234628 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of mounted components Metal over component, i.e. metal plate over component mounted on or embedded in PCB
INTEGRATED COIL MODULE
#2CIRCUIT MODULE
#3CIRCUIT MODULE
#4Thermal Transfer, Management and Integrated Control Structure
#5Power electronics assemblies having vapor chambers with integrated pedestals
#6Technique to improve waterproofness and dust resistance for circuit board in job-site gear
#7Module
#8Component package and printed circuit board for the same
#9Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance
#10Power module having metallic heat-dissipation substrate
#11Electronics assemblies and methods of manufacturing electronics assemblies with improved thermal performance
#12Integrating Josephson amplifiers or Josephson mixers into printed circuit boards
#13Apparatus related to conformal coating implemented with surface mount devices
#14Power module having metallic heat-dissipation substrate
#15POWER SUPPLY APPARATUS
#16Shielded package assemblies with integrated capacitor
#17Integrating josephson amplifiers or josephson mixers into printed circuit boards
#18Integrating Josephson amplifiers or Josephson mixers into printed circuit boards
#19Attaching a Component to a Circuit Board Using an Over-filled Cavity of Solder
#20Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
#21Integrating Josephson amplifiers or Josephson mixers into printed circuit boards
#22Microelectronic assembly with electromagnetic shielding
#23Systems and methods for providing electromagnetic interference (EMI) compartment shielding for components disposed inside of system electronic packages
#24Electronic device including shield can
#25Electronic building block set with metal layer on outer surface of each building block
#26Methods related to implementing surface mount devices with ground paths
#27METHOD FOR MANUFACTURING CAPACITOR BUILT-IN SUBSTRATE
#28Shielded package assemblies with integrated capacitor
#29Capacitor with improved heat dissipation
#30Printed circuit board assembly
#31Electronic apparatus and method for fabricating the same
#32Apparatus and methods related to conformal coating implemented with surface mount devices
#33Electronic apparatus and method for fabricating the same
#34Electronic control unit
#35Electronic control unit
#36Electronic apparatus and method for fabricating the same
#37Device and method for determining the temperature of a heat sink
#38Display apparatus
#39Socket loading element and associated techniques and configurations
#40High-frequency module
#41Printed circuit board
#42Cooled printed circuit with multi-layer structure and low dielectric losses
#43Capacitor with improved heat dissipation
#44Method of manufacturing printed-circuit board assembly
#45Noise blocking printed circuit board and manufacturing method thereof
#46Display device with flexible circuit board having graphite substrate
#47Flexible circuit board with graphite substrate and circuit arrangements using same
#48LED light arrangement with flexible circuit board having graphite substrate
#49Shielded package assemblies with integrated capacitor
#50Electronic device module and manufacturing method thereof
#51Thermal management system and method
#52Method to align surface mount packages for thermal enhancement
#53Electronic component, electronic apparatus, and moving object
#54Shielding structures for system-in-package assemblies in portable electronic devices
#55Electronic apparatus and method for fabricating the same
#56Circuit module and method of producing circuit module
#57Electronic device
#58Method of manufacturing electronic package module
#59Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims
#60Apparatus and methods related to ground paths implemented with surface mount devices
#61Apparatus and methods related to conformal coating implemented with surface mount devices
#62High-frequency module
#63Electronic package module and method of manufacturing the same
#64Electrical component resin, semiconductor device, and substrate
#65Printed circuit boards including strip-line circuitry and methods of manufacturing same
#66USB application device and method for assembling USB application device
#67Thermal management system and method
#68Solid state disk assembly
#69Device for screening an electronic module
#70Electronic control unit and method of manufacturing the same
#71Method of Making a Low Profile Flip Chip Power Module
#72Stacked semiconductor chip device with thermal management
#73Manufacturing method of printed circuit board embedded chip
#74CIRCUIT MODULE
#75Thin multi-chip flex module
#76Thin multi-chip flex module
#77Electronic Assemblies without Solder and Methods for their Manufacture
#78Thin multi-chip flex module
#79Module having at least two surfaces and at least one thermally conductive layer therebetween
#80COOLING ARRANGEMENT
#81ELECTRONIC APPARATUS AND REINFORCING COMPONENT
#82ELECTRONIC CONTROL UNIT AND METHOD OF MANUFACTURING THE SAME
#83ELECTRONIC COMPONENT MOUNTING STRUCTURE AND ELECTRONIC COMPONENT MOUNTING METHOD
#84Image display apparatus having raised parts disposed on a substrate
#85SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE AND ITS MANUFACTURING METHOD
#86Module having at least two surfaces and at least one thermally conductive layer therebetween
#87ELECTRONIC DEVICE-MOUNTED APPARATUS AND NOISE SUPPRESSION METHOD FOR SAME
