CONNECTOR, CONNECTOR ASSEMBLY, CONNECTING STRUCTURE, AND CONNECTING METHOD

PRINTED CIRCUIT BOARD AND METHOD OF PRODUCING THEREOF

SPLIT PAD WITH TEST LINE

WIRING BASE AND ELECTRONIC DEVICE

Multi-layer printed circuit board

WAVEGUIDE INTERFACE ARRANGEMENT

Printed circuit board integrated antenna for transmitting / receiving data

Opening in the pad for bonding integrated passive device in InFO package

Electrical Components Attached to Fabric

Electronic substrate

Light sensing module and display apparatus

Multilayer resin substrate and electronic component

Circuit board structure and method for manufacturing a circuit board structure

Semiconductor device having buffer structure for external terminals

Wiring board and method of manufacturing the same

Opening in the pad for bonding integrated passive device in InFO package

Electrical components attached to fabric

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

Detection device and display device with detection function

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

Electrical components attached to fabric

Ceramic electronic component

Ceramic electronic component

Resin multilayer substrate, electronic component, and mounting structure thereof

Resin multilayer substrate, electronic component, and mounting structure thereof

Current redistribution in a printed circuit board

Electrical components attached to fabric

Detection device and display device with detection function

Reduced capacitance land pad

Backlight bar, backlight module and display device

Substrate and electronic device

Substrate, electronic device, and design support method of substrate

Electrode embedded member

Opening in the pad for bonding integrated passive device in InFO package

Defected ground structure with void having resistive material along perimeter to improve EMI suppression

Power signal transmission structure and design method thereof

Connection structure between optical device and circuit substrate, and optical transmission apparatus using the same

Detection device and display device with detection function

Resin multilayer substrate and method of manufacturing the same

Flexible circuit board having enhanced bending durability

LED tube lamp

Signal transmission system, connector apparatus, electronic device, and signal transmission method

Contact area design for solder bonding

Semiconductor device and method for manufacturing semiconductor device

Multi-chip package and manufacturing method

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

Opening in the pad for bonding integrated passive device in InFO package

Breathable and electrically conductive cloth

Printed wiring line, electronic device, touch panel, gravure plate, printed wiring line formation method, touch panel production method, and electronic device production method

Circuit board, power storage device, battery pack, and electronic device

Method of forming an electrical interconnect

Circuit board structure and method for manufacturing a circuit board structure

Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers

Light source module, fabrication method therefor, and lighting device including the same

Current redistribution in a printed circuit board

Wiring board and electronic device

LED tube lamp

Detection device and display device with detection function

Planar lighting device and mounting substrate including conduction pattern with extension parts

Multilayer wiring board and probe card having the same

High-frequency signal line and electronic device provided with the same

High-frequency signal transmission line and electronic apparatus

Circuit module and method of manufacturing the same

Signal transmission system, connector apparatus, electronic device, and signal transmission method

Contact area design for solder bonding

Stretchable conductive pattern and stretchable device

Textile integration of electronic circuits

Method of producing suspension board with circuit

Flexible printed circuit board

Device for connecting to a power network and method for protecting such a device

Transparent conductive coatings for optoelectronic and electronic devices

Circuit module and method of manufacturing the same

Flat cable

Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degrees

Angle-adjustable and/or angled printed circuit board structure having at least two printed circuit board sections and method for producing the same

Wiring board and method of manufacturing the same

High-frequency signal transmission line

Structure of circuit board with voids

Suspension board and load beam combination including a positioning reference hole and a reinforcing layer

Printed circuit board with coextensive electrical connectors and contact pad areas

Suspension board with circuit assembly sheet

Optoelectronic semiconductor chip

Printed circuit boards including strip-line circuitry and methods of manufacturing same

Electronic component-embedded module and communication terminal device

Circuit board

EBG structure, semiconductor device, and circuit board

High-frequency signal line and method for producing base layer with signal line

Laminated flat cable and method for producing same

Printed circuit board and image forming apparatus

Connection apparatus for electrically conductive pads and touch control screen

Flat cable

Guarded printed circuit board islands

Method of assembling a transducer assembly

Member for flexible element and manufacturing method thereof

Electrical and mechanical interconnection for electronic components

Component built-in board and method of manufacturing the same, and component built-in board mounting body

Differential passive equalizer

FLEXIBLE CIRCUIT BOARD

Flat cable

Circuit module and method of manufacturing the same

Printed circuit board having a molded part and method for the production thereof

Multilayer substrate module

Reduced capacitance land pad

Wiring board and method for manufacturing wiring board

Wiring board

Multi-chip package and manufacturing method

High-frequency signal transmission line and electronic apparatus

High-frequency signal transmission line and electronic apparatus

Current redistribution in a printed circuit board

Electronic assembly

High-frequency signal transmission line

Flexible printed circuit board and circuit-board connection structure

High-frequency signal transmission line

Printed circuit board

Method for manufacturing a circuit board structure

High speed input/output connection interface element, cable assembly and interconnection system with reduced cross-talk

