiring board

Card manufacturing technique and resulting card

Multilayered substrate for semiconductor device

Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate

Robust interlocking via

Signal transmission structure having salients aligned with non-reference regions

Signal transmission structure

Circuit board and method in which the impedance of a transmission-path is selected by varying at least one opening in a proximate conductive plane

Robust interlocking via

Circuit board having metallic plate, printed circuit board and flexible circuit board

Suspension board with circuit and producing method thereof

Electronic control unit

Method for forming ball pads of BGA substrate

Probe card for use with microelectronic components, and methods for making same

Component for inkjet print head and manufacturing method thereof

Flexible substrate and electronic device

Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure

Partially voided anti-pads

Method of testing spacings in pattern of openings in PCB conductive layer

Plated via interposer

Electrical components attached to fabric