Patents-Review.com
ClassID:

233916 ⎘

H05K3/42 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Forming printed elements for providing electric connections to or between printed circuits Plated through-holes or plated via connections

Sub-classes:
Recent Application in this class:
#1
20260101438
2026-04-09

WIRING BOARD AND MANUFACTURING METHOD FOR WIRING BOARD

 #2
20260068048
2026-03-05

PRINTED CIRCUIT BOARD

 #3
20260068047
2026-03-05

WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE

 #4
20260059658
2026-02-26

PACKAGE SUBSTRATE AND FABRICATING METHOD THEREOF

 #5
20260025925
2026-01-22

PRINTED CIRCUIT BOARD VIA IMPEDANCE CONTROL

 #6
20260020163
2026-01-15

ELECTRONIC DEVICE

 #7
20260020142
2026-01-15

ORTHOGONAL DIFFERENTIAL VIAS DESIGN ON A PRINTED CIRCUIT BOARD

 #8
20260004689
2026-01-01

ELECTRONIC DEVICE INCLUDING CRACK DETECTION WIRING

 #9
20250338402
2025-10-30

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

 #10
20250280498
2025-09-04

INTERCONNECT SUBSTRATE AND METHOD OF MAKING INTERCONNECT SUBSTRATE

 #11
20250176113
2025-05-29

RIGID-FLEXIBLE PCB, POWER MODULE INCLUDING THE PCB, AND MANUFACTURING METHOD OF THE POWER MODULE

 #12
20250168989
2025-05-22

CONTROLLING DEPTH OF PENETRATION OF BACKDRILL CAVITY FILLING BY ADJUSTING INITIAL AMBIENT PRESSURE

 #13
20250132224
2025-04-24

PRINTED CIRCUIT BOARD

 #14
20250113446
2025-04-03

PLATED THROUGH-HOLE STRUCTURES AND METHOD FOR THE MANUFACTURE THEREOF

 #15
20250089167
2025-03-13

WIRING SUBSTRATE

 #16
20250054426
2025-02-13

ELECTRONIC DEVICE INCLUDING CRACK DETECTION WIRING

 #17
20250031316
2025-01-23

METHODS FOR FORMING CIRCUIT PATTERN ON SUBSTRATE USING METAL FOIL WITH LOW SURFACE ROUGHNESS

 #18
20240431025
2024-12-26

CORROSION RESISTANT SINGLE DAMASCENE INTERCONNECTS

 #19
20240422907
2024-12-19

Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing Method

 #20
20240389219
2024-11-21

MICRO-GROUND VIAS FOR IMPROVED SIGNAL INTEGRITY FOR HIGH-SPEED SERIAL LINKS

 #21
20240357749
2024-10-24

ELECTRONIC DEVICE WITH IMPROVED INTERFACIAL ADHESION OF METAL-ORGANIC INTERFACES

 #22
20240251510
2024-07-25

PRINTED WIRING BOARD

 #23
20240155777
2024-05-09

ELECTRONIC DEVICE

 #24
20230380062
2023-11-23

Beveled overburden for vias and method of making the same

 #25
20230371169
2023-11-16

Interlaced crosstalk controlled traces, vias, and capacitors

 #26
20230363083
2023-11-09

Electronic substrate having differential coaxial vias

 #27
20230354506
2023-11-02

PRINTED CIRCUIT BOARD AND PREPARATION METHOD THEREOF, AND ELECTRONIC COMMUNICATION DEVICE

 #28
20230354503
2023-11-02

Interconnect structure having conductor extending along dielectric block

 #29
20230326382
2023-10-12

Electronic device including crack detection wiring

 #30
20230319978
2023-10-05

Micro-ground vias for improved signal integrity for high-speed serial links

 #31
20230240009
2023-07-27

WIRING BOARD

 #32
20230189435
2023-06-15

Circuit board with rigid portion and flexible portion having connecting end and electronic package using the same

