CIRCUIT BOARD WITH SEMI-SOLDER MASK DEFINED PAD AND METHOD OF MANUFACTURING SAME

MODULE AND ELECTRONIC DEVICE

SYSTEMS AND METHODS FOR IMPLEMENTING AN ELECTRICAL CIRCUIT INCLUDING AN INDUCTIVE TUNING ELEMENT

METHODS AND APPARATUS TO CONNECT A SEMICONDUCTOR PACKAGE TO A CIRCUIT BOARD

CIRCUIT BOARD SYSTEM

POWER MODULE AND POWER DEVICE

MODULE COMPRISING ANTENNA AND RF ELEMENT, AND BASE STATION INCLUDING SAME

ELECTRIC ASSEMBLY COMPRISING TWO PRINTED CIRCUIT BOARDS

Pluggable CPU Modules with Vertical Power

CONNECTION COMPONENTS FOR CONNECTING A SEMICONDUCTOR PACKAGE WITH A BOTTOM STIFFENER TO A PRINTED CIRCUIT BOARD

Opto-mechanical structure design of thin LGA package with glass cover

Pluggable CPU modules with vertical power

HIGH-FREQUENCY COMPONENT, ELECTRIC CIRCUIT ARRANGEMENT AND RADAR SYSTEM

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Module comprising antenna and RF element, and base station including same

Opto-mechanical structure design of thin LGA package with glass cover and a thickness of an aperture ceiling is 0.20MM

Vertical power delivery packaging structure

LGA SOCKET PINS FOR IMPROVED DIFFERENTIAL SIGNALING PERFORMANCE

Electronic assembly including cable modules

METHOD TO MULTI-SOURCE PD CONTROLLERS FOR USB4 SOLUTIONS AND SYSTEMS

FLEX-PCB INTEGRATED PACKAGING FOR SILICON PHOTONICS LIDAR

Electronic component package body, electronic component assembly structure, and electronic device

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

STEPPED PACKAGE AND RECESSED CIRCUIT BOARD

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Module comprising antenna and RF element, and base station including same

Solderable circuit board module system

Electronic assembly including cable modules

Module comprising antenna and RF element, and base station including same

Liquid metal infiltration rework of electronic assembly

Structure with controlled capillary coverage

Module comprising antenna and RF element, and base station including same

Module comprising antenna and RF element, and base station including same

Power delivery module for an electronic package

Insulated socket body and terminals for a land grid array socket assembly

Functional stiffener that enables land grid array interconnections and power decoupling

Surface mount passive component shorted together

Module comprising antenna and RF element, and base station including same

Semiconductor component, and contacting assembly having a semiconductor component and a printed circuit board

Printed wiring board, printed circuit board, and electronic device

Low inductance laser driver packaging using lead-frame and thin dielectric layer mask pad definition

Reduced capacitance land pad

Integrating system in package (SiP) with input/output (IO) board for platform miniaturization

Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket

Server microprocessor carrier with guiding alignment anti-tilt and automatic thermal interface material separation features for use in land grid array sockets

Electronic module and method of manufacturing electronic module

Vertical-side solder method and package for power GaN devices

Burned-in Component Assembly

Socket connector for an electronic package

Socket connector for an electronic package

Socket connector assembly for an electronic package

Cable socket connector assembly for an electronic

Configuration element for printed circuit board assemblies

Integrating system in package (SIP) with input/output (IO) board for platform miniaturization

INTEGRATED VOLTAGE REGULATOR WITH AUGMENTED CURRENT SOURCE

System-in-Package device ball map and layout optimization

Printed circuit board with a recess to accommodate discrete components in a package

Semiconductor device

Printed circuit board and electronic device

Array type discrete decoupling under BGA grid

Configurable, encapsulated sensor module and method for making same

Solder contacts for socket assemblies

Configuration element for printed circuit board assemblies

Printed wiring board, printed circuit board, and electronic device

Land grid array (LGA) packaging of passive-on-glass (POG) structure

Bumped land grid array

Chip card module and method for producing a chip card module

EXTENDED PADS TO EASE REWORK FOR BTC AND BGA TYPE TECHNOLOGY

Rework grid array interposer with direct power

Contactor with cable and wiring board

Solder contacts for socket assemblies

Printed wiring board

Semiconductor package modules, memory cards including the same, and electronic systems including the same

