Printed circuit board, fabrication method and apparatus

Apparatus and Method for ESD Protection of an Integrated Circuit

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Thermo-compression bonded electrical interconnect structure and method

Manufacturing method of semiconductor device with a mold resin having a mold release agent

DECOUPLING CAPACITOR ASSEMBLY, INTEGRATED CIRCUIT/DECOUPLING CAPACITOR ASSEMBLY AND METHOD FOR FABRICATING SAME

Thermo-compression bonded electrical interconnect structure and method

Semiconductor integrated circuit package, printed circuit board, semiconductor apparatus, and power supply wiring structure

Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

SYSTEMS AND METHODS FOR BALL GRID ARRAY (BGA) ESCAPE ROUTING

Circuit module with thermal casing systems

Semiconductor device and printed circuit board

Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board

Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Heat sink for a high capacity thin module system

Oblong peripheral solder ball pads on a printed circuit board for mounting a ball grid array package

Electronic assemblies without solder having overlapping components

Semiconductor chip package and method for designing the same

Semiconductor Package, Printed Wiring Board Structure and Electronic Apparatus

PRINTED WIRING BOARD STRUCTURE AND ELECTRONIC APPARATUS

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Method of fabricating a semiconductor multipackage module including a processor and memory package assemblies

Surface mounted heat sink and electromagnetic shield

Memory module capable of lessening shock stress

CONDUCTOR REINFORCEMENT FOR CIRCUIT BOARDS

Motherboard

Electronic device and manufacturing method

Printed wiring board and electronic apparatus including same

Method of producing a land grid array (LGA) interposer structure

SEMICONDUCTOR PACKAGE

ELECTRONIC APPARATUS

Method of producing a land grid array interposer

Pad and circuit board, electronic device using same

Mount Board and Electronic Device

INTERCONNECT USING LIQUID METAL

Printed circuit board, mounting method of electronic component, and electronic apparatus

Printed wiring board structure, electronic component mounting method and electronic apparatus

System and method for coupling an integrated circuit to a circuit board

Signal transmission circuit, IC package, and mounting board

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

Semiconductor Package-on-Package System Including Integrated Passive Components

Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material

Semiconductor device mounting structure, manufacturing method, and removal method of semiconductor device

Method of producing a land grid array interposer

Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device

Method and device for transferring a solder deposit configuration

Printed circuit board and semiconductor module having the same

Printed wiring board assembly, method of mounting components on printed wiring board and electronic apparatus

CONTACT MADE OF CERAMIC AND ITS MANUFACTURING METHOD

Methods and apparatus for a flexible circuit interposer

SIMULTANEOUS DESIGN OF INTEGRATED CIRCUIT AND PRINTED CIRCUIT BOARD

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

Base semiconductor component for a semiconductor component stack and method for the production thereof

Die module system

Printed circuit board and flip chip package using the same with improved bump joint reliability

System and Method for Capacitive Coupled VIA Structures in Information Handling System Circuit Boards

Printed circuit board and its designing method, and designing method of IC package terminal and its connecting method

Enhanced localized distributive capacitance for circuit boards

Package substrate and its solder pad

PRINTED WIRING BOARD AND INFORMATION PROCESSING APPARATUS

Electronic component package, electronic component mounted apparatus, method of inspecting bonding portion therein, and circuit board

Semiconductor device and wiring part thereof

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Electrical connection board and assembly of such a board and a semiconductor component comprising an integrated circuit chip

Solder interconnection array with optimal mechanical integrity

Semiconductor device and method of manufacturing the same

Layout circuit

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Damage prevention interposer for electronic package and electronic interconnect structure

Interposer

Method For Increasing a Routing Density For a Circuit Board and Such a Circuit Board

Conductive dome probes for measuring system level multi-GHZ signals

Optimizing application specific integrated circuit pinouts for high density interconnect printed circuit boards

Package substrate and device for optical communication

Integrated circuit carrier assembly

Stacked package module and board having exposed ends

Optimizing ASIC pinouts for HDI

Connection an integrated circuit on a surface layer of a printed circuit board

Wiring structure of laminated capacitors

Reducing crosstalk in electronic devices having microstrip lines covered by a flexible insulating material and a metallic backing plate

Power core devices and methods of making thereof

Method of forming a land grid array (LGA) interposer

Hybrid flex-and-board memory interconnect system

ELECTRONIC SYSTEM WITH INTEGRATED CIRCUIT DEVICE AND PASSIVE COMPONENT

Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid

TAB WRAP FOLDABLE ELECTRONIC ASSEMBLY MODULE AND METHOD OF MANUFACTURE

Electronic device and electronic component mounting method

Interconnect for an electrical circuit substrate

Elliptic C4 with optimal orientation for enhanced reliability in electronic packages