 #33
20230187820
2023-06-15

Printed circuit board structure including a closed cavity

 #34
20230138739
2023-05-04

Circuit board ground via patterns for minimizing crosstalk between signal vias

 #35
20230100576
2023-03-30

THICK AND THIN TRACES IN A BRIDGE WITH A GLASS CORE

 #36
20230082429
2023-03-16

FORMING WAVEGUIDES AND HEAT TRANSFER ELEMENTS IN PRINTED CIRCUIT BOARDS

 #37
20230032026
2023-02-02

Multilayer printed circuit board

 #38
20230015176
2023-01-19

Reliability enhancement of press fit connectors

 #39
20220386452
2022-12-01

Interlaced crosstalk controlled traces, vias, and capacitors

 #40
20220386451
2022-12-01

Interconnect structure having conductor extending along dielectric block

 #41
20220377885
2022-11-24

Continuous interconnects between heterogeneous materials

 #42
20220369454
2022-11-17

Circuit board, semiconductor device and method of manufacturing circuit board

 #43
20220352613
2022-11-03

High-frequency package including a substrate body having first and second coplanar lines on opposite surfaces thereof connected by a pseudo coaxial line with exposed portions therein

 #44
20220338350
2022-10-20

Board-to-board connection structure and method for manufacturing the same

 #45
20220240369
2022-07-28

Circuit board and manufacturing method thereof and electronic device

 #46
20220180781
2022-06-09

Electronic device including crack detection wiring

 #47
20220151081
2022-05-12

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #48
20220091181
2022-03-24

Method for identifying PCB core-layer properties

 #49
20220088375
2022-03-24

IMPLANTABLE THIN FILM DEVICES

 #50
20220025520
2022-01-27

Coating of nano-scaled cavities

 #51
20220020591
2022-01-20

Method and device for plating a recess in a substrate

 #52
20220015225
2022-01-13

Electronic substrate having differential coaxial vias

 #53
20210227695
2021-07-22

METHODS FOR FABRICATING PRINTED CIRCUIT BOARD ASSEMBLIES WITH HIGH DENSITY VIA ARRAY

 #54
20210219422
2021-07-15

Component carrier with an etching neck connecting back drill hole with vertical through connection

 #55
20210195762
2021-06-24

Method for fabricating printed circuit board and printed circuit board fabricated thereby

 #56
20210161012
2021-05-27

Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric

 #57
20210092853
2021-03-25

Reel-to-reel lamination methods and devices in FPC fabrication

 #58
20210092851
2021-03-25

Reel-to-reel laser sintering methods and devices in FPC fabrication

 #59
20210092837
2021-03-25

Reel-to-reel flexible printed circuit fabrication methods and devices

 #60
20210086306
2021-03-25

Reel-to-reel laser ablation methods and devices in FPC fabrication

 #61
20210083410
2021-03-18

Reliability enhancement of press fit connectors

 #62
20210059049
2021-02-25

SPACE EFFICIENT LAYOUT OF PRINTED CIRCUIT BOARD POWER VIAS

 #63
20210014962
2021-01-14

Resin substrate and electronic device

 #64
20210007226
2021-01-07

Circuit board

 #65
20210007215
2021-01-07

Interconnect structure having conductor extending along dielectric block

 #66
20210005530
2021-01-07

Manufacturing method of heat dissipation component

 #67
20200413542
2020-12-31

Through hole filling paste

 #68
20200413537
2020-12-31

Printed wiring board and method for manufacturing printed wiring board

 #69
20200395659
2020-12-17

Printed circuit board structure including a closed cavity

 #70
20200395528
2020-12-17

Wiring Substrate, Method Of Manufacturing Wiring Substrate, Inkjet Head, MEMS Device, And Oscillator

 #71
20200383204
2020-12-03

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #72
20200381587
2020-12-03

Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate

 #73
20200375024
2020-11-26

Method for cross-talk reduction technique with fine pitch vias

 #74
20200358161
2020-11-12

Substrate integrated waveguide and method for manufacturing the same

 #75
20200344895
2020-10-29

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #76
20200335277
2020-10-22

Method for manufacturing inductor built-in substrate

 #77
20200329568
2020-10-15

Wiring substrate and method for manufacturing wiring substrate

 #78
20200329567
2020-10-15

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #79
20200313320
2020-10-01

Press-fit terminal, connector for board, and board-equipped connector

 #80
20200288576
2020-09-10

Methods for fabricating printed circuit board assemblies with high density via array

 #81
20200260594
2020-08-13

Creating in-via routing with a light pipe

 #82
20200253053
2020-08-06

Component carrier with electrically reliable bridge with sufficiently thick vertical thickness in through hole of thin dielectric

