Patents-Review.com
ClassID:

234744 ⎘

H05K2203/0369 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Metal processing Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist

Recent Application in this class:
#1
20250365870
2025-11-27

TRANSFER LAMINATE AND MANUFACTURING METHOD THEREFOR

 #2
20250365869
2025-11-27

METHOD FOR MANUFACTURING MULTILAYER SUBSTRATE

 #3
20250351268
2025-11-13

Component Carrier, Method and Apparatus for Manufacturing the Component Carrier

 #4
20250287509
2025-09-11

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE

 #5
20250151203
2025-05-08

METHOD FOR PRODUCING TRANSMISSION SUBSTRATE

 #6
20250063651
2025-02-20

PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

 #7
20240155778
2024-05-09

WIRING SUBSTRATE

 #8
20240107685
2024-03-28

PRINTED WIRING BOARD

 #9
20240023234
2024-01-18

CIRCUIT PATTERN, SEMI-FINISHED BASE MATERIAL FOR CIRCUIT SUBSTRATE, METAL-BASED CIRCUIT SUBSTRATE, PRODUCTION METHOD FOR CIRCUIT PATTERN, AND PRODUCTION DEVICE FOR CIRCUIT PATTERN

 #10
20220295641
2022-09-15

Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method

 #11
20190281703
2019-09-12

Manufacturing method of circuit board

 #12
20190172782
2019-06-06

PACKAGING SUBSTRATE FOR SEMICONDUCTOR DEVICES, CORRESPONDING DEVICE AND METHOD

 #13
20190019774
2019-01-17

Methods of fluxless micro-piercing of solder balls, and resulting devices

 #14
20180376599
2018-12-27

Piezochromic stamp

 #15
20180310406
2018-10-25

Method for making a circuit board

 #16
20170273191
2017-09-21

Manufacturing method of circuit board and stamp

 #17
20170273190
2017-09-21

Manufacturing method of circuit board

 #18
20170273189
2017-09-21

Manufacturing method of circuit board

 #19
20170273186
2017-09-21

Manufacturing method of circuit board

 #20
20170223841
2017-08-03

Carrier substrate

 #21
20170127528
2017-05-04

Method for manufacturing flexible printed circuit board (FPCB) and apparatus for manufacturing FPCB

 #22
20160128176
2016-05-05

Multilayer circuit board

 #23
20160044792
2016-02-11

Method of manufacturing a wiring substrate

 #24
20150382472
2015-12-31

Printed circuit board and manufacturing method thereof

 #25
20150289380
2015-10-08

Method of fabricating a wiring board

 #26
20150282314
2015-10-01

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

 #27
20150237717
2015-08-20

Package substrate and structure

 #28
20150101848
2015-04-16

SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME

 #29
20150027977
2015-01-29

METHOD OF MANUFACTURING WIRING BOARD

 #30
20150008577
2015-01-08

Methods of fluxless micro-piercing of solder balls, and resulting devices

 #31
20140332252
2014-11-13

Carrier substrate and manufacturing method thereof

 #32
20140226346
2014-08-14

Wiring board and light emitting device

 #33
20140102770
2014-04-17

Core substrate, manufacturing method thereof, and structure for metal via

 #34
20140090879
2014-04-03

Embedded architecture using resin coated copper

 #35
20130233605
2013-09-12

Solid electrolytic capacitor and circuit board having the same

 #36
20130134127
2013-05-30

Method of fabricating a wiring board

 #37
20130118782
2013-05-16

Radiant heat circuit board and method for manufacturing the same

 #38
20130075145
2013-03-28

Wiring substrate and method of manufacturing the same

 #39
20130068510
2013-03-21

Method of manufacturing printed circuit board having vias and fine circuit and printed circuit board manufactured using the same

 #40
20120211465
2012-08-23

Flex-rigid printed wiring board and manufacturing method thereof

 #41
20120211269
2012-08-23

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

 #42
20120193324
2012-08-02

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

 #43
20120181066
2012-07-19

PACKAGE CARRIER

 #44
20120180313
2012-07-19

Manufacturing method for printed wiring board

 #45
20120175157
2012-07-12

Wiring board and method of producing the same

 #46
20120174391
2012-07-12

Process for fabricating wiring board

 #47
20120151764
2012-06-21

Method for manufacturing printed wiring board

 #48
20120103931
2012-05-03

METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD

 #49
20120067630
2012-03-22

Circuit structure of circuit board

 #50
20120064672
2012-03-15

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding

 #51
20120000697
2012-01-05

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

 #52
20110304016
2011-12-15

Wiring board, method of manufacturing the same, and semiconductor device

 #53
20110296682
2011-12-08

Method of manufacturing multilayer printed wiring board

 #54
20110287563
2011-11-24

Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader

 #55
20110278638
2011-11-17

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/DIELECTRIC/POST HEAT SPREADER

