H05K2201/10946 - CPC Classification Index

ClassID:

234679 ⎘

H05K2201/10946 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads; Details of leads; Other details Leads attached onto leadless component after manufacturing the component

Recent Application in this class:

20250062592

2025-02-20

OPTICAL MODULE PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME

20240090131

2024-03-14

THERMAL MANAGEMENT FOR FLAT NO LEAD PACKAGES

20240090130

2024-03-14

LEADFRAME MOUNTING WITH LEAD INSERTION FOR LEAD WALL BONDING

20240040702

2024-02-01

POWER SEMICONDUCTOR DEVICE

20210051802

2021-02-18

Optical surface-mount devices

20190122823

2019-04-25

Multilayer electronic component and board having the same

20190090348

2019-03-21

High density multi-component packages

20190082539

2019-03-14

High density multi-component packages

20190006103

2019-01-03

Ceramic electronic component, method of producing the same, and electronic component mounting substrate

#10

20180374642

2018-12-27

Multilayer ceramic electronic component and mounting structure thereof

#11

20180374639

2018-12-27

Multilayer ceramic electronic component and mounting structure thereof

#12

20180268996

2018-09-20

Electronic component, board having the same, and method of manufacturing metal frame

#13

20170236643

2017-08-17

Electronic component having a connection element

#14

20170104410

2017-04-13

Power converter and method for manufacturing the same

#15

20160260546

2016-09-08

Electronic device

#16

20160212843

2016-07-21

Multilayer ceramic component and board having the same

#17

20160126015

2016-05-05

Multilayer ceramic component and board having the same

#18

20160118190

2016-04-28

Multilayer ceramic electronic component and board having the same

#19

20160086734

2016-03-24

Multilayer ceramic capacitor having terminal electrodes and board having the same

#20

20160086730

2016-03-24

Multilayer ceramic electronic component and board having the same

#21

20160042869

2016-02-11

Multilayer ceramic capacitor having terminal electrodes and board having the same

#22

20150131202

2015-05-14

Ceramic electronic component with metal terminal

#23

20140240942

2014-08-28

Electronic part and electronic control unit

#24

20140240941

2014-08-28

Electronic part and electronic control unit

#25

20140240885

2014-08-28

Electronic part and electronic control unit

#26

20140238732

2014-08-28

Electronic part and electronic control unit

#27

20140048925

2014-02-20

INTEGRATED CIRCUIT

#28

20130337697

2013-12-19

Adapter for plated through hole mounting of surface mount component

#29

20130271924

2013-10-17

System in package assembly

#30

20120262838

2012-10-18

Ceramic capacitor and electronic component including the same

#31

20120012365

2012-01-19

THERMAL FLEX CONTACT CARRIERS #2

#32

20110075386

2011-03-31

Electronic component, board unit, and information-processing device

#33

20110006718

2011-01-13

INVERTER DEVICE

#34

20100300742

2010-12-02

Substrate having leads

#35

20100193939

2010-08-05

Wiring substrate with a wire terminal

#36

20100188798

2010-07-29

Multilayer capacitor and method of manufacturing same

#37

20100167560

2010-07-01

Area array adapter

#38

20100136745

2010-06-03

POP PACKAGE AND METHOD OF FABRICATING THE SAME

#39

20100123995

2010-05-20

Ceramic capacitor and electronic component including the same

#40

20100090792

2010-04-15

THERMALLY DECOUPLING FUSE HOLDER AND ASSEMBLY

#41

20100053842

2010-03-04

Stacked multilayer capacitor

#42

20100027228

2010-02-04

Semiconductor device and method for manufacturing the same

#43

20090291573

2009-11-26

Probe card assembly and kit, and methods of making same

#44

20090246984

2009-10-01

Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments

#45

20090102041

2009-04-23

Electrical connection device and assembly method thereof

#46

20090091899

2009-04-09

Circuit device

#47

20090051446

2009-02-26

Ovenized oscillator

#48

20090047804

2009-02-19

SURFACE-MOUNT CONNECTOR AND CIRCUIT BOARD ASSEMBLY INTERCONNECTED BY SAME

#49

20090032915

2009-02-05

TFCC (TM) and SWCC (TM) thermal flex contact carriers

#50

20080291602

2008-11-27

STACKED MULTILAYER CAPACITOR

#51

20080239621

2008-10-02

Clip-on leadframe

#52

20080231305

2008-09-25

Contact carriers (tiles) for populating larger substrates with spring contacts

#53

20080207018

2008-08-28

Contact lead

#54

20080180121

2008-07-31

Probe card assembly and kit

#55

20080158842

2008-07-03

STRESS AND COLLAPSE RESISTANT INTERCONNECT FOR MOUNTING AN INTEGRATED CIRCUIT PACKAGE TO A SUBSTRATE

#56

20080153363

2008-06-26

Electrical terminal

#57

20080142944

2008-06-19

Stacked package and method for manufacturing the package

#58

20080106877

2008-05-08

Method for manufacturing leads

#59

20080054437

2008-03-06

POP package and method of fabricating the same

#60

20080032517

2008-02-07

Method and apparatus for compliantly connecting stack of high-density electronic modules in harsh environments

#61

20070285114

2007-12-13

Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component

#62