PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD, ELECTRICAL DEVICE AND MECHANISM

FLEXIBLE PRINTED CIRCUIT BOARD, IN PARTICULAR FOR CONNECTING ELECTRICAL AND/OR ELECTRONIC COMPONENTS

CIRCUIT SUBSTRATE HAVING IMPROVED BONDING STRUCTURE

METHOD FOR ORIENTING SOLDER BALLS ON A BGA DEVICE

Light sensing module and display apparatus

Printed circuit board and semiconductor module including the same

Multilayer wiring board and method of producing the same

ELECTRIC COMPONENT OF AN INTERVENTIONAL MEDICAL DEVICE

Method for orienting solder balls on a BGA device

Control device for an electric machine

Metal-ceramic substrate and method for producing a metal-ceramic substrate

Liquid ejection apparatus

Ceramic electronic component

Ceramic electronic component

Method for manufacturing printed wiring board and printed wiring board

Discrete component carrier

Method for orienting solder balls on a BGA device

Liquid ejection apparatus

Connection substrate

Electronic device

Liquid ejection apparatus

Laminated body

Fiducial mark for chip bonding

Accurate positioning and alignment of a component during processes such as reflow soldering

Resin multilayer substrate and method of manufacturing the same

ELECTRICAL COMPONENT HAVING PRE-SOLDERED SURFACE WITH FLUX RESERVOIRS

Electronic device

Actuator device, liquid ejection apparatus, and connection structure

Multi-surface edge pads for vertical mount packages and methods of making package stacks

Adapter plate for HF structures

Printed circuit board and semiconductor package including the same

Sleeved coaxial printed circuit board vias

Wiring board soldered with lead wire and electronic device comprising wiring board

Circuit board, power storage device, battery pack, and electronic device

System for pressing pre-tin shaping

Semiconductor device

Device and method for determining the temperature of a heat sink

Method for orienting solder balls on a BGA device

Light emitting module and head lamp including the same

Power module

Chip substrate comprising cavity with curved surfaces

Wiring board with cavity for built-in electronic component and method for manufacturing the same

Flexible printed circuit board

Solder alloy free electronic (safe) rigid-flexible/stretchable circuit assemblies having integral, conductive and heat spreading sections and methods for their manufacture

Semiconductor device mounting structure, backlight device, and mounting substrate

Wiring board, wiring board with lead, and electronic device

Optoelectronic semiconductor component

Substrate

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

Printed wiring board, method for manufacturing printed wiring board, and package-on-package

Electronic component mounting device and semiconductor device including the same

Circuit board

Circuit board, electronic module and illuminating device having the circuit board, and method for manufacturing the circuit board

Electrical component having presoldered surface with flux reservoirs

Circuit board

Bump structure, wiring substrate, semiconductor apparatus and bump structure manufacturing method

Sleeved coaxial printed circuit board vias

Wiring board and method for manufacturing the same

Display apparatus and circuit board module thereof

Under ball metallurgy (UBM) for improved electromigration

Under ball metallurgy (UBM) for improved electromigration

Wiring board

Laminate electronic device

Multilayer substrate

Method of manufacturing a hybrid heat-radiating substrate

BGA structure using CTF balls in high stress regions

Substrate structure, method of mounting semiconductor chip, and solid state relay

Three dimensional light emitting diode systems, and compositions and methods relating thereto

Contact surface arranged on a carrier for connecting to a counter contact surface arranged on a further carrier, and device comprising a contact surface and a counter contact surface connected thereto

LED mounting substrate and method of manufacturing the same

Assembly and production of an assembly

Electronic circuit substrate, display device, and wiring substrate

Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof

Method for assembling a circuit board

LED device with structure for precisely locating LEDs thereon and method for manufacturing the same

LED lighting module for vehicle headlight

FORMED METALLIC HEAT SINK SUBSTRATE, CIRCUIT SYSTEM, AND FABRICATION METHODS

Electronic system for wave soldering

HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Electronic assembly including an embedded electronic component

