CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

JUNCTION BLOCK FOR DISTRIBUTING HIGH-CURRENT POWER

SHIELDING A PRINTED CIRCUIT BOARD FROM ELECTROMAGNETIC INTERFERENCE AND NOISE DURING TESTING

MATERIAL SHEET HAVING LCP FIBERS AND LOW-LOSS DIELECTRIC

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL

Circuit Device

Method for shielding a printed circuit board from electromagnetic interference and noise during testing

ELECTRONIC DEVICE COMPRISING SEALING MEMBER

MODULE AND METHOD FOR MANUFACTURING SAME

Etching device and etching method using the same

Module, terminal assembly, and method for producing module

RESIN-SEALED IN-VEHICLE ELECTRONIC CONTROL DEVICE

Method for shielding a printed circuit board from electromagnetic interference and noise during testing

CIRCUIT UNIT, ELECTRICAL JUNCTION BOX, AND PRODUCTION METHOD OF CIRCUIT UNIT

Manufacturing method of mounting structure, and sheet therefor

Multilayer ceramic substrate and method of manufacturing multilayer ceramic substrate

Manufacturing method of mounting structure

Fixture for shielding a printed circuit board from electromagnetic interference and noise during testing

Electronic component and method for producing an electronic component

Method and system for providing dynamic personalized recommendations for a destination

Multilayer substrate

Method for providing hermetic electrical feedthrough

Sensor system, sensor arrangement, and assembly method using solder for sealing

Connection substrate

LED module and method of sealing

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

Printed circuit board (PCB), PCB assembly, and washing machine including the same

Systems, methods and devices for a package securing system

Flame retardant resins comprising phosphorous containing flame retardants

Flame retardant resins comprising phosphorus containing flame retardants

Flame retartdant epoxy resins comprising phosphorus containing flame retardants

Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same

Smart connector housing

Flexible electronic substrate

METAL SUBSTRATE WITH INSULATED VIAS

Non-metallic coating and method of its production

Electronic module having circuit boards and a plastic sealing ring that can be molded on by injection molding, in particular for a motor vehicle transmission control unit, and method for producing said electronic module

Electronic component, electronic module, manufacturing method therefor, and electronic apparatus

STRAP BAND INCLUDING ELECTRODES FOR WEARABLE DEVICES AND FORMATION THEREOF

Circuit board and method for fabricating the same

Electrical vacuum-compatible feedthrough structure and detector assembly using such feedthrough structure

Fire resistant electrical panel

Tape package and display apparatus including the same

ELECTRONIC MODULE, LIGHTING DEVICE AND MANUFACTURING METHOD OF THE ELECTRONIC MODULE

Insulated metal substrate

Electronic package mounting

Electronic device and method for manufacturing electronic device

Method for making a biocompatible hermetic housing including hermetic electrical feedthroughs

Printed circuit solder connections

Multilayer ceramic electronic device and method for manufacturing the same

Method for producing base substrate, method for producing electronic device, base substrate, and electronic apparatus

Base substrate, electronic device, and method of manufacturing base substrate

Electronic device, electronic apparatus, and method of manufacturing electronic device

Reinforced wiring unit and sealing structure

Printed circuit board with cavity

Apparatus and associated methods

Preventing conductive anodic filament (CAF) formation by sealing discontinuities in glass fiber bundles

Flexible Circuit Board and Electric Device

Control module for a transmission control installed in an automatic transmission

ELECTRONIC-COMPONENT EMBEDDED RESIN SUBSTRATE AND ELECTRONIC CIRCUIT MODULE

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

Method for assembling camera module

Light Band and Method for Producing a Light Band

Flexible printed circuit board with waterproof structure

Capacitively coupled connector using liquid dielectric for improved performance

Heat-radiating substrate and manufacturing method thereof

SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME

Seal structure

Hermetic sealing device and hermetic sealing structure

TAMPER EVIDENT PCBA FILM

CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Seal structure

Electric device

Wiring substrate and method for manufacturing wiring substrate

Module for integrated control electronics having simplified design

Ceramic substrate material, method for the production and use thereof, and antenna or antenna array

