POWER MODULE

ELECTRONIC DEVICE

METHOD OF MANUFACTURING MULTICORE CABLE AND MULTICORE CABLE

ELECTRONIC DEVICE

POWER MODULE

MEMORY MODULE AND ELECTRONIC DEVICE

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

MICRO CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTILAYER ELECTRONIC COMPONENT

INFORMATION HANDLING SYSTEM DUAL LAYER MODULAR PRINTED CIRCUIT BOARD INTERPOSER

MANUFACTURING METHOD OF POWER MODULE

CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

COMPONENT CARRIER

ILLUMINATED SIGNAGE AND BADGES

TERMINAL STRUCTURE AND WIRING SUBSTRATE

ELECTRICALLY COUPLING PRINTED CIRCUIT BOARDS USING A SNAP-FIT CONNECTOR

DISPLAY DEVICE

SEMICONDUCTOR STORAGE DEVICE

CIRCUIT BOARD WITH ALTERNATE COMPONENT INTEGRATION CAPABILITY

Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces

VARYING DIAMETERS OF POWER-VIAS IN A PCB BASED ON VIA LOCATION

Fastener and sealant

RECHARGEABLE BATTERY PACK

PCB LAND PAD FOR THREE-PIN MOSFET COMPONENT

ELECTRICAL EQUIPMENT

PRINTED CIRCUIT BOARD OVER PRINTED CIRCUIT BOARD ASSEMBLY

Circuit board, electronic device, and production method for circuit board

PRINTED CIRCUIT BOARD GROUNDING

POWER MODULE AND APPARATUS

ELECTRONIC ASSEMBLY WITH ELECTROMAGNETIC SHIELDING

OPTICAL DEVICE, CAMERA, AND CIRCUIT MODULE

Touchpad assembly

FILLING CRACKS ON A SUBSTRATE VIA

Printed circuit board including bonding layer, having conductive particles, disposed between core portions

CIRCUIT MODULE AND SUBSTRATE MODULE

Apparatus and power module

Circuit Board Assembly and Radio Unit Comprising the Same

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD, METHOD FOR MANUFACTURING CIRCUIT BOARD, AND ELECTRONIC DEVICE

Printed circuit board including an insulating layer and a metal post

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

ASSEMBLING METHOD OF ELECTRONIC MODULE

Printed circuit board configuration blocks and edge projections

NETWORK COMMUNICATION DEVICE HAVING ELECTROMAGNETIC SHIELDING FUNCTION

Circuit board and method for manufacturing thereof

CONNECTION ASSEMBLY, BOARD-LEVEL ARCHITECTURE, AND COMPUTING DEVICE

CONNECTION ELEMENT FOR ELECTRICALLY CONNECTING TWO CIRCUIT CARRIERS

BOARD-LEVEL STRUCTURE AND COMMUNICATION DEVICE

ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

Camera module

ELECTRONIC DEVICE CAPABLE OF SUPPRESSING HIGH GROUND IMPEDANCE, AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Radio frequency front-end module, manufacturing method thereof and communication device

Connection structure and connection structure manufacturing method

WIRING MODULE

Power system

Separable interface cable structure for high voltage under-module power input

Printed circuit board

Electronic device including thermosetting bonding sheet

Substrate structure

Electrical Components Attached to Fabric

HYBRID CIRCUIT BOARD AND BATTERY PACK HAVING SAME

Power module

VOLTAGE CONVERTER AND METHOD FOR MANUFACTURING A VOLTAGE CONVERTER

Board-to-board connecting structure and method for manufacturing the same

Process for manufacturing a roll of flexible carrier for electronic components

DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARDS FOR ELECTRICAL AND/OR ELECTRONIC CIRCUITS

Electrical components attached to fabric

Printed wiring board and method for manufacturing the same

Radio frequency module

Electronic component mounting substrate and manufacturing method thereof

LOCKING SOLDER BUSH

Electrical components attached to fabric

LED flexible light bar

FLEXIBLE SUBSTRATE AND FLEXIBLE PANEL

Multilayered transient liquid phase bonding

Transient liquid phase material bonding and sealing structures and methods of forming same

Electrical components attached to fabric

Printed circuit board, air conditioner, and method for manufacturing printed circuit board

Substrate, display panel and fabrication method thereof, and spliced screen

Electrical connector

Embedding component with pre-connected pillar in component carrier

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Electrical connector having solder posts with heights greater than maximum widths thereof

Chip component having groove formed therein

Method for bonding discrete devices using anisotropic conductive film

Electrical connector

Electronic component embedded substrate

Connection body, method for manufacturing connection body, and method for inspecting same

Electrical connector with terminals made from soldering balls

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Devices and methods for solder flow control in three-dimensional microstructures

Head mounted computing device, adhesive joint system and method

Electronic device

Wiring board

Circuit substrate and method for manufacturing the same

Printed circuit board

Chip-component structure

LOW-PROFILE PACKAGE WITH PASSIVE DEVICE

Structure mounted with electronic component

Electronic component housing container and electronic device

Methods for manufacturing a Z-directed printed circuit board component having a removable end portion

SUSPENSION BOARD WITH CIRCUIT

Electronic component-embedded module and communication terminal device

Continuous extrusion method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board