Light emitting module and head lamp including the same

Connector structures and methods

Multilayer printed wiring board

Bump structure and process of manufacturing the same

Multilayer substrate

Three dimensional light emitting diode systems, and compositions and methods relating thereto

Mutual capacitance and magnetic field distribution control for transmission lines

Multilayer wiring board

PACKAGE CARRIER

CIRCUIT BOARD

ELECTRONIC PACKAGE AND METHOD OF MAKING SAME

PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD HAVING STEPPED CONDUCTION LAYER

Heat-radiating substrate and method of manufacturing the same

Wiring substrate and manufacturing method for wiring substrate

MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES

METHOD OF MANUFACTURING CIRCUIT BOARD

Lighting device, display device and television receiver

Multilayer printed wiring board with filled viahole structure

LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor

LED unit

Thermal pad and method of forming the same

Light emitting module

Heat-radiating substrate and method of manufacturing the same

HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Semiconductor module and semiconductor device

Mounting structure

Circuit board with buried circuit pattern

CIRCUIT MODULE

Multilayer wiring substrate, and method of manufacturing the same

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

LIGHT SOURCE MODULE

Flex-rigid wiring board and method for manufacturing the same

ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Light emitting diode module and method for making the same

Leadframe for leadless package, structure and manufacturing method using the same

Leadframe for leadless package, structure and manufacturing method using the same

Light emitting diode substrate assembly

Method of manufacturing a laminate electronic device including separating a carrier into a plurality of parts

Integrated device and manufacturing method

Heat conduction board and mounting method of electronic components

Multilayer printed wiring board

Printed circuit board structure

Method for fabricating a printed circuit board having differential trace profile

HYBRID CHIP-ON-HEATSINK DEVICE AND METHODS

DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE

Solder pad structure with high bondability to solder ball

Power amplifier and signal transceiving system

Composite multi-layer substrate and module using the substrate

Heat sink package

Printed wiring board, method for forming the printed wiring board, and board interconnection structure

Printed wiring board, method for forming the printed wiring board, and board interconnection structure

Method of producing a land grid array interposer structure

Device for reducing thermal stress on connection points

Solder layer, heat sink using such a solder layer and method for manufacturing such a heat sink

Assembly and production of an assembly

Printed circuit board, manufacturing method thereof and radio-frequency device

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

Methods for making millichannel substrate, and cooling device and apparatus using the substrate

Circuit board and structure using the same

Semiconductor device and process for producing same

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity in the post

Wired circuit board assembly sheet

CIRCUIT BOARD ASSEMBLY

Semiconductor chip assembly with post/base heat spreader and cavity in post

Multilayer printed wiring board with filled viahole structure

Method of connecting printed circuit boards and corresponding arrangement

Microcavity structure and process

Thermally-Efficient Metal Core Printed Circuit Board With Selective Electrical And Thermal Connectivity

Method for smoothing printed circuit boards

Suspension board with circuit

Printed wiring board

ELECTRONIC APPARATUS, FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD

Tubular memory module

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING

Electronic component

Electronic carrier board

Printed circuit board and semiconductor package

Multilayer ceramic substrate, electronic component, and method of manufacturing multilayer ceramic substrate

Illuminator module

Mutual capacitance and magnetic field distribution control for transmission lines

Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard

Heat sink package

Semiconductor device

Method of fabricating a probe card

Circuit substrate, circuit device and manufacturing process thereof

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Illumination device comprising a substrate plate and a heat sink

Device mounting structure and device mounting method

Land grid array interposer producing method

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Circuitized substrate with internal cooling structure and electrical assembly utilizing same

Differential trace profile for printed circuit boards

Method of producing a land grid array (LGA) interposer structure

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME

Printed circuit board having stepped conduction layer

Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers

Manufacturing method of solder ball disposing surface structure of package substrate

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

SUBSTRATE, ELECTRONIC COMPONENT, ELECTRONIC CONFIGURATION AND METHODS OF PRODUCING THE SAME

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Printed wiring board, method for forming the printed wiring board, and board interconnection structure