Electronic device

Electronic component

Socket loading element and associated techniques and configurations

CPU package substrates with removable memory mechanical interfaces

Modular printed circuit board electrical integrity and uses

Motherboard with a hole

MULTILAYER WIRING BOARD

Printed circuit board assembly including conductive heat transfer

Ball grid array formed on printed circuit board

Modular printed circuit board

Support structure for stacked integrated circuit dies

SCREEN CONTROL MODULE OF A MOBILE ELECTRONIC DEVICE AND CONTROLLER THEREOF

Face-up substrate integration with solder ball connection in semiconductor package

Mounting member, electronic component, and method for manufacturing module

Method of manufacturing printed circuit board and printed circuit board

Lateral slide pick and place cover for reduced bent pins in LGA sockets

Electronic apparatus and land grid array module

Electrical connector

Land grid array interconnect formed with discrete pads

Interconnection designs and materials having improved strength and fatigue life

Reduced capacitance land pad

Apparatus and method for vertically-structured passive components

ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION

Motherboard assembly for interconnecting and distributing signals and power

Method of forming a land grid array with discrete pads

Endoscope apparatus and electronic apparatus

ENDOSCOPE DEVICE AND CIRCUIT BOARD

LAND GRID ARRAY (LGA) CONTACT CONNECTOR MODIFICATION

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS

PRINTED CIRCUIT BOARD (PCB) ASSEMBLY WITH ADVANCED QUAD FLAT NO-LEAD (A-QFN) PACKAGE

SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING ELONGATED FASTENERS

Method of forming a semiconductor socket

THERMAL FLEX CONTACT CARRIERS #2

Occam process for components having variations in part dimensions

Semiconductor device

Electronic Assemblies without Solder and Methods for their Manufacture

Power integrity circuits with EMI benefits

Separable electrical connectors using isotropic conductive elastomer interconnect medium

Method for low temperature bonding of electronic components

Motherboard assembly for interconnecting and distributing signals and power

Apparatus and method for vertically-structured passive components

Printed wiring board, semiconductor device, and method for manufacturing printed wiring board

ELECTRONIC DEVICE, LAYERED SUBSTRATE, AND METHODS OF MANUFACTURING SAME

PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

Substrate having leads

CONNECTION MEMBER AND PRINTED CIRCUIT BOARD UNIT

SPACE TRANSFORMER CONNECTOR PRINTED CIRCUIT BOARD ASSEMBLY

Separable electrical connectors using isotropic conductive elastomer interconnect medium

SEMICONDUCTOR PACKAGE SUBSTRATE WITH METAL BUMPS

Method and structure for adapting solder column to warped substrate

Methods for securing semiconductor devices using elongated fasteners

Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power Distribution

Method for manufacturing printed-circuit board

Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving

Through board stacking of multiple LGA-connected components

Low profile solder grid array technology for printed circuit board surface mount components

Electronic Assemblies without Solder and Method for their Design, Prototyping, and Manufacture

Composite interconnect

Method of optimizing land grid array geometry

Semiconductor module

Separable electrical connectors using isotropic conductive elastomer interconnect medium

DIRECT ATTACH INTERCONNECT FOR CONNECTING PACKAGE AND PRINTED CIRCUIT BOARD

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

Mounted structural body and method of manufacturing the same

Electrical connection device and assembly method thereof

RFID tag and manufacturing method thereof

Providing variable sized contacts for coupling with a semiconductor device

Package substrate including surface mount component mounted on a peripheral surface thereof and microelectronic package including same

Semiconductor package embedded in substrate, system including the same and associated methods

