Microwave circuit

Circuit device and manufacturing method thereof

Surface mountable PPTC device with integral weld plate

Bonding pad structure, display panel and bonding pad array structure using the same and manufacturing method thereof

Bonding arrangement and method for LTCC circuitry

Electronic assembly and method of manufacture thereof

Conducting structure of a multi-layers IC board

Method for fabricating a structure for making contact with a device

IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless

Flip-chip adaptor package for bare die

Method and apparatus to create electrical junctions for information routing in textile structures

Semiconductor device and manufacturing method for the same

Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection

Method of manufacturing circuits

Method for electrical interconnection of angularly disposed conductive patterns

Method for diffusion bond welding for use in a multilayer electronic assembly

Circuit assembly, producing method of the same, distribution unit and bus bar substrate

Electronic circuit device and porduction method therefor

FPC with via holes with filler being welded to suspension and drive apparatus

Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device

Method of head stack assembly flexible circuit assembly attached to an actuator arm

Method of mounting electronic part and flux-fill

Multilayer circuit board structure and manufacturing method thereof

Electrical connection of electrical wires to flexible conductive elements

Transponder wire bonded to round wire on adhesive tape having a water-soluble backing

Printed circuit board having improved high speed transmission lines