 #56
20110275180
2011-11-10

Method of making a semiconductor chip assembly with a post/base heat spreader with a thermal via

 #57
20110256671
2011-10-20

SEMICONDUCTOR MEMORY MODULE WITH REVERSE MOUNTED CHIP RESISTOR

 #58
20110227122
2011-09-22

Semiconductor chip assembly with post/base heat spreader with thermal via

 #59
20110201157
2011-08-18

Method of making a semiconductor chip assembly with a post/base heat spreader and a mulitlevel conductive trace

 #60
20110198662
2011-08-18

Semiconductor chip assembly with post/base heat spreader and multilevel conductive trace

 #61
20110198114
2011-08-18

Multilayer wiring substrate, and method of manufacturing the same

 #62
20110198112
2011-08-18

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

 #63
20110183472
2011-07-28

Method of making a semiconductor chip assembly with a post/base heat spreader and a plated through-hole

 #64
20110175136
2011-07-21

Semiconductor chip assembly with post/base heat spreader and plated through-hole

 #65
20110156272
2011-06-30

Multilayered wiring substrate

 #66
20110156090
2011-06-30

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/POST HEAT SPREADER AND ASYMMETRIC POSTS

 #67
20110151626
2011-06-23

Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts

 #68
20110132651
2011-06-09

Method of manufacturing a circuit board

 #69
20110122481
2011-05-26

Integrated device and manufacturing method

 #70
20110104856
2011-05-05

Method of making a semiconductor chip assembly with a post/base/post heat spreader

 #71
20110101410
2011-05-05

Semiconductor chip assembly with post/base/post heat spreader

 #72
20110092083
2011-04-21

Out of plane integral conductive arms and methods for manufacturing the same

 #73
20110089465
2011-04-21

Semiconductor chip assembly with post/base heat spreader with ESD protection layer

 #74
20110079814
2011-04-07

LIGHT EMITTED DIODE SUBSTRATE AND METHOD FOR PRODUCING THE SAME

 #75
20110074021
2011-03-31

DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE

 #76
20110048785
2011-03-03

Wired circuit board and producing method thereof

 #77
20110027945
2011-02-03

Method for producing substrate for mounting device and method for producing a semiconductor module

 #78
20110016709
2011-01-27

Manufacturing method for printed wiring board

 #79
20110003437
2011-01-06

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLANGE HEAT SPREADER AND A CAVITY IN THE FLANGE

 #80
20100327310
2010-12-30

Semiconductor chip assembly with post/base/flange heat spreader and cavity in flange

 #81
20100264541
2010-10-21

Methods of fluxless micro-piercing of solder balls, and resulting devices

 #82
20100261348
2010-10-14

Method for fabricating semiconductor package substrate having different thicknesses between wire bonding pad and ball pad

 #83
20100230689
2010-09-16

Metal core multi-LED SMD package and method of producing the same

 #84
20100221414
2010-09-02

METHOD FOR MANUFACTURING PRINTED WIRING BOARD

 #85
20100218986
2010-09-02

Method for manufacturing printed wiring board and printed wiring board

 #86
20100218983
2010-09-02

Printed wiring board

 #87
20100218980
2010-09-02

Printed wiring board

 #88
20100212946
2010-08-26

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

 #89
20100208437
2010-08-19

Multilayer wiring substrate and method for manufacturing the same

 #90
20100203679
2010-08-12

Method of making a semiconductor chip assembly with a post/base heat spreader and a cavity over the post

 #91
20100193225
2010-08-05

Circuit board, method of manufacturing the same, and resistance element

 #92
20100181594
2010-07-22

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY OVER POST

 #93
20100167438
2010-07-01

Method of making a semiconductor chip assembly with an aluminum post/base heat spreader and a silver/copper conductive trace

 #94
20100167436
2010-07-01

Method of making a semiconductor chip assembly with a post/base heat spreader and a signal post

 #95
20100163921
2010-07-01

Semiconductor chip assembly with aluminum post/base heat spreader and silver/copper conductive trace

 #96
20100147560
2010-06-17

Wiring board and method of manufacturing the same

 #97
20100132997
2010-06-03

MULTILAYER WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

 #98
20100132995
2010-06-03

Wiring board and method of producing the same

 #99
20100122842
2010-05-20

Printed circuit board and manufacturing method thereof

 #100
20100096662
2010-04-22

Semiconductor chip assembly with post/base heat spreader and signal post

 #101
20100087020
2010-04-08

Method of making a semiconductor chip assembly with a copper/aluminum post/base heat spreader