#88Printed circuit board embedded chip and manufacturing method thereof
#89Light source device
#90Electrical power tools
#91Thin multi-chip flex module
#92Discrete electronic component and related assembling method
#93Thin multi-chip flex module
#94Thin multi-chip flex module
#95Thin multi-chip flex module
#96Thin multi-chip flex module
#97Electronic circuit arrangement and method for producing an electronic circuit arrangement
#98Semiconductor device including main substrate and sub substrates
#99Electronic control device using LC module structure
#100Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#101THIN CIRCUIT MODULE AND METHOD
#102Circuit module with thermal casing systems
#103Heat sink for a high capacity thin module system
#104Device and method for determining the temperature of a heat sink
#105RECOVERABLE ELECTRONIC COMPONENT
#106High density module having at least two substrates and at least one thermally conductive layer therebetween
#107Electronic apparatus and flexible wiring member
#108Printed circuit board, memory module having the same and fabrication method thereof
#109Method of assembly to achieve thermal bondline with minimal lead bending
#110ELECTRONIC COMPONENT BUILT-IN MODULE AND METHOD FOR MANUFACTURING THE SAME
#111Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus
#112COMMUNICATION MODULE PACKAGE ASSEMBLY
#113SMALL-SIZED COMMUNICATION MODULE PACKAGE
#114Die module system
#115Low profile flip chip power module and method of making
#116PRINTED CIRCUIT BOARD AND SEMICONDUCTOR MEMORY MODULE USING THE SAME
#117Multi-chip module with power system
#118High capacity thin module system
#119Electronic controller
#120High capacity thin module system and method
#121High capacity thin module system and method
#122High density memory module using stacked printed circuit boards
#123Interconnection system between CPU and voltage regulator
#124Integrated circuit chip thermal solution
#125Thermally enhanced electronic flip-chip packaging with external-connector-side die and method
#126ELECTRICAL CONNECTION BOX
#127Optically coupled semiconductor device and electronic device
#128Motor controller
#129Semiconductor Module with Serial Bus Connection to Multiple Dies
#130Semiconductor Module with Serial Bus Connection to Multiple Dies
#131Semiconductor Module with Serial Bus Connection to Multiple Dies
#132Semiconductor Module With Serial Bus Connection to Multiple Dies
#133Electronic circuit device
#134Electrical equipment for junction and method of manufacturing the same
#135DISCRETE ELECTRONIC COMPONENT AND RELATED ASSEMBLING METHOD
#136Composite core circuit module system and method
#137Circuit board arrangement including heat dissipater
#138Memory Module System and Method
#139Memory Module System and Method
#140Thin module system and method
#141Buffered Thin Module System and Method
#142LED Assembly with Vented Circuit Board
#143LED Assembly with Vented Circuit Board
#144LED Assembly with Vented Circuit Board
#145LED assembly with vented circuit board
#146LED backlight unit
#147Backlight module
#148Embedded actives and discrete passives in a cavity within build-up layers
#149Technique for manufacturing an overmolded electronic assembly
#150Technique for manufacturing an overmolded electronic assembly
#151Light source module
#152Memory module system and method
#153Modified core for circuit module system and method
#154Electronic control unit and method thereof
#155Heat spreader with multiple stacked printed circuit boards
#156Electronic module for system board with pass-thru holes
#157Processor module for system board
#158Multi-chip module with power system and pass-thru holes
#159Processor module with thermal dissipation device
#160Systems to cool multiple electrical components
#161Flex circuit constructions for high capacity circuit module systems and methods
#162Thermal management of surface-mount circuit devices
#163Multi-chip module with power system
#164Redundant power for processor circuit board
#165Apparatus and method for multiprocessor circuit board
#166Heat-dissipating device
#167Electronic part-mounted substrate, thermal conductive member for electronic part-mounted substrate and liquid-jetting head
#168High capacity thin module system
#169Circuit module with thermal casing systems
#170Optoelectronic transceiver
#171Thin module system and method
#172Die module system
#173Buffered thin module system and method
#174Thin module system and method
#175Thin module system and method
#176Optimized mounting area circuit module system and method
#177High capacity thin module system and method
#178Thin module system and method with thermal management
#179Thin module system and method with skew reduction
#180Module thermal management system and method
#181Thin module system and method
#182Minimized profile circuit module systems and methods
#183Electronic module with conductive polymer
#184High density memory module using stacked printed circuit boards
#185LED assembly with vented circuit board
#186LED assembly with reverse circuit board
#187Electronic device
#188Discrete electronic component and related assembling method
#189Cooling arrangement for a printed circuit board with a heat-dissipating electronic element
#190Backside cooling apparatus for modular platforms
#191Power supply packaging system
#192Pogo pin integrated circuit package mount