System for the Manufacture of Electronic Assemblies Without Solder

Assembly of Encapsulated Electronic Components to a Printed Circuit Board

Electronic assemblies without solder having overlapping components

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Method of manufacturing an electronic part mounting structure

Camera device and electronic device including the same

Method of making a circuit assembly

Skived electrical contact for connecting an IC device to a circuit board and method of making a contact by skiving

CAMERA MODULE AND METHOD FOR ASSEMBLING SAME

Electronic Assemblies without Solder and Methods for their Manufacture

Power integrity circuits with EMI benefits

Interconnection designs and materials having improved strength and fatigue life

Customizable backer for achieving consistent loading and engagement of array package connections

Surface treatments for contact pads used in semiconductor chip packagages and methods of providing such surface treatments

Compliant penetrating packaging interconnect

Probe card assembly and kit

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

Stacked package and method for manufacturing the package

Integrated circuit package with improved power signal connection

IC chip package having force-adjustable member between stiffener and printed circuit board

Rotation joint and semiconductor device having the same

Multi-Chip Module (MCM) of a Computer System

IC chip package having automated tolerance compensation

Printed circuit board unit and electronic apparatus

Method for implementing component placement suspended within grid array packages for enhanced electrical performance

Through board stacking of multiple LGA-connected components

High density electronic packages

IC socket and manufacturing method for the same

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Customizable backer for achieving consistent loading and engagement of array package connections

Interconnection system between CPU and voltage regulator

Computer systems having an interposer including a flexible material

Interconnections resistant to wicking

Method of fabricating an electronic module having a side contact

Anisotropic conductive sheet and method of manufacturing the same

Technique for blind-mating daughtercard to mainboard

Space transforming land grid array interposers

Electronic packaging using conductive interproser connector

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Structure and process for a contact grid array formed in a circuitized substrate

Separable network interconnect systems and assemblies

Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems

Composition and method for pre-surgical skin disinfection

Probe For Semiconductor Devices

Components, methods and assemblies for multi-chip packages

Low temperature bumping process

Integrated circuit package with improved power signal connection

Computer system and bridge module thereof

Gel package structural enhancement of compression system board connections

Method for using gel package structure enhancing thermal dissipation between compressed printed circuit board and heat sink mechanical stiffener

Method for structural enhancement of compression system board connections

Gel package structural enhancement of compression system board connections

Gel package structural enhancement of compression system board connections

Integrated circuit die configuration for packaging

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

LSI package provided with interface module

Contact Structures Comprising A Core Structure And An Overcoat

Probe card assembly and kit

Power delivery to base of processor

Land grid array structures and methods for engineering change

Method and apparatus for soldering modules to substrates

Electronic component and electronic configuration

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Interposers with flexible solder pad elements

Means of mounting for electronic components, arrangement and procedure

Method for aligning a component on a printed circuit board

Memory module

Integrated circuit die configuration for packaging

Methods of manufacturing interposers with flexible solder pad elements

Hybrid compression socket connector for integrated circuits

Probe for semiconductor devices

Structure for controlled shock and vibration of electrical interconnects

Micro-bumps to enhance LGA interconnections

Interposer with flexible solder pad elements and methods of manufacturing the same

High density package with wrap around interconnect

Device and method for tilted land grid array interconnects on a coreless substrate package

Flexible scrub ring contact

Mounting a voltage regulator on top of a processor

Method and stencil for extruding material on a substrate

Method and stencil for extruding material on a substrate

Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications

Electronic packaging using conductive interposer connector

IC module assembly

Integrated circuit package with improved power signal connection

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS

I/C package/thermal-solution retention mechanism with spring effect

LSI package provided with interface module

Method and system for producing resilient solder joints

Adhesive film and tacking pads for printed wiring assemblies

Apparatus and method for force mounting semiconductor packages to printed circuit boards

Probe card assembly

Contact structures and methods for making same

Barrier for hybrid socket movement reduction

Grid array pattern for crosstalk reduction

Grid array pattern for crosstalk reduction

Pogo pin integrated circuit package mount