ELECTRONIC MODULE AND APPARATUS

VERTICAL INTEGRATED VOLTAGE REGULATOR WITH CIRCUIT BOARD CUTOUT

ELECTRONIC MODULE

POWER TOOL PRINTED CIRCUIT BOARD INCLUDING BUSBARS

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

ASSEMBLY STRUCTURE

METHODS AND APPARATUS TO MANAGE NOISE FOR TIMING CIRCUITRY

Converter Package with Integrated Inductor

Multilayer Capacitor and Circuit Board Containing the Same

METHOD AND CONFIGURATION FOR STACKING MULTIPLE PRINTED CIRCUIT BOARDS

BUS BAR LINK FOR BATTERY CELL INTERCONNECTIONS IN A BATTERY MODULE

SYSTEMS AND METHODS FOR ASSEMBLING PROCESSOR SYSTEMS

Electronic Assembly

Multicomponent Connector

Pluggable CPU Modules with Vertical Power

CHIP ON FILMS AND DISPLAY MODULES

PRINTED CIRCUIT BOARD ASSEMBLY WITH REDUCED TOTAL HEIGHT

CIRCUIT AND CONNECTOR ELEMENT ALIGNMENT, CIRCUIT BOARD ASSEMBLIES

Package-on-package assembly with wire bond vias

Method and configuration for stacking multiple printed circuit boards

HIGH-POWER ELECTRONICS DEVICES AND METHODS FOR MANUFACTURING SAME

Substrate frame design for three-dimensional stacked electronic assemblies and method for the same

Pluggable CPU modules with vertical power

ELECTRONIC DEVICE

Electronic component module, sub-module, and method for manufacturing same

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

Battery module printed circuit board assembly system and method

ELECTRONIC MODULE AND APPARATUS

WIDEBAND ANTENNAS IN GLASS THROUGH DIRECT VIA FEEDING AND GLASS STACKING

Separable interface cable structure for high voltage under-module power input

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERPOSER SERVER ARCHITECTURE

LIQUID METAL INTERCONNECT FOR MODULAR SYSTEM ON AN INTERCONNECT SERVER ARCHITECTURE

Bus bar link for battery cell interconnections in a battery module

Assembly structure

ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY MODULE

Display device

Multilayer capacitor and circuit board containing the same

Semiconductor module and electronic apparatus

Circuit module and interposer

Electrical Components Attached to Fabric

Locking input/output module

Chip-on-film package and display apparatus including the same

Package-on-package assembly with wire bond vias

ELECTRONIC PACKAGE WITH PASSIVE COMPONENT BETWEEN SUBSTRATES

Wafer-level passive array packaging

Circuit board and display device including the same

INTEGRATED COMPONENT AND PORWER SWITCHING DEVICE

Ambient temperature sensor which may be coupled to a printed circuit board with an improved package

Method of forming a capacitive loop substrate assembly

Display device and electronic equipment

Electrical components attached to fabric

Assembling and handling edge interconnect packaging system

Direct current blocking capacitors and method of attaching an IC package to a PCB

Semiconductor device and system

Systems and methods for assembling processor systems

Electronic component module and method for manufacturing the same

Package-on-package assembly with wire bond vias

Assembly structure and electronic device having the same

Electrical components attached to fabric

Method of forming an electronic device

Mounting structure

Camera module facilitating industrialized assembly line and electronic device with the same

Direct current blocking capacitors

Battery module constant current relay control systems and methods

Systems, methods, and devices for pre-charge control of a battery module

Electrical components attached to fabric

Multilayer element and LC filter

Seal ring inductor and method of forming the same

Battery module printed circuit board assembly system and method

Semiconductor module

Microelectronic assemblies having front end under embedded radio frequency die

Capacitor loop structure

Scalable phased array package

Scalable phased array package

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Composite electronic component and resistor

Composite electronic component and resistor

Imaging detector module assembly

Semiconductor device

Multilayer electronic component and board having the same

Ring-in-ring configurable-capacitance stiffeners and methods of assembling same

Electronic package with passive component between substrates

PROTECTION CONTACTOR

High density multi-component packages

High density multi-component packages

Composite electronic component and board having the same

Clip-type contactor and protective apparatus including same

Multilayer structure and related method of manufacture for electronics

Composite electronic component, composite electronic component package, circuit board, and method of producing a composite electronic component

