HYBRID-MATERIAL LEADS FOR SOLDERLESS COUPLING OF AN ELECTRONIC COMPONENT

METHODS OF ASSEMBLING STACKED PRINTED CIRCUIT BOARD COMPONENT ARRAY

Circuit Board for Camera Module and Corresponding Camera Module

METHOD AND SYSTEM FOR CONNECTING A TERMINAL ELEMENT TO A SUBSTRATE

SWITCH DEVICE WITH WELDING PROTECTIVE PLATE

RADIO FREQUENCY MODULE AND METHOD FOR MANUFACTURING THE SAME

FLEXIBLE CIRCUIT BOARD AND PAD CONNECTING SYSTEM

METHOD AND ELECTRICAL CONTACT ELEMENT

HIGH-FREQUENCY HIGH-POWER PACKAGING MODULE, MANUFACTURING METHOD FOR MODULE, AND HYBRID SUBSTRATE

ULTRASONIC WELDING SYSTEMS, METHODS OF USING THE SAME, AND RELATED WORKPIECES INCLUDING WELDED CONDUCTIVE PINS

Printed circuit board PCB assembly and electronic device

METHOD FOR FORMING POWER MODULE PACKAGE, POWER MODULE PACKAGE AND ELECTRONIC DEVICE

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT

BATTERY SYSTEM WITH FLEXIBLE PRINTED CIRCUIT

Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins

ELECTROOPTICAL DISPLAY DEVICE

Gold finger type fan frame and double-layer connection structure thereof

STACKED COMPONENT ARRAY STRUCTURE

Battery system with flexible printed circuit

Electronic device and method for manufacturing electronic device

Display apparatus having grooved terminals

Electrochemical three-dimensional printing and soldering

Substrate with buried component and manufacture method thereof

Sensor module

Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

Welding structure and display module

RECHARGEABLE BATTERY PACK

Semiconductor module and method for fabricating the same

Electrochemical three-dimensional printing and soldering

Transceiver antenna for wireless charging, apparatus and method of manufacturing the same

ELECTRICAL AND/OR ELECTRONIC COMPONENT AND CONTACT SYSTEM

Method for producing a camera module, camera module

Base with electronic component and voice coil motor

Assembly method and AP device

Ultrasonic welding systems, methods of using the same, and related workpieces including welded conductive pins

Display device and manufacturing method of display device

Bonding apparatus and method of fabricating display device using the same

ELECTRONIC COMPONENT, METHOD FOR PRODUCING ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING MOUNT STRUCTURE

Structural lead frame

Component assemblies and embedding for high density electronics

Battery system with flexible printed circuit

Display apparatus having grooved terminals

FPC connection structure and method for connecting to printed circuit board by using same

Method for producing a printed circuit board using a mould for conductor elements

Battery pack and manufacturing method therefor

Information handling system with high current battery planar tab interconnect

Method of manufacturing battery module and interconnect board assembly with integrated PCB and flex circuit

Circuit board connector

Planar transformer and switching power adapter

Biocompatible electromechanical connection for ceramic substrate electronics for biomedical implant

Circuit board manufacturing method

Display device and manufacturing method of display device

Method of attaching a contact element to a conductive path a conductor plate

Welding system

Power semiconductor device and manufacturing method thereof, and power conversion device

Electrochemical cell connector having flexible circuit including plurality of arms with conductor in opening of arms and battery pack containing same

SiP module and manufacturing method of the SiP module

LIGHTING CORD FOR DECORATIONS

Touch panel and touch display device

Method for Bonding an Electrically Conductive Element to a Bonding Partner

Information handling system with high current battery planar tab interconnect

METHOD FOR MANUFACTURING AN EMBEDDED FLEXIBLE CIRCUIT BOARD

SYSTEM AND METHOD FOR CONNECTING FLAT FLEXIBLE CABLE TO PRINTED CIRCUIT BOARD

EMBEDDED FLEXIBLE CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Light-emitting device and method for manufacturing same

