H05K2203/0545 - CPC Classification Index

ClassID:

234784 ⎘

H05K2203/0545 - CPC Classification

Classification description:

Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by; Patterning and lithography; Masks; Details of resist; Patterning and lithography Pattern for applying drops or paste; Applying a pattern made of drops or paste

Recent Application in this class:

20230113966

2023-04-13

ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT

20210032489

2021-02-04

Patterning paste

20180290170

2018-10-11

Method of calibrating a dispenser

20180036762

2018-02-08

Method of calibrating a dispenser

20170151916

2017-06-01

Vehicular panel and wiring structure for vehicle

20170136779

2017-05-18

Method of aerosol printing a solder mask ink composition

20170013723

2017-01-12

Etch-resistant inkjet inks for manufacturing conductive patterns

20160280969

2016-09-29

Method for manufacturing electrically conductive adhesive film, electrically conductive adhesive film, and method for manufacturing connector

20160265758

2016-09-15

Light emitting device and lighting apparatus

#10

20160243582

2016-08-25

Method of calibrating a dispenser

#11

20160137860

2016-05-19

Hot melt compositions with improved etch resistance

#12

20160066430

2016-03-03

Hot melt compositions with improved etch resistance

#13

20160062230

2016-03-03

Method of aerosol printing a solder mask ink composition

#14

20150357511

2015-12-10

Transparent conductive coatings for optoelectronic and electronic devices

#15

20150289370

2015-10-08

Double-sided patterned transparent conductive film and method for manufacturing the same

#16

20150201491

2015-07-16

Pattern forming method, electronic wiring substrate, and optical device

#17

20150053643

2015-02-26

Hot melt compositions with improved etch resistance

#18

20140120663

2014-05-01

Mounting method and mounting structure for semiconductor package component

#19

20140057080

2014-02-27

Ceramic electronic component and manufacturing method thereof

#20

20130164505

2013-06-27

Purple Solder Proof Ink Composition, Purple Printed Circuit Board and Process for Preparing the Same

#21

20120325538

2012-12-27

PRINTED CIRCUIT BOARD ASSEMBLY

#22

20120204950

2012-08-16

Transparent conductive coatings for optoelectronic and electronic devices

#23

20120168209

2012-07-05

Ceramic circuit board and process for producing same

#24

20110315321

2011-12-29

RESIN APPLICATION APPARATUS AND DATA CREATION APPARATUS FOR RESIN APPLICATION

#25

20110108997

2011-05-12

MOUNTING METHOD AND MOUNTING STRUCTURE FOR SEMICONDUCTOR PACKAGE COMPONENT

#26

20110100684

2011-05-05

METHOD FOR MANUFACTURING AN ELECTRICAL CONDUCTOR BY APPLYING AT LEAST ONE PASTE, IN PARTICULAR A THICK-FILM PASTE

#27

20100315795

2010-12-16

Electronic component and method of manufacturing electronic component

#28

20100264196

2010-10-21

ELECTRONIC COMPONENT MOUNTING METHOD

#29

20100237493

2010-09-23

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS HAVING A PRINTED CIRCUIT BOARD

#30

20100187672

2010-07-29

ELECTRONIC APPARATUS AND CIRCUIT BOARD

#31

20100132991

2010-06-03

ELECTRONIC DEVICE, PRINTED CIRCUIT BOARD, AND ELECTRONIC COMPONENT

#32

20100079965

2010-04-01

Printed circuit board and electronic apparatus having printed circuit board

#33

20100000773

2010-01-07

Electronic component mounting structure

#34

20090321120

2009-12-31

PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE

#35

20090314536

2009-12-24

PRINTED CIRCUIT BOARD, ELECTRIC INSTRUMENT, AND SEMICONDUCTOR PACKAGE

#36

20090310321

2009-12-17

PRINTED CIRCUIT BOARD AND ELECTRONIC APPARATUS

#37

20090242023

2009-10-01

SYSTEM AND METHOD FOR PRODUCING A SOLAR CELL ARRAY

#38

20090236136

2009-09-24

Printed circuit board assembly

#39

20090130800

2009-05-21

Manufacturing method of semiconductor device

#40

20090058445

2009-03-05

Circuit board testing using a probe

#41

20090056985

2009-03-05

PCB with soldering pad projections forming fillet solder joints and method of production thereof

#42

20090051379

2009-02-26

Method of treating and probing a via

#43

20090022885

2009-01-22

Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same

#44

20090001575

2009-01-01

Printed circuit board, mounting method of electronic component, and electronic apparatus

#45

20080303145

2008-12-11

Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device

#46

20080289175

2008-11-27

Electronic component mounting system and electronic component mounting method

#47

20080251945

2008-10-16

Semiconductor package that has electronic component and its fabrication method

#48

20080226877

2008-09-18

Method for mounting a semiconductor package onto PCB

#49

20080212300

2008-09-04

Circuit board and method of manufacturing same

#50

20080205009

2008-08-28

Electronic apparatus and mounting method

#51

20080196608

2008-08-21

Screen printing plate and screen printing apparatus

#52

20080196245

2008-08-21

Method for mounting electronic components

#53

20080179379

2008-07-31

SOLDER JOINT STRUCTURE, SOLDERING METHOD, AND ELECTRONIC-COMPONENT MANUFACTURING APPARATUS USING THE SAME STRUCTURE AND THE METHOD

#54

20070254469

2007-11-01

Surface mounting method

#55

20070252285

2007-11-01

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

#56

20070190264

2007-08-16

PRINTED CIRCUIT BOARDS

#57

20070148816

2007-06-28

Attachment of a QFN to a PCB

#58

20070111597

2007-05-17

Cable connector

#59

20070090170

2007-04-26

Method of making a circuitized substrate having a plurality of solder connection sites thereon

#60

20070035021

2007-02-15

Printed circuit board and electronic apparatus including printed circuit board

#61

20070023138

2007-02-01

Gluing method and device

#62

20060254502

2006-11-16

Printable electric circuits, electronic components and method of forming the same

#63

20060237516

2006-10-26

Method of treating and probing a via

#64

20060198994

2006-09-07

Ceramic circuit substrate and manufacturing method thereof

#65

20060186520

2006-08-24

Semiconductor device and manufacturing method thereof

#66

20060152323

2006-07-13

Embedded inductor for semiconductor device circuit

#67

20060125096

2006-06-15

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

#68

20050275074

2005-12-15

Semiconductor package

#69

20050269699

2005-12-08

Ball grid array solder joint reliability

#70

20050242160

2005-11-03

Electrical circuits with button plated contacts and assembly methods

#71

20050224560

2005-10-13

Mounting substrate and mounting method of electronic part

#72

20050184379

2005-08-25

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

#73

20050085007

2005-04-21

Joining material stencil and method of use

#74

20050061854

2005-03-24

Method for mounting a semiconductor package onto PCB

#75

20050056946

2005-03-17

Electrical circuit assembly with improved shock resistance

#76

20050046026

2005-03-03

Adhesive film and tacking pads for printed wiring assemblies