 #83
20200248311
2020-08-06

Coating of nano-scaled cavities

 #84
20200245502
2020-07-30

Thermal management of printed circuit board components

 #85
20200245469
2020-07-30

Repairing defective through-holes

 #86
20200245461
2020-07-30

Printed wiring board

 #87
20200236775
2020-07-23

Method for producing a printed circuit board having thermal through-contacts

 #88
20200175901
2020-06-04

Electronic device including crack detection wiring

 #89
20200115572
2020-04-16

Solvent-free resin composition and uses of the same

 #90
20200113061
2020-04-09

Method for producing wiring board, and wiring board

 #91
20200107449
2020-04-02

Method of making a circuit board

 #92
20200072871
2020-03-05

ULTRA LOW-COST, LOW LEADTIME, AND HIGH DENSITY SPACE TRANSFORMER FOR FINE PITCH APPLICATIONS

 #93
20200045825
2020-02-06

Component carrier with component embedded in cavity and with double dielectric layer on front side

 #94
20200044303
2020-02-06

Substrate integrated waveguide and method for manufacturing the same

 #95
20200037452
2020-01-30

Method of manufacturing through hole of substrate

 #96
20200037446
2020-01-30

Implementing embedded wire repair for PCB constructs

 #97
20200029471
2020-01-23

Electronic control unit

 #98
20200006233
2020-01-02

PIN ASSEMBLIES FOR PLATED VIAS

 #99
20190394883
2019-12-26

Preventing post reflow interconnect failures in VIPPO solder joints via utilization of adhesive material

 #100
20190387631
2019-12-19

Manufacturing method of double layer circuit board

 #101
20190306991
2019-10-03

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #102
20190297731
2019-09-26

Wiring board, multilayer wiring board, and method of manufacturing wiring board

 #103
20190289725
2019-09-19

Multilayer circuit board and method of manufacturing the same

 #104
20190289724
2019-09-19

Method of manufacturing multilayer circuit board

 #105
20190239363
2019-08-01

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #106
20190228975
2019-07-25

Method and device for plating a recess in a substrate

 #107
20190215950
2019-07-11

Component carrier comprising a copper filled multiple-diameter laser drilled bore

 #108
20190214751
2019-07-11

Plated through hole socketing coupled to a solder ball to engage with a pin

 #109
20190175905
2019-06-13

Implantable thin film devices

 #110
20190160570
2019-05-30

Systems and methods for attaching printed circuit board to pallet

 #111
20190159333
2019-05-23

Electronic substrate having differential coaxial vias

 #112
20190103513
2019-04-04

Glass wiring substrate, method of producing the same, part-mounted glass wiring substrate, method of producing the same, and display apparatus substrate

 #113
20190098753
2019-03-28

Method of integrating an electronic module with conductive fabric

 #114
20190080977
2019-03-14

Through electrode substrate and manufacturing method thereof

 #115
20190059157
2019-02-21

Plated opening with vent path

 #116
20190045638
2019-02-07

Double-sided circuit board and method for preparing the same

 #117
20190019593
2019-01-17

Transparent and flexible conductors made by additive processes

 #118
20190008049
2019-01-03

Manufacturing method for forming substrate structure comprising vias

 #119
20190006777
2019-01-03

Printed Circuit Board Solder Joints

 #120
20180332705
2018-11-15

Printed circuit board structure

 #121
20180331417
2018-11-15

Method for manufacturing chip signal elements

 #122
20180324958
2018-11-08

Single-layer circuit board, multi-layer circuit board, and manufacturing methods therefor

 #123
20180323502
2018-11-08

Printed circuit board structure including a closed cavity

 #124
20180295718
2018-10-11

Cavities containing multi-wiring structures and devices

 #125
20180279466
2018-09-27

Circuit board

 #126
20180255648
2018-09-06

High-current transmitting method utilizing printed circuit board

 #127
20180240781
2018-08-23

Three-dimensional (3D) package structure having an epoxy molding compound layer between a discrete inductor and an encapsulating connecting structure

 #128
20180213654
2018-07-26

Electronic device with integrated circuit chip provided with an external electrical connection network

