ELECTRONIC PACKAGE AND METHOD FOR FORMING THE SAME

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS OF USING THE SAME

Leadframe package with pre-applied filler material

Chip assemblies

Connecting electronic components to mounting substrates

Semiconductor package module

Embedding component with pre-connected pillar in component carrier

Electronic component, diaphragm, and electronic device

Mounting structure and method for manufacturing same

Leadframe package with pre-applied filler material

Electronic package assembly

Leadframe package with pre-applied filler material

Layered solder material for bonding different species of electrodes and method of bonding the different species of electrodes in an electronic component

PRINTED CIRCUIT BOARD

Dual solder layer for fluidic self assembly and electrical component substrate and method employing same

Electronic component housing container and electronic device

Solder piece, chip solder and method of fabricating solder piece

Mounting structure and method for manufacturing same

Electronic component module

Solder piece, chip solder and method of fabricating solder piece

Flip-chip Mounting Structure and Flip-chip Mounting Method

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS

Selective application by electroless plating of a tin-whisker impenetrable metal cap to metals on electronic assemblies

ELECTRICAL CONNECTION AND METHOD FOR MAKING THE SAME

Electronic device, interposer and method of manufacturing electronic device

CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE

Soldering material and electronic component assembly

ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME

Semiconductor device mounted structure and its manufacturing method

SOLDER JOINT STRUCTURE, ELECTRONIC DEVICE USING THE SAME, AND SOLDER BONDING METHOD

Electronic component mounting structure, electronic component mounting method, and electronic component mounting board

Semiconductor device with an improved solder joint

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME

Semiconductor device with an improved solder joint

PRINTED WIRING BOARD, MANUFACTURING METHOD FOR PRINTED WIRING BOARD AND ELECTRONIC DEVICE

Semiconductor device and manufacturing method therefor

Low profile solder grid array technology for printed circuit board surface mount components

ATTACHING A LEAD-FREE COMPONENT TO A PRINTED CIRCUIT BOARD UNDER LEAD-BASED ASSEMBLY CONDITIONS

Printed circuit board comprising semiconductor chip and method of manufacturing the same

Solder Mounting Structure, Method for Manufacturing Such Solder Mounting Structure and Use of Such Solder Mounting Structure

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Flip-chip package structure, and the substrate and the chip thereof

Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure

Integrated circuit package system with mounting features for clearance

TEMPORARY CHIP ATTACH USING INJECTION MOLDED SOLDER

Semiconductor device and manufacturing method of the semiconductor device

CONDUCTIVE BALL-OR PIN-MOUNTED SEMICONDUCTOR PACKAGING SUBSTRATE, METHOD FOR MANUFACTURING THE SAME AND CONDUCTIVE BONDING MATERIAL

SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD

Materials for use with interconnects of electrical devices and related methods

Soldering an electronics package to a motherboard

Paste for soldering and soldering method using the same

Touch screen system and display device using the same

Temporary chip attach using injection molded solder

Printed circuit board minimizing undesirable signal reflections in a via and methods therefor

Structure of circuit board

Solder ball assembly for a semiconductor device and method of fabricating same

Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

Semiconductor device with an improved solder joint

Method for forming multi-layer bumps on a substrate

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Apparatus for solder crack deflection

Ball grid array package

Method and apparatus for attaching solder balls to substrate

Method for forming multi-layer bumps on a substrate

Integrated circuit package system including high-density small footprint system-in-package

Method for fabricating a chip module and a device module fabricated therefrom

Ternary alloy column grid array

Semiconductor package repair method

Semiconductor device and unit equipped with the same

Solder interconnect structure and method using injection molded solder

Socket grid array

Wiring board with semiconductor component

Doped contact formations

Structure and method to gain substantial reliability improvements in lead-free BGAs assembled with lead-bearing solders

Low temperature PB-free processing for semiconductor devices

Semiconductor attachment method

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method thereof

Methods of forming vias in multilayer substrates

Soldering an electronics package to a motherboard

Package structure with two solder arrays

Two solder array structure with two high melting solder joints

Method of semiconductor device assembly including fatigue-resistant ternary solder alloy

Circuit carrier

Socket grid array

Solder joint structure and method for soldering electronic components

Method of interconnecting die and substrate

Method for producing a semiconductor device in chip format

Ball grid array package

Electronic package having controlled height stand-off solder joint

Apparatus with electrical components end mounted to printed circuit board