ClassID:

234624

H05K2201/1053 - page 2 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of mounted components; Involving several components Mounted components directly electrically connected to each other, i.e. not via the PCB

Recent Application in this class:
#301
20060267176
2006-11-30

System for assembling electronic components of an electronic system

#302
20060231947
2006-10-19

Systems and methods for reducing simultaneous switching noise in an integrated circuit

#303
20060170510
2006-08-03

MOUNTING STRUCTURE AND METHOD OF SURFACE-MOUNT CRYSTAL OSCILLATOR

#304
20060158863
2006-07-20

Interconnection structure through passive component

#305
20060131070
2006-06-22

Power delivery mechanism

#306
20060111065
2006-05-25

Electronic circuit and method of manufacturing the same

#307
20060092595
2006-05-04

Multilayered chip capacitor array

#308
20060063303
2006-03-23

Packaging method, packaging structure and package substrate for electronic parts

#309
20060060957
2006-03-23

Assembly for stacked BGA packages

#310
20060054220
2006-03-16

Assembling structure for pressure sensor integrally formed with electromagnetic valve

#311
20060051953
2006-03-09

Module assembly and method for stacked BGA packages

#312
20060049504
2006-03-09

Module assembly for stacked BGA packages

#313
20060033216
2006-02-16

Stacked packages

#314
20060018104
2006-01-26

Electronic component mounted structure and optical transceiver using the same

#315
20060011369
2006-01-19

Method and components for implementing EMC shielded resonance damping

#316
20050269129
2005-12-08

PRINTED CIRCUIT BOARD WITH SHIELDED PATH AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH SHIELDED PATH

#317
20050258548
2005-11-24

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

#318
20050258511
2005-11-24

Ultra low inductance multi layer ceramic capacitor

#319
20050230852
2005-10-20

Semiconductor chip package

#320
20050225408
2005-10-13

Direct current cut structure

#321
20050202725
2005-09-15

Apparatus for providing controlled impedance in an electrical contact

#322
20050189640
2005-09-01

Interconnect system without through-holes

#323
20050179128
2005-08-18

Semiconductor device with capacitor

#324
20050173796
2005-08-11

Microelectronic assembly having array including passive elements and interconnects

#325
20050161492
2005-07-28

Method of manufacturing mounting boards

#326
20050146017
2005-07-07

Power supply connection structure to a semiconductor device

#327
20050142694
2005-06-30

Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges

#328
20050122100
2005-06-09

Vertical die chip-on-board

#329
20050110155
2005-05-26

Semiconductor device and method of manufacturing the same, circuit board and electronic device

#330
20050110135
2005-05-26

Module assembly and method for stacked BGA packages

#331
20050093153
2005-05-05

BGA package with component protection on bottom

#332
20050093120
2005-05-05

Detachable on package voltage regulation module

#333
20050090041
2005-04-28

Constructing of an electronic assembly having a decoupling capacitor

#334
20050047457
2005-03-03

Laser diode driving circuit and an optical head

#335
20050017344
2005-01-27

Interconnecting component

#336
20050014395
2005-01-20

System for making high-speed connections to board-mounted modules

#337
20050007281
2005-01-13

Surface-mounted antenna apparatus

#338
17072924
2023-04-25

Method and apparatus for a shielding structure of surface-mount LTCC devices

#339
16510780
2020-08-25

Chip double-sided layout on PCB

#340
15890776
2018-11-13

Three-dimensional electronics distribution by geodesic faceting

#341
15483417
2018-08-21

Multilayer structure and related method of manufacture for electronics

#342
15439641
2019-11-19

Electrical components attached to fabric