 #129
20180213641
2018-07-26

Process for producing wiring substrate

 #130
20180177049
2018-06-21

Plated opening with vent path

 #131
20180160547
2018-06-07

Method of manufacturing substrate and substrate

 #132
20180153044
2018-05-31

WIRING SUBSTRATE METHOD OF MANUFACTURING, WIRING SUBSTRATE AND WIRING SUBSTRATE MANUFACTURING DEVICE

 #133
20180145050
2018-05-24

Three-dimensional package structure and the method to fabricate thereof

 #134
20180132349
2018-05-10

Manufacturing method of double layer circuit board

 #135
20180098426
2018-04-05

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #136
20180084652
2018-03-22

Implementing backdrilling elimination utilizing via plug during electroplating

 #137
20180082979
2018-03-22

Substrate and the method to fabricate thereof

 #138
20180070443
2018-03-08

Component carrier comprising a deformation counteracting structure

 #139
20180042123
2018-02-08

Implementing backdrilling elimination utilizing via plug during electroplating

 #140
20180027648
2018-01-25

Interconnect structure and method of manufacturing the same

 #141
20180008821
2018-01-11

Implantable thin film devices

 #142
20170372994
2017-12-28

Porous alumina templates for electronic packages

 #143
20170359921
2017-12-14

Thermal management of printed circuit board components

 #144
20170326689
2017-11-16

METHODS OF FORMING A SUBSTRATE HAVING AN OPEN PORE THEREIN AND PRODUCTS FORMED THEREBY

 #145
20170320994
2017-11-09

EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF

 #146
20170318664
2017-11-02

Electrical shielding using bar vias and associated methods

 #147
20170311443
2017-10-26

Double layer circuit board

 #148
20170303392
2017-10-19

THERMAL MANAGEMENT OF PRINTED CIRCUIT BOARD COMPONENTS

 #149
20170301558
2017-10-19

Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate

 #150
20170273195
2017-09-21

Recessed cavity in printed circuit board protected by LPI

 #151
20170273172
2017-09-21

Method of manufacturing a signal transition component having a C-shaped conducting frame

 #152
20170269737
2017-09-21

TOUCH SCREEN, MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE

 #153
20170238426
2017-08-17

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

 #154
20170223820
2017-08-03

Component carrier comprising a copper filled multiple-diameter laser drilled bore

 #155
20170223819
2017-08-03

Component carrier comprising a copper filled mechanical drilled multiple-diameter bore

 #156
20170208695
2017-07-20

Sleeved coaxial printed circuit board vias

 #157
20170204253
2017-07-20

Composite materials including filled hollow glass filaments

 #158
20170188466
2017-06-29

Method for producing a printed circuit board

 #159
20170167970
2017-06-15

Method of producing through wiring substrate and method of producing device

 #160
20170148719
2017-05-25

Through-electrode substrate, method for manufacturing same, and semiconductor device in which through-electrode substrate is used

 #161
20170127534
2017-05-04

Method for mitigating signal attenuation in printed circuit board connections

 #162
20170105289
2017-04-13

METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

 #163
20170048969
2017-02-16

Radio frequency coupling and transition structure

 #164
20170030858
2017-02-02

Sensor element for detecting at least one property of a measured gas in a measured gas chamber, and method for manufacturing the same

 #165
20170019996
2017-01-19

Mounting substrate, manufacturing method for the same, and component mounting method

 #166
20170012593
2017-01-12

Output-noise reduction device

 #167
20160381781
2016-12-29

Circuit board and method of manufacturing the same

 #168
20160380538
2016-12-29

Current distribution in DC-DC converters

 #169
20160366759
2016-12-15

PRINTED CIRCUIT BOARD WITH REDUCED CROSS-TALK

 #170
20160330834
2016-11-10

Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same

 #171
20160322290
2016-11-03

Substrate for integrated circuit devices including multi-layer glass core and methods of making the same

 #172
20160319447
2016-11-03

Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens

 #173
20160307794
2016-10-20

Self-forming metal barriers

 #174
20160302299
2016-10-13

Circuit board and method of manufacturing the same

 #175
20160286643
2016-09-29

Electronic apparatus case

 #176
20160278218
2016-09-22

Methods of defect inspection of plated through hole structures utilizing fluorescent conductive fill material

 #177
20160278208
2016-09-22

Selective segment via plating process and structure

 #178
20160278207
2016-09-22

Selective segment via plating process and structure

 #179
20160270231
2016-09-15

Wiring module including wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring module

 #180
20160242280
2016-08-18

Substrate containing low-Dk-core glass fibers having low dielectric constant (Dk) cores for use in printed circuit boards (PCBs), and method of making same

 #181
20160224143
2016-08-04

Method of fabricating touch screen panel

 #182
20160198573
2016-07-07

Printed circuit assembly for a solenoid module for an automatic transmission

 #183
20160192508
2016-06-30

Formation of dielectric with smooth surface

 #184
20160184593
2016-06-30

Implantable medical device system including feedthrough assembly and method of forming same

