Chip package and substrate thereof

Package having balls designed to reduce contact resistance, test apparatus for testing the package, and method of manufacturing the package

Structure and method for reducing warp of substrate

Electronic assembly that includes pads having a bowl shaped upper section

Embedded capacitor device having a common coupling area

Method for designing semiconductor apparatus, system for aiding to design semiconductor apparatus, computer program product therefor and semiconductor package

Area array routing masks for improved escape of devices on PCB

Printed circuit board

Method for re-forming BGA of a semiconductor package

Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology

Printed circuit board for thermal dissipation and electronic device using the same

Flexible interconnect cable with grounded coplanar waveguide

Printed circuit board and electronic apparatus including printed circuit board

Method and circuit for reducing series inductance of a decoupling capacitor in a ball grid array (BGA)

Printed circuit board, semiconductor package and multi-stack semiconductor package using the same

Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid

Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels)

Security apparatus

Semiconductor device and a manufacturing method of the same

Printed circuit board for thermal dissipation and electronic device using the same

Printed circuit board (PCB) having a plurality of integrated circuits (ICS) interconnected through routing pins in one central integrated circuit

System and method for processor power delivery and thermal management

Semiconductor package having lead free conductive bumps and method of manufacturing the same

Electronic component and method for manufacturing the same

Contact Structures Comprising A Core Structure And An Overcoat

Apparatus and method for solder ball placement

Method for molding a small form factor digital memory card

Interposers with alignment fences and semiconductor device assemblies including the interposers

Probe card assembly and kit

Power delivery to base of processor

Electronic apparatus with thermal module

Configuration for multi-layer ball grid array

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Module and method for fabricating the same

Non-uniform decoupling capacitor distribution for uniform noise reduction across chip

Manufacturing method for an electronic component assembly and corresponding electronic component assembly

Zero ATE insertion force interposer daughter card

Apparatuses and associated methods for improved solder joint reliability

Semiconductor device, semiconductor device mounting board, and method for mounting semiconductor device

Through-hole arrangement for a ball grid array package

Semiconductor device

Memory module system and method

Offset integrated circuit package-on-package stacking system

Multi-chip electronic package with reduced line skew and circuitized substrate for use therein

Apparatus and methods for constructing balanced chip packages to reduce thermally induced mechanical strain

Technique for accommodating electronic components on a multilayer signal routing device

Modular integrated circuit chip carrier

Solder ball pad surface finish structure of circuit board and fabrication method thereof

System component interposer

Ball grid array assignment

NON-SOLDER MASK DEFINED (NSMD) TYPE WIRING SUBSTRATE FOR BALL GRID ARRAY (BGA) PACKAGE AND METHOD FOR MANUFACTURING SUCH A WIRING SUBSTRATE

Ball grid array configuration for reducing path distances

Bow control in an electronic package

Methods and apparatus for interconnecting a ball grid array to a printed circuit board

Gap control between interposer and substrate in electronic assemblies

BGA-type multilayer circuit wiring board

Electronic device

Matched-impedance surface-mount technology footprints

BGA semiconductor chip package and mounting structure thereof

Semiconductor module and method of forming a semiconductor module

Systems and methods for reducing simultaneous switching noise in an integrated circuit

BGA type semiconductor package featuring additional flat electrode teminals, and method for manufacturing the same

Printed wiring board and information processing apparatus

High-frequency, high-signal-density, surface-mount technology footprint definitions

Heater that attaches electronic component to and detaches the same from substrate

Inductor

Ball assignment system

Alignment fences and devices and assemblies including the same

Methods and apparatus for a flexible circuit interposer

Methods and apparatus for a flexible circuit interposer

Method for increasing wiring channels/density under dense via fields

Semiconductor integrated circuit arrangement device and method

Electronic function part mounted body and method of manufacturing the electronic function part mounted body

Integrated device and electronic system

Stacked semiconductor package

Modified core for circuit module system and method

Signal transmission circuit, IC package, and mounting board

Methods and apparatus for a flexible circuit interposer

Electronic device, standoff member, and method of manufacturing electronic device

Methods for fabricating semiconductor devices so as to stabilize the same when contact-bearing surfaces thereof face over test substrates

Printed board

Stacked ball grid array package module utilizing one or more interposer layers

Circuit board for mounting a semiconductor circuit with a surface mount package

Circuit board assembly with a brace surrounding a ball-grid array device

Conductive heat transfer for electrical devices from the solder side and component side of a circuit card assembly