Display apparatus having grooved terminals

CONDUCTIVE TERMINALS, BUSBARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING RELATED POWER

Glue dispensing method and circuit board

Flexible printed wiring board, electronic device having flexible printed wiring board, and method for manufacturing electronic device having flexible printed wiring board

Electrochemical three-dimensional printing and soldering

Ultrasonic bonding jig, bonding structure, and bonding method

Welded structure

Composite bump, method for forming composite bump, and substrate

Optical module

Fingerprint sensor package and fabricating method thereof

Ultrasonic vibration bonding apparatus

Resin substrate, component-mounted resin substrate, method of manufacturing resin substrate, and method of manufacturing component-mounted resin substrate

Resin board structure and method for fabricating the same

Resin substrate, component-mounting resin substrate, and method of manufacturing component-mounting resin substrate

Flexible circuit battery attachment devices, systems, and methods

Electronic module with a component which can be flexibly placed by means of a base element, and method for producing same

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

METHOD AND APPARATUS TO CREATE ELECTRICAL JUNCTIONS FOR INFORMATION ROUTING IN TEXTILE STRUCTURES

WIRING SYSTEM

Conductor assembly, electronic component using same, and manufacturing method thereof

Circuit board secured to battery cell using a circuit board through hole and methods for welding the circuit board

Fingerprint sensor package and fabricating method thereof

Method for working a first component and a second component by laser welding and corresponding device

Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices

Connection element for an electronic component arrangement and process to produce the same

Method for solderless electrical press-in contacting of electrically conductive press-in pins in circuit boards

Inter-chip alignment

FLEXIBLE PRINTED WIRING BOARD, ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE HAVING FLEXIBLE PRINTED WIRING BOARD

Battery bridge and method for activating an electronic device

Methods for connecting a wire to a feedthrough pin and apparatus including a wire connected to a feedthrough pin by the method

Manufacturing method, pickup method, equipment and EMI (electromagnetic interference) electromagnetic shielding layer manufacturing method of SiP (system in package) module

Protective Element for Conductors

Biocompatible bonding method and electronics package suitable for implantation

Electronic control module, in particular for gear mechanism control, with electrical components which are welded to press contacts

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Multi-stacked electronic device with defect-free solder connection

Electronic control module and method for producing an electronic control module

Method for producing a power printed circuit and power printed circuit obtained by this method

Module component

Methods for connecting inter-layer conductors and components in 3D structures

Multi-stacked electronic device with defect-free solder connection

Printed circuit board with at least one integrated precision resistor

Electronic control device and production method thereof

ELECTRONIC CONTROL UNIT AND METHOD FOR ARRANGING ELECTRONIC COMPONENTS ON A CIRCUIT CARRIER AND FOR ELECTRICALLY CONNECTING SAID ELECTRONIC COMPONENTS TO A CIRCUIT CARRIER

Opto-electric hybrid board and method of manufacturing same

ELECTRIC RESISTANCE WELDING METHOD AND USE THEREOF, AND ELECTRODE WELDING HEAD USED

Biocompatible bonding method and electronics package suitable for implantation

Method of mounting self-adhesive substrate on electronic device

Tin fusion joining for robust integration of electrical components with axial leads

Multi-stacked electronic device with defect-free solder connection

Multi-stacked electronic device with defect-free solder connection

Method for producing a circuit carrier and for connecting an electrical conductor to a metallization layer of a circuit carrier

Electronic component, method for manufacturing the electronic component, and circuit board

LED screen display unit and production method therefor

Method of assembling a heat dissipating module of an electronic device

Electronic device and method for assembling the same

Method of manufacturing printed circuit board having electronic component embedded

Unpacked structure for power device of radio frequency power amplification module and assembly method therefor

Method of manufacturing a MEMS micro-mirror assembly

MEMS micro-mirror assembly

Modular power conversion system and method

Semiconductor device

Dual interface module and dual interface card having a dual interface module manufactured using laser welding