 #185
20160183373
2016-06-23

Method for a printed circuit board with an array of high density AC coupling/DC blocking capacitors

 #186
20160183367
2016-06-23

Integrated system of an electronic module and conductive fabric and method of making the same

 #187
20160174360
2016-06-16

Signal transmission board and method for manufacturing the same

 #188
20160157341
2016-06-02

Multilayer ceramic substrate and manufacturing thereof

 #189
20160143152
2016-05-19

Reaction products of heterocyclic nitrogen compounds polyepoxides and polyhalogens

 #190
20160143142
2016-05-19

Element embedded printed circuit board and method of manufacturing the same

 #191
20160135297
2016-05-12

Via in a printed circuit board

 #192
20160111299
2016-04-21

Methods of fabricating tape film packages

 #193
20160050786
2016-02-18

Systems and methods for coupling a circuit board to an information handling system chassis

 #194
20160047774
2016-02-18

Compact microelectronic integrated gas sensor

 #195
20160047772
2016-02-18

Making imprinted thin-film electronic sensor structure

 #196
20160044788
2016-02-11

Printed circuit board and manufacturing method thereof

 #197
20160044782
2016-02-11

Multilayer wiring substrate, manufacturing method therefor, and substrate for probe card

 #198
20160044781
2016-02-11

Porous alumina templates for electronic packages

 #199
20160020500
2016-01-21

Flexible printed circuit board and manufacturing method of flexible printed circuit board

 #200
20160014901
2016-01-14

Electronic sub-assembly, a method for manufacturing the same, and a printed circuit board with electronic sub-assembly

 #201
20150351248
2015-12-03

Method for manufacturing substrate gap supporter

 #202
20150338451
2015-11-26

Systems and methods for detecting unauthorized population of surface-mount devices on a printed circuit board

 #203
20150334836
2015-11-19

Via in a printed circuit board

 #204
20150319860
2015-11-05

Electronic device assemblies including conductive vias having two or more conductive elements

 #205
20150319852
2015-11-05

PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD STRIP AND MANUFACTURING METHOD THEREOF

 #206
20150310967
2015-10-29

Making multi-layer micro-wire structure

 #207
20150289372
2015-10-08

FLUORESCENT CONDUCTIVE FILL MATERIAL FOR PLATED THROUGH HOLE STRUCTURES AND METHODS OF DEFECT INSPECTION UTILIZING THE SAME

 #208
20150282314
2015-10-01

Method for manufacturing printed wiring board with conductive post and printed wiring board with conductive post

 #209
20150250060
2015-09-03

Method for forming a circuit board via structure for high speed signaling

 #210
20150230338
2015-08-13

Circuit board with integrated passive devices

 #211
20150228570
2015-08-13

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

 #212
20150214665
2015-07-30

Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate

 #213
20150208506
2015-07-23

A PRINTED CIRCUIT BOARD ARRANGEMENT AND A METHOD FOR FORMING ELECTRICAL CONNECTION AT A PRINTED CIRCUIT BOARD

 #214
20150195911
2015-07-09

Printed circuit board

 #215
20150181766
2015-06-25

Substrate and the method to fabricate thereof

 #216
20150181733
2015-06-25

Three-dimensional (3D) package structure with electronic components encapsulated by a connection structure over an inductor

 #217
20150179611
2015-06-25

Three-dimensional package structure and the method to fabricate thereof

 #218
20150173191
2015-06-18

Method of manufacturing an intermediate product for an interposer and intermediate product for an interposer

 #219
20150163919
2015-06-11

Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component

 #220
20150156881
2015-06-04

Substrate with built-in electronic component and method for manufacturing substrate with built-in electronic component

 #221
20150146393
2015-05-28

High strength through-substrate vias

 #222
20150101858
2015-04-16

Cavities containing multi-wiring structures and devices

 #223
20150078848
2015-03-19

Method for implementing high-precision backdrilling stub length control

 #224
20150077963
2015-03-19

PRINTED WIRING BOARD WITH METAL POST AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD WITH METAL POST

 #225
20150075851
2015-03-19

Printed wiring board and method for manufacturing the same

 #226
20150068034
2015-03-12

Manufacturing method of package carrier

 #227
20150060128
2015-03-05

Double-sided circuit board and method for preparing the same

 #228
20150052742
2015-02-26

Circuit board structure manufacturing method

 #229
20150041208
2015-02-12

Micro mechanical anchor for 3D architecture

 #230
20150021081
2015-01-22

Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate

 #231
20150016081
2015-01-15

Electronic device with at least one impedance-compensating inductor and related methods