Stacked type semiconductor device and method of fabricating stacked type semiconductor device

Circuit board mounted with surface mount type circuit component and method for producing the same

Electronic assembly with integrated IO and power contacts

Off-grid decoupling of ball grid array (BGA) devices and method

Multilayer interconnection board

Semiconductor mounting board

Method and apparatus for reducing stresses applied to bonded interconnects between substrates

Interconnection structure through passive component

Thermal management system and method for electronic assemblies

Stacked semiconductor package having interposing print circuit board

Inverted CSP stacking system and method

Method for aligning a component on a printed circuit board

Method for making a semiconductor multipackage module including a processor and memory package assemblies

Enhanced reliability semiconductor package

Systems and methods for providing co-processors to computing systems

Connection of package, board, and flex cable

Ballout for buffer

Foamable underfill encapsulant

Packaging for electronic modules

Test unit usable with a board having an electronic component

Device for electrical connection of an integrated circuit chip

Multilayer printed wiring board

Transponder assembly for use with parallel optics modules in fiber optic communications systems

Transponder assembly for use with parallel optics modules in fiber optic communications systems

Technique for enhancing circuit density and performance

Anchored non-solder mask defined ball pad

Stacking system and method

Thermal attach and detach methods and system for surface-mounted components

Electrical printed circuit board

Semiconductor apparatus

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Flex circuit constructions for high capacity circuit module systems and methods

Forming of high aspect ratio conductive structure using injection molded solder

Solder reflow system and method thereof

Semiconductor device and method of fabricating the same

METHOD FOR ATTACHING AN INTEGRATED CIRCUIT PACKAGE TO A CIRCUIT BOARD

Method for fabricating semiconductor components with conductive vias

Methods for assembling a stack package for high density integrated circuits

Stack package for high density integrated circuits

Semiconductor device with improved heat dissipation

Off-width pitch for improved circuit card routing

Integrated circuit component and mounting method thereof

Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips

Heat-dissipating device

Semiconductor module with conductive element between chip packages

Stepped integrated circuit packaging and mounting

Stacked module systems

High capacity thin module system

Stacking system and method

Circuit module with thermal casing systems

Integrated structure with CPU and north bridge chip

Printed wiring board and information processing device incorporating the board

Folded substrate with interposer package for integrated circuit devices

Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

Circuit Module Access System and Method

Multi-terminal device and printed wiring board

System and method for forming solder joints

Packaging method, packaging structure and package substrate for electronic parts

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Printed circuit board having chip package mounted thereon and method of fabricating same

Assembly for stacked BGA packages

Solder interconnection array with optimal mechanical integrity

Circuit board having an overlapping via

Method of forming solder ball, and fabricating method and structure of semiconductor package using the same

Projected contact structures for engaging bumped semiconductor devices and methods of making the same

Stackable ball grid array

Thin module system and method

Module assembly and method for stacked BGA packages

Die module system

Buffered thin module system and method

Thin module system and method

LSI package with interface module, transmission line package, and ribbon optical transmission line

Thin module system and method

Optimized mounting area circuit module system and method

High capacity thin module system and method

Semiconductor device and method for manufacturing semiconductor device

Thin module system and method with thermal management

Thin module system and method with skew reduction

Module assembly for stacked BGA packages

Module thermal management system and method

Thin module system and method

Minimized profile circuit module systems and methods

System and method for capacitive coupled via structures in information handling system circuit boards

Control of breakdown voltage for microelectronic packaging

Board level solder joint support for BGA packages under heatsink compression

IC package with power and signal lines on opposing sides

Semiconductor device having stiffener

LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device

Apparatus for providing optical communication between integrated circuits of different PC boards and an integrated circuit assembly for use therein

Probe for semiconductor devices

Methods of forming a contact array in situ on a substrate

Interconnect for bumped semiconductor components

Surface treatment for oxidation removal in integrated circuit package assemblies

Wiring board and method of manufacturing wiring board

Substrates including alignment fences

Reconfigurable processor element utilizing both coarse and fine grained reconfigurable elements

Integrated circuit stacking system and method

Motherboard structure for preventing short circuit

Method of forming printed circuit card

Groundless flex circuit cable interconnect

Stud bump socket

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Stacking system and method

System and method for processor power delivery and thermal management

Apparatus and method for PCB smoke and burn detection and prevention

Semiconductor package

Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Ball grid array solder joint reliability