 #102
20100084163
2010-04-08

WIRING BOARD AND METHOD OF FABRICATING THE SAME

 #103
20100075448
2010-03-25

Method of making a semiconductor chip assembly with a post/base/cap heat spreader

 #104
20100072511
2010-03-25

SEMICONDUCTOR CHIP ASSEMBLY WITH COPPER/ALUMINUM POST/BASE HEAT SPREADER

 #105
20100072510
2010-03-25

Semiconductor chip assembly with post/base/cap heat spreader

 #106
20100071944
2010-03-25

CHIP CAPACITOR EMBEDDED PWB

 #107
20100065319
2010-03-18

Wiring board and process for fabricating the same

 #108
20100059786
2010-03-11

Semiconductor chip assembly with post/base heat spreader and substrate

 #109
20100059256
2010-03-11

Method of making a circuit structure of a circuit board

 #110
20100055812
2010-03-04

Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace

 #111
20100055811
2010-03-04

Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate

 #112
20100052005
2010-03-04

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CONDUCTIVE TRACE

 #113
20100051325
2010-03-04

Flex-rigid printed wiring board and manufacturing method thereof

 #114
20100033875
2010-02-11

Suspension board with circuit

 #115
20100025085
2010-02-04

ELECTRONIC APPARATUS, FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD

 #116
20100024212
2010-02-04

Method of fabricating multilayer printed circuit board

 #117
20100012360
2010-01-21

Metal core circuit element mounting board

 #118
20100003788
2010-01-07

Method of making a semiconductor chip assembly with a post/base heat spreader and vertical signal routing

 #119
20100003787
2010-01-07

Method of making a semiconductor chip assembly with a post/base heat spreader and horizontal signal routing

 #120
20100001395
2010-01-07

Semiconductor chip assembly with post/base heat spreader and vertical signal routing

 #121
20100001309
2010-01-07

Semiconductor chip assembly with post/base heat spreader and horizontal signal routing

 #122
20090304910
2009-12-10

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

 #123
20090289360
2009-11-26

WORKPIECE CONTACT PADS WITH ELEVATED RING FOR RESTRICTING HORIZONTAL MOVEMENT OF TERMINALS OF IC DURING PRESSING

 #124
20090265928
2009-10-29

Circuit board and manufacturing method thereof

 #125
20090218125
2009-09-03

Multilayer printed wiring board and method of manufacturing multilayer printed wiring board

 #126
20090212007
2009-08-27

SURFACE TREATMENT METHOD

 #127
20090205852
2009-08-20

Circuit board and manufacturing method thereof

 #128
20090197364
2009-08-06

Method of fabricating substrate

 #129
20090178828
2009-07-16

Heat dissipating wiring board and method for manufacturing same

 #130
20090168391
2009-07-02

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

 #131
20090156020
2009-06-18

Electrical connector having a connect portion connecting two contact portions having projections and a drainage at least partially between the projections

 #132
20090152719
2009-06-18

Methods of fluxless micro-piercing of solder balls, and resulting devices

 #133
20090151995
2009-06-18

Package for semiconductor device and method of manufacturing the same

 #134
20090139086
2009-06-04

METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD

 #135
20090134530
2009-05-28

WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

 #136
20090119915
2009-05-14

Method for manufacturing circuit device

 #137
20090115036
2009-05-07

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

 #138
20090102050
2009-04-23

SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATE

 #139
20090093110
2009-04-09

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

 #140
20090085207
2009-04-02

Ball grid array substrate package and solder pad

 #141
20090081861
2009-03-26

Manufacturing method of solder ball disposing surface structure of package substrate

 #142
20090081596
2009-03-26

Metal photoetching product and production method thereof

 #143
20090071699
2009-03-19

PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

 #144
20090056119
2009-03-05

Method of fabricating multilayer printed circuit board

 #145
20090008137
2009-01-08

Wired circuit board and producing method thererof

 #146
20080303146
2008-12-11

Process for manufacturing substrate with bumps and substrate structure

 #147
20080265391
2008-10-30

Etched interposer for integrated circuit devices

 #148
20080257590
2008-10-23

HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF

 #149
20080251896
2008-10-16

Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same

 #150
20080246146
2008-10-09

Wiring substrate and wiring substrate manufacturing method

 #151
20080223820
2008-09-18

METHOD FOR FORMING MINIATURE WIRES

 #152
20080136033
2008-06-12

Packaging board and manufacturing method therefor, semiconductor module and mobile apparatus