Method for connecting inter-layer conductors and components in 3D structures

Electric connection method

Miniature wire-bondable capacitor

Filter assembly

Electrical component

Chip assembly and chip assembling method

Method for mounting a component in or on a circuit board, and circuit board

Connector, PCB for LED light bar and LED light bar

Electronics package suitable for implantation

VIAS FOR MITIGATING PAD DELAMINATION

Flip-chip Mounting Structure and Flip-chip Mounting Method

Multilayer ceramic capacitor

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF

MANUFACTURING METHOD OF PRINTED WIRING BOARD AND A LAMINATE JOINTING APPARATUS

Electronics package suitable for implantation

ELECTRONIC CIRCUIT BOARD AND A RELATED METHOD THEREOF

Biocompatible bonding method and electronics package suitable for implantation

Bondable conductive ink

ELECTRODE BASE

Method for manufacturing semiconductor device, and semiconductor device

Semiconductor apparatus and the method of manufacturing the same

Implementing interleaved-dielectric joining of multi-layer laminates

Method for Electrically Conductively Connecting Conductor Tracks in Conductor Carriers and System Comprising such Conductor Carriers

Electronics package suitable form implantation

Module Connection in a Printed Wiring Board

Wireless telemetry electronic circuit board for high temperature environments

Method for manufacturing a circuit for high temperature and high g-force environments

Electrical microfilament to circuit interface

FLEXIBLE PRINTED CIRCUIT TO GLASS ASSEMBLY SYSTEM AND METHOD

Apparatus with a multi-layer coating and method of forming the same

Thermo-compression bonded electrical interconnect structure and method

Biocompatible bonding method and electronics package suitable for implantation

Surface mountable PPTC device with integral weld plate

INTEGRATED PASSIVE DEVICE ASSEMBLY

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

Biocompatible bonding method and electronics package suitable for implantation

Circuit board, its manufacturing method, and joint box using circuit board

METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE

Thermo-compression bonded electrical interconnect structure

Printed wiring board and method for manufacturing the same

METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD AND USE AND PRINTED CIRCUIT BOARD

Non-volatile memory with reduced mobile ion diffusion

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Method for contacting a rigid printed circuit board to a contact partner and arrangement of a rigid printed circuit board and contact partner

Electric device

Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other

METHOD OF CONNECTION OF FLEXIBLE PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE OBTAINED THEREBY

ELECTRONIC APPARATUS AND REINFORCING COMPONENT

Method and Apparatus for Building Multilayer Circuits

Method of producing a device comprising at least two distinct components that are interconnected by interconnecting wires and a device thereby obtained

Method for Mounting Flip Chip and Substrate Used Therein

Circuit layout and method and device for producing a circuit pattern on a substrate

LASER WELDING METHOD

SUSPENSION DESIGN FOR HIGH SHOCK PERFORMANCE SOLDERING BALL BONDING

Wiring substrate with a wire terminal

PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

Secondary battery

Grid array packages

Stackable semiconductor device assemblies

Grid array packages and assemblies including the same

Method for producing a device comprising a transponder antenna connected to contact pads in which soldering energy is applied directly to contact pads

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

INTEGRATED CIRCUIT PACKAGE

Circuit board for secondary battery and secondary battery with the circuit board

Electrical microfilament to circuit interface

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

CHIP CAPACITOR EMBEDDED PWB

Process of fabricating a circuit board

Horizontal dual in-line memory modules

Conductor module and electromagnetic welding method

Wireless telemetry electronic circuit board for high temperature environments

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Battery cell interconnect and voltage sensing assembly and method for coupling battery cell assemblies thereto

Printed Circuit Board With Additional Functional Elements, Method of Production and Use

ELECTRONIC CIRCUIT AND METHOD FOR MANUFACTURING SAME

Mounting method using thermocompression head

Protective circuit board and battery pack using the same

Motor drive apparatus

System and method for mounting shielded cables to printed circuit board assemblies

Method for arranging print head chips

Arrangement comprising a shunt resistor and method for producing an arrangement comprising a shunt resistor

OLED device employing a metal thin-film connected to a high-current cable

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Printed circuit board assembly and manufacturing method for the same

CONNECTING STRUCTURE OF CIRCUIT BOARDS, CONNECTING METHOD OF CIRCUIT BOARDS, AND COMPRESSING TOOL FOR CONNECTING CIRCUIT BOARDS