Contact surface arranged on a carrier for connecting to a counter contact surface arranged on a further carrier, and device comprising a contact surface and a counter contact surface connected thereto

Wiring board for mounting a semiconductor element

Compact low loss transition with an integrated coupler

Connector assembly and female connector used for the same

Display apparatus

Flexible circuit board

Liquid Crystal Display and Backframe Structure

Easily assembled chip assembly and chip assembling method

Method for fabricating packaging structure having embedded semiconductor element

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

Method for manufacturing a suspension board assembly sheet with circuits

Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the method

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

Single Layer Touch-Control Sensor Structure With Reduced Coupling To Proximate Ground Structures

LED device with structure for precisely locating LEDs thereon and method for manufacturing the same

Planar lighting device and mounting substrate including conduction pattern with extension parts

Suspended lattice for electrical interconnects

Printed circuit boards including strip-line circuitry and methods of manufacturing same

Printed circuit boards including strip-line circuitry and methods of manufacturing same

Method of manufacturing a printed circuit board

Printed wiring board, and method of supplying power and forming wiring for printed wiring board

Structural body and interconnect substrate

Structural body and interconnect substrate

LED PACKAGE MODULE

Signal transmission system, connector apparatus, electronic device, and signal transmission method

LED mounting circuit board, belt-like flexible LED light and LED illuminating device using the same

CONNECTOR ASSEMBLY, MALE CONNECTOR, AND MANUFACTURING METHOD FOR MALE CONNECTOR

Arrangement comprising an electric and/or electronic module and a circuit carrier

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

SYSTEM IN PACKAGE, PRINTED CIRCUIT BOARD PROVIDED WITH SUCH SYSTEM IN PACKAGE

Ceramic elements module

APPARATUS FOR DETECTING PATTERN ALIGNMENT ERROR

BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL

Electronic assembly including an embedded electronic component

Wiring substrate with a torsion restrictor for a terminal

Electronic device, wiring board, and method of shielding noise

Circuit manufacturing and design techniques for reference plane voids with strip segment

Circuit manufacturing and design techniques for reference plane voids with strip segment

CIRCUIT BOARD, ELECTRONIC APPARATUS, AND NOISE BLOCKING METHOD

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

REDUCED STRESS GULL WING SOLDER JOINTS FOR PRINTED WIRING BOARD CONNECTIONS

High-frequency signal transmission line

Printed circuit board with coextensive electrical connectors and contact pad areas

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

Mutual capacitance and magnetic field distribution control for transmission lines

Method For Centering A Print Track

Transparent conductive coatings for optoelectronic and electronic devices

Flexible circuit board and display device

Wiring board and method of manufacturing the wiring board

Printed wiring board, method of soldering quad flat package IC, and air conditioner

Process for fabricating wiring board

Method of fabricating a circuit board

Electronic component

Bendable luminous modules and method for producing bendable luminous modules

Coil-integrated switching power supply module

Wiring structure having a plurality of circuit boards with an insulating sleeve in a terminal insertion hole

Defected ground structure with shielding effect

CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY

Printed circuit board

Electromagnetic bandgap structure and printed circuit board

Circuit arrangement with shunt resistor

Printed circuit board

Method for manufacturing multilayer printed circuit board with plated through holes

HIGH POWER AMPLIFIER, WIRELESS TRANSMITTER, WIRELESS TRANSCEIVER, AND METHOD FOR MOUNTING HIGH POWER AMPLIFIER

Method of manufacturing printed wiring board with built-in electronic component

Semiconductor device, semiconductor unit, and power semiconductor device

Printed wiring board and method for manufacturing printed wiring board

Flexible printed circuit board

Printed wiring board manufacturing method

Connection device for high frequency signals between a connector and a transmission line

Via structure for multi-gigahertz signaling

Apparatus for detecting pattern alignment error

Wired circuit board assembly sheet

Wired circuit board assembly sheet

Method of manufacturing a wired circuit board

Printed circuit board including via pad with concavo-convex patterns and method of manufacturing the same

PRINTED CIRCUIT BOARD WITH INSULATING AREAS

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PRINTED CIRCUIT BOARD

Printed circuit board

Circuit board and semiconductor module

Wiring board

Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus

Low temperature co-fired ceramics assembling system and method thereof

Circuit module and method of manufacturing the same

Wired-circuit-board assembly sheet and producing method thereof

Suspension board assembly sheet with circuits and method for manufacturing the same