Low profile chip scale stacking system and method

In-grid decoupling for ball grid array (BGA) devices

Electronic apparatus and mounting method

Passive electronic device

Electronic board incorporating a heating resistor

Dynamic pad size to reduce solder fatigue

POWER CONTROL STRUCTURE FOR MANAGING A PLURALITY OF VOLTAGE ISLANDS

Alternating via fanout patterns

Probe card assembly and kit

Anti-Impact memory module

Electrical terminal footprints for a printed circuit board

Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane

SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY

Electronic component built-in substrate and method for manufacturing the same

Substrate improving immobilization of ball pads for BGA packages

Multi-layer printed wiring board

Method of producing a land grid array interposer utilizing metal-on-elastomer

Semiconductor package and module printed circuit board for mounting the same

Crack-resistant solder joint, electronic component such as circuit substrate having the solder joint, semiconductor device, and manufacturing method of electronic component

Memory module for improving impact resistance

Laterally Interconnected IC Packages and Methods

Method of producing a land grid array (LGA) interposer utilizing metal-on-elastomer

High-frequency PCB connections that utilize blocking capacitors between the pins

Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths

Routing density through asymmetric array of vias

Integrated circuit device mounting with folded substrate and interposer

Ceramic package substrate with recessed device

Printed circuit board having coplanar LC balance

Method of forming a land grid array interposer

Integrated circuit package with chip-side signal connections

Electronic Apparatus

Semiconductor device and printed circuit board

IC chip package having force-adjustable member between stiffener and printed circuit board

Slim design main board

Circuit board including stubless signal paths and method of making same

Semiconductor module and method of manufacturing the same

Method and apparatus for reducing stresses applied to bonded interconnects between substrates

Printed circuit board with embedded circuit component

Flexible interconnect cable for an electronic assembly

Voltage controlled oscillator module with ball grid array resonator

Ball grid array package assembly with integrated voltage regulator

Electronic System With Lead Free Interconnections And Method of Fabrication

CHIP-PACKAGING COMPOSITIONS INCLUDING CATALYSTS AND HARDENERS, PACKAGES MADE THEREWITH, AND METHODS OF ASSEMBLING SAME

Compact solid state drive and processor assembly

PRINTED CIRCUIT BOARD FOR MOUNTING SEMICONDUCTOR DEVICE PACKAGE, AND METHOD OF TESTING AND FABRICATING SEMICONDUCTOR DEVICE PACKAGE USING THE SAME

Method of making multi-chip electronic package with reduced line skew

Ball grid array package and method thereof

High capacity thin module system

Stack-type semiconductor package sockets and stack-type semiconductor package test systems

Partial Solder Mask Defined Pad Design

Printed circuit boards having pads for solder balls and methods for the implementation thereof

Motherboard configured to minimize or prevent damage to a chip thereon

Semiconductor integrated circuit device

Apparatus for supplying power to a semiconductor device using a capacitor DC shunt

Inverted CSP Stacking System and Method

Reworkable passive element embedded printed circuit board

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Modularized Die Stacking System and Method

Semiconductor device power interconnect striping

Interchangeable connection arrays for double-sided DIMM placement

Thermal management system and method for electronic assemblies

Method for implementing component placement suspended within grid array packages for enhanced electrical performance

POP package and method of fabricating the same

Substrate structure having N-SMD ball pads

System and method for reducing stress-related damage to ball grid array assembly

Components, methods and assemblies for stacked packages

System and method for reducing stress-related damage to ball grid array assembly

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Semiconductor device and method of manufacturing the same

Stacked module systems and methods

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Reliability enhancement process

High capacity thin module system and method

High capacity thin module system and method

Methods and apparatus for efficiently generating profiles for circuit board work/rework

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

LGA utilizing metal-on-elastomer hemi-torus having a slitted wall surface for venting gases

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Device mounting board having multiple circuit substrates, and semiconductor module with the device mounting board

Via heat sink material

Semiconductor package

Integrated circuit module and method of forming the same

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

Electronic part and circuit substrate

Electronic circuit in a package-on-package configuration and method for producing the same

Capacitor sheet and electronic circuit board

Optical transmission between devices on circuit board

Ball grid array (BGA) connection system and related method and ball socket

Package mounted module

Defining pin functionality at device power on

Conductive component, electrical connector, and chip module

Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

System and apparatus for power distribution for a semiconductor device

Compliant integrated circuit package substrate

In-situ monitoring and method to determine accumulated printed wiring board thermal and/or vibration stress fatigue using a mirrored monitor chip and continuity circuit

SEMICONDUCTOR PACKAGE AND METHOD OF MOUNTING THE SAME

Printed circuit board and circuit structure for power supply

Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device

Thermally enhanced memory module

Encapsulated multi-phase electronics heat-sink

Integrated circuit (IC) carrier assembly incorporating serpentine suspension

Interconnections resistant to wicking

Power distribution system for integrated circuits

Power distribution system for integrated circuits

Thermally enhanced electronic flip-chip packaging with external-connector-side die and method