Method and system for attaching flexible circuits to a mounting surface

Devices and methods for solder flow control in three-dimensional microstructures

Z-directed capacitor components for printed circuit boards

Module and method of manufacturing the same

Z-directed delay line components for printed circuit boards

Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR

Process for manufacturing a Z-directed component for a printed circuit board using a sacrificial constraining material

Chip-component structure

Planar contact with solder

Z-directed printed circuit board components having conductive channels for reducing radiated emissions

LED device with structure for precisely locating LEDs thereon and method for manufacturing the same

Connecting contact

Electrical interconnects in an electronic contact lens

Continuous extrusion process for manufacturing a Z-directed component for a printed circuit board

Circuit board and process for producing the same

Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

Z-DIRECTED CAPACITOR COMPONENTS FOR PRINTED CIRCUIT BOARDS

Terminal assembly with regions of differing solderability

SYSTEMS FOR SURFACE MOUNTING AN INTEGRATED CIRCUIT USING A Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENT

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE

Z-directed pass-through components for printed circuit boards

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Mounting component, electronic device, and mounting method

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Electronic component, board unit, and information-processing device

ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC EQUIPMENT

Surface mount contact

LOWER PROFILE ELECTRICAL CONTACT AND ELECTRICAL SOCKET USING THE SAME

Coreless packaging substrate and method for fabricating the same

Z-directed filter components for printed circuit boards

Z-directed pass-through components for printed circuit boards

Z-directed delay line components for printed circuit boards

Z-Directed Switch Components for Printed Circuit Boards

Z-directed variable value components for printed circuit boards

Z-directed connector components for printed circuit boards

Z-Directed Ferrite Bead Components for Printed Circuit Boards

Z-directed capacitor components for printed circuit boards

Z-Directed Components for Printed Circuit Boards

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Low profile socket connector

Solder attached contact and a method of manufacturing the same

Semiconductor device

Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint

Terminal assembly with regions of differing solderability

Planar contact with solder

Electrical contact having improved soldering section of high compliance

Solder-bearing articles and method of retaining a solder mass along a side edge thereof

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME

Component having a mechanical contact and method for producing the component

Non-pull back pad package with an additional solder standoff

Alignment plate

Alignment plate

Circuit board and process for producing the same

Component with bonding adhesive

Mounting structure of electronic component

Surface Mount Array Connector Leads Planarization Using Solder Reflow Method

Electrical contact with retaining device for clipping solder ball

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

ELECTRICAL CONNECTOR AND ELECTRICAL CONNECTING DEVICE USING THE SAME

Electronic component mounting system, electronic component placing apparatus, and electronic component mounting method

RECOVERABLE ELECTRONIC COMPONENT

Method of manufacturing an electronic component and an electronic device

Fine pitch electrical interconnect assembly

Connector applied underfill

Electrical terminal

Electrical terminal

Use of palladium in IC manufacturing with conductive polymer bump

Method of attaching a solder element to contact and the contact assembly formed thereby

Non-pull back pad package with an additional solder standoff

Solder-bearing contacts and method of manufacture thereof and use in connectors

Electrical connector

Electrical connector

IC contact for LGA socket

Method for forming electrical contacts on an electrical connector

System and method of attaching an integrated circuit assembly to a printed wiring board

Increased interconnect density electronic package and method of fabrication

Electrical connector and terminal thereof

Mounting method of passive component

Lead(Pb)-free electronic component attachment

Electrical connector with stepped housing

Alignment plate

Alignment plate

Integrated circuit package having metallic members intruding into solder balls

Electrical contacts having solder stops

Method for manufacturing a printed circuit board for electronic devices and an electronic device using the same

High density power connector with impedance control

Conductive terminal and the electrical connector using the conductive terminal

Contact terminal structure

Contact terminal structure

Method and apparatus for soldering modules to substrates

Electronic component and electronic configuration

Method for repair soldering of multi-pole miniature plug connectors

Methods for packing microfeature devices and microfeature devices formed by such methods

Electrical contacts having solder stops

Method for making a wound capacitor

Ball grid array contacts with spring action

Conductive terminal and the electrical connector using the conductive terminal

Conductive terminal and the electrical connector using the conductive terminal

Electrical connector with a solder ball locking structure

Method of retaining a solder mass on an article

Methods for packaging microfeature devices and microfeature devices formed by such methods

Electrical connector with a solder ball locking structure

Semiconductor package having a grid array of pin-attached balls

Electronic component mounted structure and optical transceiver using the same

Method for attaching an IC socket connector to a circuit board

Electrical contact pin carrying a charge of solder and process for producing it

Connector having improved contacts with fusible members

Connector having improved contacts with fusible members

Connector having improved contacts with fusible members

Method of connecting a contact with a solder and an electronic device using the method

Connector having improved contacts with fusible members

Connector having improved contacts with fusible members

Connector having improved contacts with fusible members

Method for attaching a shield can to a PCB and a shield can therefor

Method for securing electronic components to a substrate

Solder ball formation structure for a terminal socket

Electrically conductive wire

Use of palladium in IC manufacturing with conductive polymer bump

Electronic card connector

Method of surface mounting a semiconductor device

Electrical connector and contact

Wound capacitor

Solder-bearing contacts and method of manufacture thereof and use in connectors

Use of palladium in IC manufacturing with conductive polymer bump

Connector with solder-bearing contact

Solder bearing conductive terminal

Electrical components attached to fabric

Fabric-based items with fusible insulating strands