H05K2201/10954 - CPC Classification Index

ClassID:

234680 ⎘

H05K2201/10954 - CPC Classification

Classification description:

Indexing scheme relating to printed circuits covered by; Details of components or other objects attached to or integrated in a printed circuit board; Details of electrical connections of non-printed components, e.g. special leads Other details of electrical connections

Sub-classes:

H05K2201/10962 » Component not directly connected to the PCB 163
H05K2201/10962 » Component not directly connected to the PCB 163
H05K2201/10969 » Metallic case or integral heatsink of component electrically connected to a pad on PCB 198
H05K2201/10969 » Metallic case or integral heatsink of component electrically connected to a pad on PCB 198
H05K2201/10977 » Encapsulated connections 679
H05K2201/10977 » Encapsulated connections 679
H05K2201/10984 » Component carrying a connection agent, e.g. solder, adhesive 218
H05K2201/10984 » Component carrying a connection agent, e.g. solder, adhesive 218
H05K2201/10992 » Using different connection materials, e.g. different solders, for the same connection 92
H05K2201/10992 » Using different connection materials, e.g. different solders, for the same connection 92

Recent Application in this class:

20260156751

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SAME

20260068053

MAGNETIC ELECTRONIC COMPONENT AND HAND-MADE CIRCUIT KIT

20250024600

INTERCONNEXION FILM AND ELECTRONIC STRUCTURE COMPRISING SUCH A FILM

20230240011

Electronic assembly

20220322538

Fluid ejection controllers to pivotally hold firing boards

20220201865

ELECTRIC COMPONENT

20210127493

Supporting-terminal-equipped capacitor chip and mounted structure thereof

20200064395

Shape conformable capacitive coupler

20190280417

Electrical connector

20190150334

Fine pitch component placement on printed circuit boards

20180063970

Display device

20170127517

Printed wiring board and method for manufacturing the same

20160128193

Systems, methods and devices for inter-substrate coupling

20160128192

Systems, methods and devices for inter-substrate coupling

20150351256

Method of forming a printed circuit board assembly

20150351242

Assembly of printed circuit boards

20150313042

OPTIMUM POWER INTERFACE BOARD POWER PERFORMANCE BY SERVER OR STORAGE SYSTEM

20150208508

Contact bump connection and contact bump and method for producing a contact bump connection

20150163897

Electrical connector

20150062834

Jumper module mounting circuit board and circuit board assembly

20150049443

CHIP ARRANGEMENT

20140346680

Forming of an electric connection of the via type

20140084460

Contact bumps methods of making contact bumps

14176494

Apparatus having self healing liquid phase power connects and method thereof