Use of an electronic module for an integrated mechatronic transmission control of simplified design

Ceramic composite multilayer substrate, method for manufacturing ceramic composite multilayer substrate and electronic component

Sealing structure

Electric control unit having a housing part and a cooling part

Sealing structure

METHOD FOR THE SELECTIVE SURFACE TREATMENT OF NON-FLAT WORKPIECES

Wiring board with lead pins and method of producing the same

INTEGRATED CIRCUIT PACKAGE

Method of forming wiring board and wiring board obtained

Electronics housing with standard interface

COMMUNICATION DEVICE

Electronic component module and method for manufacturing the same

Compact control device for a motor vehicle

Process for depositing sensors on a porous support

Method for producing a flexible conductor carrier and arrangement comprising the flexible conductor carrier

Electronics housing with open conductor track regions and a contact partner formed as a clip

Method for mutually connecting substrates, flip chip mounting body, and mutual connection structure between substrates

Package substrate having embedded semiconductor chip and fabrication method thereof

Wiring substrate, manufacturing method thereof, semiconductor device, and manufacturing method thereof

System and method of sealing electrical components in a frame tray

Fabricating process for substrate with embedded passive component

SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS AND METHOD

Method of forming solid vias in a printed circuit board

Circuit carrier

Microelectronic devices and methods for forming interconnects in microelectronic devices

Method for manufacturing an electronic assembly; an electronic assembly, a cover and a substrate

Memory module, socket and mounting method providing improved heat dissipating characteristics

Production method of an electronic circuit device

CIRCUIT BOARD, METHOD FOR MANUFACTURING SUCH CIRCUIT BOARD, AND ELECTRONIC COMPONENT USING SUCH CIRCUIT BOARD

SURFACE ACOUSTIC WAVE SENSOR ASSEMBLIES

System and Method for Substrate with Interconnects and Sealing Surface

Method for manufacturing multilayer ceramic electronic device

Housing for a power module

Control device and method for producing a control device

Control apparatus, in particular a mechatronic transmission control device or engine control device

INTERCONNECT USING LIQUID METAL

Method for providing hermetic electrical feedthrough

METHOD FOR PROVIDING HERMETIC ELECTRICAL FEEDTHROUGH

Method of providing a printed circuit board with an edge connection portion

STORAGE APPARATUS AND FLEXIBLE PRINTED BOARD UNIT

Material for forming capacitor layer and method for manufacturing the material for forming capacitor layer

Substrate and method for manufacturing the same

Interconnection and Packaging Method for Biomedical Devices with Electronic and Fluid Functions

Component and method for manufacturing printed circuit boards

Method for producing semiconductor device

Modular board device, high frequency module, and method of manufacturing the same

Microelectronic devices and methods for forming interconnects in microelectronic devices

Waterproof and dustproof structure

Sensor substrate and method of fabricating same

Functional device-mounted module and a method for mounting functional device-mounted module

ELECTRONIC UNIT

Electrical equipment for junction and method of manufacturing the same

Module part

Package and electronic apparatus using the same

Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam

Microelectronic devices and methods for forming interconnects in microelectronic devices

Electroplating apparatus

Liquid treating apparatus

Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive.

Electronic circuit device and production method of the same

Method for patterning carbon nanotube coating and carbon nanotube wiring

Modular board device, high frequency module, and method of manufacturing same

Microelectronic devices and methods for forming interconnects in microelectronic devices

Memory module, socket and mounting method providing improved heat dissipating characteristics

Layered components, materials, methods of production and uses thereof

Electrical feedthrough assembly for a sealed housing

Circuit interconnect for optoelectronic device

Method for the selective surface treatment of planar workpieces

Method and system for non-vascular sensor implantation

Integrated electromagnetic interference filters and feedthroughs

Module part

Device and method for protecting a connector assembly

Method for providing hermetic electrical feedthrough