Multilayer capacitor and circuit board containing the same

Electronic assembly that includes a substrate bridge

Wireless interconnects on flexible cables between computing platforms

LIGHT SENSOR LEAD FRAME SUBSTRATE AND MANUFACTURING METHOD THEREOF

3-D STACKING OF ACTIVE DEVICES OVER PASSIVE DEVICES

SEMICONDUCTOR DEVICE

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

PROCESS FOR PROTECTING AN ELECTRONIC DEVICE BY SELECTIVE DEPOSITION OF POLYMER COATINGS

Battery module constant current relay control systems and methods

Assembling and handling edge interconnect packaging system

Printable 3D electronic structure

Package-on-package assembly with wire bond vias

Component stability structure

Method of fabricating package structure with an embedded electronic component

Battery module printed circuit board assembly system and method

Layered battery module system and method of assembly

Imaging detector module assembly

Electronic component mounting board

Development of the advanced component in cavity technology

Multilayer electronic component and board having the same

Semiconductor apparatus, stacked semiconductor apparatus, encapsulated stacked-semiconductor apparatus, and method for manufacturing the same

Multi-stacked electronic device with defect-free solder connection

System and method for establishing connections of a battery module

ASSEMBLY STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME

Seal ring inductor and method of forming the same

Coil electronic component and method of manufacturing the same

Electronic control unit

Multi-stacked electronic device with defect-free solder connection

Composite electronic component and resistor

Semiconductor device

Device including a printed circuit board and a metal workpiece

Connector for a computing assembly

LED light core structure

Direct printed circuit routing to stacked opto-electrical IC packages

Multilayer wiring board having wiring structure for mounting multiple electronic components and method for manufacturing the same

Composite electronic component and board having the same

Package structure with an embedded electronic component and method of fabricating the package structure

MOLDED INTERPOSER FOR PACKAGED SEMICONDUCTOR DEVICE

Printed wiring board and method for manufacturing the same

Printed wiring board, method for manufacturing the same and semiconductor device

Metallized particle interconnect with solder components

Metallized particle interconnect with solder components

Semiconductor modules and semiconductor packages

Multi-stacked electronic device with defect-free solder connection

High-frequency component and high-frequency module including the same

Composite electronic component and board having the same

Three-dimensional stack of leaded package and electronic member

SEMICONDUCTOR DEVICE

Package-on-package assembly with wire bond vias

Package apparatus and manufacturing method thereof

Assembled circuit and electronic component

Embedded packages having a connection joint group

Ceramic electronic component with metal terminal

LED lead frame for laminated LED circuits

Bus bar link for battery cell interconnections in a battery module

Battery cell interconnect with stress distribution over a geometric form

Battery terminal post system and method of manufacture

Battery module housing and method of making the same

High current interconnect system and method for use in a battery module

System for providing voltage measurements of battery cells to a PCB within a battery module

Battery module lid system and method

Systems, methods, and devices for constant current relay control of a battery module

Bladed fuse connectors for use in a vehicle battery module

Battery module lid assembly system and method of making the same

System and method for establishing connections of a battery module

System and method for venting pressurized gas from a battery module

Layered battery module system and method of assembly

Battery module printed circuit board assembly system and method

Systems, methods, and devices for pre-charge control of a battery module

Wiring board and method for manufacturing the same

Pad structure and mounted structure

Lighting assembly, a light source and a luminaire

Sensor unit, method of manufacturing the same, electronic apparatus, and moving object

Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims

Packaged capacitor component with multiple self-resonance frequencies

Interconnect architecture with stacked flex cable

Method of interconnecting microchips

Semiconductor package assembly with decoupling capacitor

Circuit assembly

Electronic component and printed circuit board with RFID tag

Wiring board and method for manufacturing the same

Method of manufacturing printed circuit board

Substrate structure having electronic components and method of manufacturing substrate structure having electronic components

Passive component as thermal capacitance and heat sink

Printed circuit board with compact groups of devices

Assembled circuit and electronic component

Apparatus and method for vertically-structured passive components

Mount board and electronic device

Package-on-package assembly with wire bond vias

Wiring board and method for manufacturing the same

FOLDABLE SUBSTRATE

Dual side package on package

Three dimensional passive multi-component structures

Three dimensional passive multi-component structures

Package-on-package assembly with wire bond vias

Wiring board and method for manufacturing the same

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Package-on-package assembly with wire bond vias

Apparatus for stacked electronic circuitry and associated methods

Multi-chip packages providing reduced signal skew and related methods of operation

Assembled circuit and electronic component

Power module for an automobile

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF

Seal ring inductor and method of forming the same

Circuit board unit

Semiconductor device, method of manufacturing semiconductor device, and electronic device

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

Clip for BIOS chip

Embedded isolation filter

Flex cable and method for making the same

System and method of forming a patterned conformal structure

Arrangement of optoelectronic components

Embedded chip-on-chip package and package-on-package comprising same

SUBSTRATE AND IC SOCKET

Electronic component assembly comprising a varistor and a semiconductor component