Multilayer electronic component and method for producing the same

Flex-based circuit module

Wire bonding method and apparatus for integrated circuit

Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor

Package modification for channel-routed circuit boards

Integrated strain gages for board strain characterization

Method of making an electronic package

Electronic device including chip parts and a method for manufacturing the same

Semiconductor device power interconnect striping

Method and apparatus for supporting microelectronic substrates

Stacked module systems and methods

Semiconductor chip package

Integrated circuit package with low modulus layer and capacitor/interposer

Semiconductor device

Semiconductor device and printed circuit board

Multi-chip module with embedded package and method for manufacturing the same

Circuit board, device mounting structure, device mounting method, and electronic apparatus

Semiconductor device package having buffered memory module and method thereof

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Semiconductor package having a high-speed signal input/output terminal

Capillary underfill channel

Mounting structure of ball grid array

Electronic assembly with integrated IO and power contacts

Methods for forming electrical connections and resulting devices

Embedded power management control circuit

Delivery regions for power, ground and I/O signal paths in an IC package

Interchangeable connection arrays for double-sided memory module placement

Integrated circuit package with chip-side signal connections

Interconnect system without through-holes

Area array and leaded SMT component stenciling apparatus and area array reballing method

Optimized power delivery to high speed, high pin-count devices

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device with capacitor

Electronic part mounting substrate, electronic part, and semiconductor device

Interconnect structure and method for connecting buried signal lines to electrical devices

Semiconductor part for component mounting, mounting structure and mounting method

Module power distribution network

Spacer, printed circuit board, and electronic equipment

Shared via decoupling for area arrays components

Printed wiring board with wiring pattern having narrow width portion

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Colored conductive wires for a semiconductor package

UBM for fine pitch solder ball and flip-chip packaging method using the same

Low profile stacking system and method

Power supply connection structure to a semiconductor device

Pitch change and chip scale stacking system and method

Method of mounting electronic component on substrate without generation of voids in bonding material

Apparatuses and methods to route line to line

Thermally enhanced semiconductor package

System and method for delivering power to a semiconductor device

Process for soldering an electronic component on an electronic card, process for repairing the card and installation for using the process

Solder contact reworking using a flux plate and squeegee

Printed circuit boards having pads for solder balls and methods for the implementation thereof

Method for ball grid array chip packages having improved testing and stacking characteristics

Device package, a printed wiring board, and an electronic apparatus with efficiently spaced bottom electrodes including intervals between bottom electrodes of different lengths

Semiconductor package with improved solder joint reliability

Methods to prevent mechanical flexure related BGA failure

Support for an integrated circuit package having a column grid array interconnect

Wiring layout of auxiliary wiring package and printed circuit wiring board

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor device and method of manufacturing the same, circuit board and electronic device

Module assembly and method for stacked BGA packages

Mounting structure for semiconductor parts and semiconductor device

Mounting structure in integrated circuit module

Via heat sink material

Stair step printed circuit board structures for high speed signal transmissions

Test system with interconnect having conductive members and contacts on opposing sides

Method of RFIC die-package configuration

BGA package with component protection on bottom

RFIC die-package configuration

Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts

Constructing of an electronic assembly having a decoupling capacitor

Methods of fabricating a via-in-pad with off-center geometry

Depopulation of a ball grid array to allow via placement

Ball grid array package and method thereof

Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts

Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection

Mesh shaped dam mounted on a substrate

Optimization of routing layers and board space requirements for a ball grid array package

Optimization of routing layers and board space requirements for a ball grid array land pattern

Ball grid array package with external leads

Ball grid array (BGA) package having corner or edge tab supports

Low cost substrate for an integrated circuit device with bondpads free of plated gold

Method of using pre-applied underfill encapsulant

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Semiconductor device and method of fabricating the same

Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Method of establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate

Memory expansion and chip scale stacking system and method

Apparatus for providing an integrated printed circuit board registration coupon

Semiconductor integrated circuit and electronic apparatus having the same

Memory expansion and chip scale stacking system and method

Electrical circuit assembly with improved shock resistance

Expansion constrained die stack

Method and device to elongate a solder joint

Junction structure and junction method for conductive projection

Arrangement for improving module reliability

Method and system for forming ball grid array ("BGA") packages

Semiconductor package, electronic circuit device, and mounting method of semiconductor device

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Semiconductor device and method for production thereof

Integrated circuit stacking system and method

Integrated circuit stacking system

Integrated circuit stacking system

Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate

Apparatus and method for force mounting semiconductor packages to printed circuit boards