Method of making an electronic package

Package mounted module and package board module

Semiconductor device stack and method for its production

Method and apparatus for a low thermal impedance printed circuit board assembly

Compensation for far end crosstalk in data buses

SYSTEM AND METHOD FOR PROCESSOR POWER DELIVERY AND THERMAL MANAGEMENT

Flexible circuit connectors

Component mounting apparatus and component mounting method

Semiconductor package-on-package system including integrated passive components

Printed wiring board, semiconductor package with printed wiring board and electronic device having printed circuit board

Ball grid array connection monitoring system and method

Contactor and test method using contactor

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor Device and Method of Manufacturing the Same, Circuit Board and Electronic Device

Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out

Semiconductor device and manufacture method thereof

Stacked microelectronic device assemblies

Midplane with offset connectors

TEST CONTACT SYSTEM FOR TESTING INTEGRATED CIRCUITS WITH PACKAGES HAVING AN ARRAY OF SIGNAL AND POWER CONTACTS

Circuit board apparatus, circuit component reinforcing method and electronic device

Manufacturing method of semiconductor device

Multi-layer board with decoupling function

Ball grid array package

Electronic circuit, a semiconductor device and a mounting substrate

Facility and method for high-performance circuit board connection

System and method of using a compliant lead interposer

Microcomputer having memory interface circuits and memory devices on a module board

Interconnect design for reducing radiated emissions

RFIC die and package

Semiconductor chip package mounting structure implementing flexible circuit board

Composition and method for pre-surgical skin disinfection

Memory module with rubber spring connector

Passive impedance equalization of high speed serial links

High density surface mount part array layout and assembly technique

Probe For Semiconductor Devices

Composite core circuit module system and method

Methods for fabricating fences on interposer substrates

Interconnection pattern design

Semiconductor chip package with attached electronic devices, and integrated circuit module having the same

Substrate and semiconductor device

Semiconductor module comprising semiconductor chips and method for producing the same

Semiconductor module and method of forming a semiconductor module

GAP CONTROL BETWEEN INTERPOSER AND SUBSTRATE IN ELECTRONIC ASSEMBLIES

Structure of Ball Grid Array package

Electronic device comprising at least one printed circuit board and comprising a plurality of semiconductor components of identical type, and method

Apparatus and method of via-stub resonance extinction

Connection verification technique

Multilayer semiconductor device

Substrate structure, substrate manufacturing method and electronic device

LAYOUT STRUCTURE OF A CONDUCTION REGION OF A CPU SOCKET

Method and power control structure for managing plurality of voltage islands

Multi-stacked package and method of manufacturing the same

Using a thru-hole via to improve circuit density in a PCB

Paste coater and PoP automatic mounting apparatus employing the same

Projected contact structures for engaging bumped semiconductor devices

Package module with alignment structure and electronic device with the same

Memory Module System and Method

Memory Module System and Method

Semiconductor device and manufacturing method thereof

Process for attaching components with near-zero standoff to printed circuit boards

IC embedding seat

Methods for fabricating protective layers on semiconductor device components

Small form factor molded memory card and a method thereof

Ball grid attachment

Low Profile Stacking System and Method

Thin module system and method

Low Profile Stacking System and Method

LAYOUT STRUCTURE OF BALL GRID ARRAY

Method and device to elongate a solder joint

Buffered Thin Module System and Method

Stacking method and stacked structure for attaching memory components to associated device

INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM

Offset integrated circuit package-on-package stacking system

Flex circuit apparatus and method for adding capacitance while conserving circuit board surface area

Method and apparatus for reducing electrical interconnection fatigue

Coupling substrate for semiconductor components and method for producing the same

Power distribution for high-speed integrated circuits

Electronic packaging for optical emitters and sensors

Printed wiring board and printed circuit board using the same

Semiconductor module including a plurality of IC chips therein

Chip-packaging composition of resin and cycloaliphatic amine hardener

System and method for decreasing stress on solder holding BGA module to computer motherboard

Power core devices

Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

Capacitor interconnection

Printed wiring board and method of suppressing power supply noise thereof

Electronic component packaging structure and method for producing the same

Arrangement of conductive pads on grid array package and on circuit board

Electronic apparatus

Thermal expansion compensation graded IC package

Built-in capacitor type power feed device to power pins of electrical component

Power feed device to power pins of electrical component

Mid-plane arrangement for components in a computer system

Method for fabricating a chip module and a device module fabricated therefrom

Depopulation of a ball grid array to allow via placement

Semiconductor module and method of forming a semiconductor module