 #153
20080123299
2008-05-29

Circuit Device and Manufacturing Method of the Same

 #154
20080106876
2008-05-08

Semiconductor memory module with reverse mounted chip resistor

 #155
20080106875
2008-05-08

Circuit device and method of manufacturing the same

 #156
20080076249
2008-03-27

Method of manufacturing semiconductor device

 #157
20080020132
2008-01-24

Substrate having stiffener fabrication method

 #158
20080014409
2008-01-17

Method of making a circuitized substrate

 #159
20080003402
2008-01-03

Fine pitch microcontacts and method for forming thereof

 #160
20070272654
2007-11-29

Method for Manufacturing Circuit Board

 #161
20070257338
2007-11-08

Method of manufacturing a coaxial trace in a surrounding material, coaxial trace formed thereby, and semiconducting material containing same

 #162
20070252270
2007-11-01

Circuit Apparatus

 #163
20070230078
2007-10-04

Circuit device

 #164
20070209199
2007-09-13

Methods of making microelectronic assemblies

 #165
20070144769
2007-06-28

Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrate

 #166
20070126093
2007-06-07

High thermal conducting circuit substrate and manufacturing process thereof

 #167
20070107930
2007-05-17

Printed circuit board and method for manufacturing the same

 #168
20070102396
2007-05-10

Method of making a circuitized substrate

 #169
20070090086
2007-04-26

Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring board

 #170
20070081297
2007-04-12

Method of manufacturing thin film capacitor and printed circuit board having thin film capacitor embedded therein

 #171
20070077687
2007-04-05

METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS

 #172
20070070613
2007-03-29

Method of manufacturing high density printed circuit boad

 #173
20070069360
2007-03-29

Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same

 #174
20070042585
2007-02-22

Method of forming metal plate pattern and circuit board

 #175
20070034401
2007-02-15

Circuit board and manufacturing method thereof

 #176
20070017090
2007-01-25

Method of forming metal plate pattern and circuit board

 #177
20060258139
2006-11-16

Manufacturing method for wiring circuit substrate

 #178
20060221586
2006-10-05

Packaging substrate having adhesive-overflowing prevention structure

 #179
20060220242
2006-10-05

Method for producing flexible printed wiring board, and flexible printed wiring board

 #180
20060200958
2006-09-14

Method of manufacture of ceramic composite wiring structures for semiconductor devices

 #181
20060145343
2006-07-06

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

 #182
20060145340
2006-07-06

Structure of substrate

 #183
20060127690
2006-06-15

Metal photoetching product and production method thereof

 #184
20060118830
2006-06-08

MSD raised metal interface features

 #185
20060113658
2006-06-01

Substrate core

 #186
20060097368
2006-05-11

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

 #187
20060070978
2006-04-06

Method for manufacturing a bump-attached wiring circuit board

 #188
20060068577
2006-03-30

Method for fabricating electrical interconnect structure

 #189
20060065439
2006-03-30

Wiring board and wiring board manufacturing method

 #190
20060062979
2006-03-23

Circuit board and a power module employing the same

 #191
20060049518
2006-03-09

Semiconductor device and method for manufacturing the same

 #192
20060038303
2006-02-23

Etched interposer for integrated circuit devices

 #193
20060024862
2006-02-02

Method of manufacturing circuit device

 #194
20060022020
2006-02-02

Method for the production of a metal-ceramic substrate, preferably a copper ceramic substrate

 #195
20060001166
2006-01-05

Circuit device and manufacturing method thereof

 #196
20050263911
2005-12-01

Circuit device and manufacturing method thereof

 #197
20050263905
2005-12-01

Method for manufacturing circuit device

 #198
20050263895
2005-12-01

Circuit device and manufacturing method thereof

 #199
20050263846
2005-12-01

Circuit device with dummy elements

 #200
20050263482
2005-12-01

Method of manufacturing circuit device

 #201
20050263320
2005-12-01

Circuit device and manufacturing method thereof

 #202
20050214981
2005-09-29

Circuit device and manufacturing method thereof

 #203
20050212107
2005-09-29

Circuit device and manufacturing method thereof

 #204
20050205524
2005-09-22

Method of manufacturing tape wiring substrate

 #205
20050167829
2005-08-04

Partially etched dielectric film with conductive features

 #206
20050161804
2005-07-28

Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate

 #207
20050155789
2005-07-21

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

 #208
20050142917
2005-06-30

Electrically insulating body, and electronic device

 #209
20050124096
2005-06-09

Manufacturing methods for printed circuit boards

 #210
20050124091
2005-06-09

Process for making circuit board or lead frame

 #211
20050121800
2005-06-09

Membrane probe with anchored elements

 #212
20050104205
2005-05-19

Encapsulated lead having step configuration

 #213
20050104198
2005-05-19

Circuit device and manufacturing method thereof

 #214
20050101136
2005-05-12

Etching method and method of manufacturing circuit device using the same

 #215
14970165
2017-02-07

Security mesh and method of making