234624 ⎘
Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of mounted components; Involving several components Mounted components directly electrically connected to each other, i.e. not via the PCB
System for assembling electronic components of an electronic system
#302Systems and methods for reducing simultaneous switching noise in an integrated circuit
#303MOUNTING STRUCTURE AND METHOD OF SURFACE-MOUNT CRYSTAL OSCILLATOR
#304Interconnection structure through passive component
#305Power delivery mechanism
#306Electronic circuit and method of manufacturing the same
#307Multilayered chip capacitor array
#308Packaging method, packaging structure and package substrate for electronic parts
#309Assembly for stacked BGA packages
#310Assembling structure for pressure sensor integrally formed with electromagnetic valve
#311Module assembly and method for stacked BGA packages
#312Module assembly for stacked BGA packages
#313Stacked packages
#314Electronic component mounted structure and optical transceiver using the same
#315Method and components for implementing EMC shielded resonance damping
#316PRINTED CIRCUIT BOARD WITH SHIELDED PATH AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD WITH SHIELDED PATH
#317Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor
#318Ultra low inductance multi layer ceramic capacitor
#319Semiconductor chip package
#320Direct current cut structure
#321Apparatus for providing controlled impedance in an electrical contact
#322Interconnect system without through-holes
#323Semiconductor device with capacitor
#324Microelectronic assembly having array including passive elements and interconnects
#325Method of manufacturing mounting boards
#326Power supply connection structure to a semiconductor device
#327Stacking memory chips using flat lead-frame with breakaway insertion pins and pin-to-pin bridges
#328Vertical die chip-on-board
#329Semiconductor device and method of manufacturing the same, circuit board and electronic device
#330Module assembly and method for stacked BGA packages
#331BGA package with component protection on bottom
#332Detachable on package voltage regulation module
#333Constructing of an electronic assembly having a decoupling capacitor
#334Laser diode driving circuit and an optical head
#335Interconnecting component
#336System for making high-speed connections to board-mounted modules
#337Surface-mounted antenna apparatus
#338Method and apparatus for a shielding structure of surface-mount LTCC devices
#339Chip double-sided layout on PCB
#340Three-dimensional electronics distribution by geodesic faceting
#341Multilayer structure and related method of manufacture for electronics
#342Electrical components attached to fabric