H05K2201/09745 - page 2 - CPC Classification Index

ClassID:

234526 ⎘

H05K2201/09745 - page 2 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Shape and layout; Shape and layout details of conductors covering at least two types of conductors provided for in - Recess in conductor, e.g. in pad or in metallic substrate

Recent Application in this class:

#301

20050285147

2005-12-29

Circuit apparatus provided with asperities on substrate surface

#302

20050275090

2005-12-15

Chip-component-mounted device and semiconductor device

#303

20050263846

2005-12-01

Circuit device with dummy elements

#304

20050221537

2005-10-06

Plastic packaging with high heat dissipation and method for the same

#305

20050208749

2005-09-22

Methods for forming electrical connections and resulting devices

#306

20050201069

2005-09-15

Electronic device

#307

20050200267

2005-09-15

Substrate having fine line, electron source and image display apparatus

#308

20050199680

2005-09-15

Rotating disk storage device and integrated wire head suspension assembly

#309

20050179121

2005-08-18

IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless

#310

20050173795

2005-08-11

Socket grid array

#311

20050173783

2005-08-11

Semiconductor package with passive device integration

#312

20050163981

2005-07-28

Method for bonding ceramic to copper, without creating a bow in the copper

#313

20050160679

2005-07-28

Screening of a printed-circuit electronics card mounted on a metal substrate

#314

20050155789

2005-07-21

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

#315