SEMICONDUCTOR CHIP MOUNTING METHOD, SEMICONDUCTOR MOUNTING WIRING BOARD PRODUCING METHOD AND SEMICONDUCTOR MOUNTING WIRING BOARD

LEAD TERMINAL BONDING METHOD AND PRINTED CIRCUIT BOARD

Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the same

Thermo-compression bonded electrical interconnect structure and method

Thermo-compression bonded electrical interconnect structure and method

Microelectronic assembly having second level interconnects including solder joints reinforced with crack arrester elements and method of forming same

Microelectronic Package Having Second Level Interconnects Including Stud Bumps and Method of Forming Same

Bringing a cable into contact with a flexible strip conductor

Approach for assembling and repairing probe assemblies using laser welding

Method for manufacturing semiconductor device, and semiconductor device

Method for Connecting Printed Circuit Boards

Manufacturing method of printed wiring board and a laminate jointing apparatus

Power semiconductor module and method for producing the same

Tape carrier for semiconductor device and method for making same

Method of Improving the Strength of a Spot-Welded Joint Between Fine Enameled Wire and Circuit Board

Electronic control apparatus

Electronic control apparatus

STACK UP PCB SUBSTRATE FOR HIGH DENSITY INTERCONNECT PACKAGES

ELECTRONIC DEVICE

Electronic component device and method of mounting electronic component

Vehicular lamp

Electronic System With Lead Free Interconnections And Method of Fabrication

Semiconductor package

Conductive terminal welding method and conductive terminal structure

CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Method of making bondable flexible printed circuit

HYBRID BONDED FLEX CIRCUIT

Method and Apparatus to Create Electrical Junctions for Information Routing in Textile Structures

Electrical conductivity bridge in a conductive multilayer article

Electronics package suitable for implantation

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

HIGH DENSITY CANTILEVERED PROBE FOR ELECTRONIC DEVICES

Methods for providing and using grid array packages

CIRCUIT BOARD DEVICE AND BATTERY PACK

Semiconductor device having semiconductor element with back electrode on insulating substrate

Wiring board and method for manufacturing the same, and semiconductor device

Flexible printed-circuit boards bonding method and printed circuit board

Circuit Assembly and Method of its Manufacture

Connecting device for electronic components

Circuit board, its manufacturing method, and joint box using circuit board

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Biocompatible bonding method and electronics package suitable for implantation

Method of laser welding, manufacturing method of control unit, and car electronic control unit

Bonding method and apparatus

Probe For Semiconductor Devices

Light source module

Electronic part mounting method

Method of bonding flying leads

Method of bonding flying leads

Electrical microfilament to circuit interface

Carbon nanotube reinforced metallic layer

Wiring substrate and electronic parts packaging structure

Circuit board

CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE UTILIZING THE SAME

Biocompatible bonding method and electronics package suitable for implantation

Method for fabricating a light-emitting device

Biocompatible bonding method and electronics package suitable for implantation

Semiconductor device and method for manufacturing the same

Light-emitting device and light source apparatus using the same

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Method for LTCC circuitry

Method of head stack assembly flexible circuit assembly attached to an actuator arm

Circuit device and manufacturing method thereof

Semiconductor module and method of manufacturing the same

Wiring board, electronic circuit board, electronic apparatus and manufacturing method of electronic circuit board

Flip-chip adaptor package for bare die

Light source apparatus and fabrication method thereof

Liquid discharge recording head and ink jet recording apparatus

Semiconductor package module without a solder ball and method of manufacturing the semiconductor package module

Cornerbond assembly comprising three-dimensional electronic modules

Conductor board and method for producing a conductor board

Plasma display apparatus

Wiring board and manufacturing method therefor

Method of mounting electronic component

Bonding structure of device packaging

Multilayer circuit board and method of producing the same

Joining apparatus with UV cleaning

Probe for semiconductor devices

Carriage assembly of a hard disk drive

Structure of terminal member

Lead wire bonding method

Mounting with auxiliary bumps

Fusion bonded assembly with attached leads

Circuit device