Mount board and electronic device

Wiring board and method for manufacturing the same

Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnections

Electrical connection interfaces and methods for adjacently positioned circuit components

Power integrity circuits with EMI benefits

Method of making substrate package with through holes for high speed I/O flex cable

Apparatus and method for vertically-structured passive components

Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate

CAPACITOR MOUNTING METHOD AND PRINTED CIRCUIT BOARD

CIRCUIT PACKAGE WITH INTEGRATED DIRECT-CURRENT (DC) BLOCKING CAPACITOR

Semiconductor module and electronic circuit-integrated motor device using same

Electronic component and method of manufacturing electronic component

Circuit board and method of mounting electronic component on printed board

Method and Apparatus for Vertical Stacking of Integrated Circuit Chips

Multi-chip packages providing reduced signal skew and related methods of operation

Semiconductor chip package with undermount passive devices

CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT

MEMORY MODULE

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Module and mounted structure using the same

Structures and methods for an application of a flexible bridge

Interconnect System without Through-Holes

System and method of forming a patterned conformal structure

Electro component package

Substrate package with through holes for high speed I/O flex cable

Printed substrate through which very strong currents can pass and corresponding production method

Chip having side protection terminal and package using the chip

Structure and Method for Reliable Solder Joints

Embedding device in substrate cavity

SEMICONDUCTOR PACKAGE HAVING PASSIVE COMPONENT BUMPS

3-D stacking of active devices over passive devices

LED unit with interlocking legs

LED assembly incorporating a structure for preventing solder contamination when soldering electrode leads thereof together

ELECTRONIC COMPONENT BUILT-IN BOARD, MANUFACTURING METHOD OF ELECTRONIC COMPONENT BUILT-IN BOARD, AND SEMICONDUCTOR DEVICE

Assembled circuit and electronic component

Electrical connection interfaces and methods for adjacently positioned circuit components

LOW INDUCTANCE, HIGH RATING CAPACITOR DEVICES

Integrated circuit package-on-package stacking system and method of manufacture thereof

Integrated circuit packages including sinuous lead frames

LIGHT EMITTING MODULE

Circuit device and method of manufacturing the same

Direct-connect signaling system

Package with passive component support assembly

Integrated circuit packaging system with passive components

DECOUPLING CAPACITOR ASSEMBLY, INTEGRATED CIRCUIT/DECOUPLING CAPACITOR ASSEMBLY AND METHOD FOR FABRICATING SAME

Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same

Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board

Embedded resistor and capacitor circuit and method of fabricating same

Connector and substrate mounting method for the same

Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus

Integrated circuit package system with flexible substrate and mounded package

SEMICONDUCTOR PACKAGE

Mount Board and Electronic Device

Method and apparatus for stackable modular integrated circuits

Semiconductor Package-on-Package System Including Integrated Passive Components

Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus

Base semiconductor component for a semiconductor component stack and method for the production thereof

Method of assembling electronic components of an electronic system, and system thus obtained

SEMICONDUCTOR DEVICE INCLUDING MULTILAYER WIRING BOARD WITH POWER SUPPLY CIRCUIT

APPARATUS FOR PROVIDING CONTROLLED IMPEDANCE IN AN ELECTRICAL CONTACT

Chip component mounting structure, chip component mounting method, and electronic device

Power integrity circuits with EMI benefits

Laterally Interconnected IC Packages and Methods

Detection device

Printed-wiring board, method of manufacturing printed-wiring board, and electronic equipment

Electronic component device and method of mounting electronic component

Single Package Multiple Component Array With Ball Grid Array Mounting and Contact Interface

Simultaneous bidirectional cable interface

Method for implementing component placement suspended within grid array packages for enhanced electrical performance

POWER SEMICONDUCTION DEVICE AND CIRCUIT MODULE HAVING SUCH POWER SEMICONDUCTION DEVICE

Ultra low inductance multi layer ceramic capacitor

Module and mounted structure using the same

Electronic circuit in a package-on-package configuration and method for producing the same

Semiconductor device stack and method for its production

Electrical assembly

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Semiconductor package-on-package system including integrated passive components

Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device

Semiconductor module having discrete components and method for producing the same

Embedding device in substrate cavity

Composition and method for pre-surgical skin disinfection

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Semiconductor module comprising semiconductor chips and method for producing the same

Interconnected IC packages with vertical SMT pads

Circuit board and method for mounting chip component

Stacking method and stacked structure for attaching memory components to associated device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus

Method of forming a device package having edge interconnect pad

Multilayer printed wiring board, method of manufacturing multilayer printed wiring board and electronic apparatus

Electrical module and electrical unit

Structures and methods for an application of a flexible bridge

Amplifier with feedback bridge