Packaging structure having embedded semiconductor element

Wired circuit board and producing method thereof

Electronic circuit unit

Method for manufacturing a ceramic elements module

Circuit board having semiconductor chip

Printed circuit board

Printed circuit board

Negative photosensitive material, photosensitive board employing the negative photosensitive material, and negative pattern forming method

Composite multi-layer substrate and module using the substrate

Semiconductor device and display apparatus

Concave connector substrate, method of manufacturing the same, measuring kit, sensor substrate, and sensor substrate interprolated cylinder

Circuit manufacturing and design techniques for reference plane voids with strip segment

Packaging substrate device, method for making the packaging substrate device, and packaged light emitting device

Flexible printed circuit board

Printed circuit board with coextensive electrical connectors and contact pad areas

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

Circuit board with ESD protection and electronic device using same

Method of producing printed circuit board incorporating resistance element

Mounting structure for semiconductor element with underfill resin

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Multilayer wiring board and method for manufacturing the same

PRINTED CIRCUIT BOARD UNIT

Circuit board and structure using the same

LED lamp assembly

Method for fabricating embedded thin film resistors of printed circuit board

Method of electromagnetic noise suppression devices using hybrid electromagnetic bandgap structures

Ball land structure having barrier pattern

Flexible light source device and fabrication method thereof

ELECTRONIC DEVICE AND HIGH FREQUENCY CIRCUIT BOARD THEREOF

BURIED CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND METHOD OF CHANGING CAPACITANCE THEREOF

Method of manufacturing the circuit apparatus, method of manufacturing the circuit board, and method of manufacturing the circuit device

Apparatus minimizing impedance in flex-to-printed circuit board connection through the disk base of a hard disk drive

Printed wiring board and electronic apparatus

Resin-molded article fit with a metal plate

Suspension board with circuit

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Suspension board with circuit having a light emitting device exposed from a surface thereof opposite to that on which a slider is mounted

Microcavity structure and process

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Multilayer circuit board and motor driving circuit board

Wiring board and process for fabricating the same

Multi-chip package and manufacturing method

Printed circuit board and method of producing the same

Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component

Multi-layer circuit substrate fabrication and design methods providing improved transmission line integrity and increased routing density

Suspension board with circuit, producing method thereof, and positioning method of suspension board with circuit

Printed wiring board

PRINTED WIRING BOARD HAVING RECOGNITION MARK

Tab tape for tape carrier package

Method and apparatus of changing PCB pad structure to increase solder volume and strength

Intermediate multilayer wiring board product, and method for manufacturing multilayer wiring board

FLEXIBLE PRINTED CIRCUIT BOARD, SHIELD PROCESSING METHOD FOR THE CIRCUIT BOARD AND ELECTRONIC APPARATUS

Method of manufacturing a printed wiring board with built-in electronic component

Thermal management of LED-based lighting systems

Liquid crystal display device

Producing method of wired circuit board

Capacitor structure with raised resonance frequency

Optical communication module and flexible printed circuit board

Production method of suspension board with circuit

FLEXIBLE PRINTED CIRCUIT BOARD

FLEXIBLE PRINTED CIRCUIT BOARD

Wired circuit board assembly sheet

Wired circuit board and method for manufacturing wired circuit board and mounting electronic component thereon

Electrical connection structure

10G XFP compliant PCB

Mutual capacitance and magnetic field distribution control for transmission lines

Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces

Connecting structure and connecting method, liquid ejection head and method of manufacturing same

Circuit board having configurable ground link and with coplanar circuit and ground traces

COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof

Method of manufacturing printed wiring board with built-in electronic component

Method for manufacturing board with built-in electronic elements

Printed circuit board and method of manufacturing the same

Printed circuit board and method of manufacturing the same

Printed circuit board and method of manufacturing the same

Semiconductor device

Construction of reliable stacked via in electronic substrates—vertical stiffness control method

Reference plane voids with strip segment for improving transmission line integrity over vias

Printed wiring board including a thermal land for supressing heat dissipation

Electric apparatus

Method of making circuitized substrates having film resistors as part thereof

DUAL DENSITY PRINTED CIRCUIT BOARD ISOLATION PLANES AND METHOD OF MANUFACTURE THEREOF

Semiconductor package board using a metal base

Wired circuit board

Substrate panel

Substrate panel including insulation parts and bus line

HEAT SINK DEVICE

Optical module

Reference layer openings

Bendable area design for flexible printed circuitboard

ELECTRONIC COMPONENT MODULE AND CIRCUIT BOARD THEREOF

Display Device

Core substrate and method of producing the same

Method of producing substrate

Method of producing substrate

PRINTED WIRING BOARD WITH CONDUCTIVE CONSTRAINING CORE INCLUDING RESIN FILLED CHANNELS