Device and method for determining the temperature of a heat sink

Electronic component and method of forming the same

Method of producing a land grid array (LGA) interposer structure

Wired circuit board and producing method thererof

Method of producing a land grid array interposer

Control apparatus, in particular a mechatronic transmission control device or engine control device

Printed circuit board

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Method of producing a land grid array interposer

LIGHT EMITTING MODULE

Electronic device and pressure sensor

Wiring board connection method

Circuit board assembly

Multilayer printed wiring board with filled viahole structure

Metal wiring plate

Leadframe for leadless package, structure and manufacturing method using the same

Packaging substrate and method for manufacturing the same

Method of forming a land grid array (LGA) interposer

Wiring structure, forming method of the same and printed wiring board

Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition

Multilayer printed wiring board

Method for manufacturing bump of probe card

Compliant penetrating packaging interconnect

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

Connection method of a flexible printed circuit board with two printed circuit boards, and electric or electronic component with parts connected by the connection method

Method of producing a land grid array interposer utilizing metal-on-elastomer

Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component

PRINTED-WIRING BOARD

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

Printed circuit board, light emitting apparatus having the same and manufacturing method thereof

Mounting device for high frequency microwave devices

Method of forming a land grid array interposer

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

Reverse build-up process for fine bump pitch approach

Resin-sealed electronic device and method of manufacturing the same

Substrate for mounting flip chip and the manufacturing method thereof

Method of manufacturing a circuit board

Electronic controller

Connecting part of conductor pattern and conductor patterns-connected structure

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Light-emitting heat-dissipating device and manufacturing method thereof

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Method of making an interposer

Composite multi-layer substrate and module using the substrate

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Printed wiring board, method for forming the printed wiring board, and board interconnection structure

Electronic device with integrated heat distributor

Printed circuit board

Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection Method

Thin multichip flex-module

Electronic device

Light source and liquid crystal display device using the same

Semiconductor device having flange structure

Interconnects with interlocks

Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate

Metal-base circuit board and its manufacturing method

Metal core, package board, and fabricating method thereof

Camera module using printed circuit board with step portion

Cable connector

Printed circuit board and method for manufacturing the same

Ball grid array (BGA) package and method thereof

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

Mounting board and semiconductor device

Microelectronic interconnect substrate and packaging techniques

Chip embedded packaging structure

Interposer and test assembly for testing electronic devices

Printed circuit board and manufacturing method thereof

Electronic assembly that includes pads having a bowl shaped upper section

Electronic apparatus with a wiring terminal

Bonding pad fabrication method, method for fabricating a bonding pad and an electronic device, and electronic device

Circuit board and light souce device having same

Technique for manufacturing an overmolded electronic assembly

Composite multi-layer substrate and module using the substrate

Solder ball pad surface finish structure of circuit board and fabrication method thereof

Interposer for use with test apparatus

Electronic apparatus and method for manufacturing the same

Packaging substrate having adhesive-overflowing prevention structure

High-k thin film grain size control

Substrate, device and method for forming a guidance structure in the substrate, and positioning method

Wired circuit board

Semiconductor package with passive device integration

Semiconductor device with a recessed bond pad

Connector device

Electronic control unit and method thereof

Multilayer printed wiring board with filled viahole structure

Method of making a support for light emitting diodes which are interconnected in a three-dimensional environment

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Interlocking via for package via integrity

Head gimbal assembly provided with solder ball connecting structure allowing re-utilization of suspension

Forming of high aspect ratio conductive structure using injection molded solder

Thermal management of surface-mount circuit devices

Reinforced solder bump structure and method for forming a reinforced solder bump

Socket grid array

Backlight module

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

LED luminance enhancing construction

Semiconductor device and method for manufacturing semiconductor device

Method of forming a solder ball on a board and the board

Interconnects with interlocks

Semiconductor device and manufacturing method thereof

Method for evaluating and modifying solder attach design for integrated circuit packaging assembly

BGA package with concave shaped bonding pads