 #232
20150010694
2015-01-08

Method of manufacturing substrate having cavity

 #233
20150007933
2015-01-08

Method of forming a laminate structure having a plated through-hole using a removable cover layer

 #234
20140355213
2014-12-04

Electronic devices comprising printed circuit boards

 #235
20140332067
2014-11-13

Via Fill Material For Solar Applications

 #236
20140326495
2014-11-06

HIGH PERFORMANCE PRINTED CIRCUIT BOARD

 #237
20140304977
2014-10-16

Fabrication process of stepped circuit board

 #238
20140291001
2014-10-02

METHOD OF MAKING HYBRID WIRING BOARD WITH BUILT-IN STIFFENER AND INTERPOSER AND HYBRID WIRING BOARD MANUFACTURED THEREBY

 #239
20140251663
2014-09-11

Simultaneous and selective wide gap partitioning of via structures using plating resist

 #240
20140209371
2014-07-31

Printed circuit board having orthogonal signal routing

 #241
20140209370
2014-07-31

PCB having offset differential signal routing

 #242
20140208590
2014-07-31

Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate

 #243
20140201995
2014-07-24

CUTTING DRILL AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

 #244
20140192502
2014-07-10

Reducing impedance of a printed circuit board through a square wave pattern of plated-through holes

 #245
20140151107
2014-06-05

Touch member and method of manufacturing the same

 #246
20140151095
2014-06-05

PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

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Circuit board with integrated passive devices

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2014-04-17

Circuit board incorporating electronic component and manufacturing method thereof

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2014-04-10

Manufacturing method of substrate structure

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2014-04-03

Printed circuit board, and method and apparatus for drilling printed circuit board

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Plating catalyst and method

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2014-03-20

Printed circuit board and method for manufacturing the same

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2014-03-20

Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component

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PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

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Preventing the formation of conductive anodic filaments in a printed circuit board

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20140001150
2014-01-02

Circuit board multi-functional hole system and method

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2014-01-02

Method of electroplating and depositing metal

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2014-01-02

Manufacturing method of substrate structure

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Electronic devices with printed circuit boards having padded openings

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Wiring circuit flexible substrate including a terminal section and a connecting section

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Method for forming a circuit board via structure for high speed signaling

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PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME

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Plug via stacked structure, stacked substrate having via stacked structure and manufacturing method thereof

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Production method of multilayer printed wiring board and multilayer printed wiring board

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Wired circuit board including an insulating layer formed with an opening filled with a conductive portion and producing method thereof

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Wiring substrate having border portion separating two side metallic foils and manufacturing method of wiring substrate

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PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

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STRUCTURE OF VIA HOLE OF ELECTRICAL CIRCUIT BOARD

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Method for manufacturing circuit board having holes to increase resonant frequency of via stubs

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Method of producing a printed wiring board

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Electronic device assemblies including conductive vias having two or more conductive elements

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Through-hole substrate and method of producing the same

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Tape film packages and methods of fabricating the same

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2013-07-11

Connector

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Printed circuit board with reduced cross-talk

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2013-06-27

Low resistance through-wafer via

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Cavities containing multi-wiring structures and devices

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High strength through-substrate vias

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Wiring board, semiconductor device and method for manufacturing wiring board

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Preventing conductive anodic filament (CAF) formation by sealing discontinuities in glass fiber bundles

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BASE MEMBER

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Wiring board and method for manufacturing the same

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Grooved circuit board accommodating mixed-size components

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Plated through hole void detection in printed circuit boards by detecting a pH-sensitive component

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Plated Through Hole Void Detection in Printed Circuit Boards by Detecting Material Coupling to Exposed Laminate

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PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

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Method of manufacturing printed wiring board, and printed wiring board

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Electronic control unit and method of manufacturing the same

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Interposer, its manufacturing method, and semiconductor device

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CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

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CIRCUIT BOARD AND RADIATING HEAT SYSTEM FOR CIRCUIT BOARD

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INTERPOSER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

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Method of fabricating an interconnect device

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THIN FILM THROUGH-GLASS VIA AND METHODS FOR FORMING SAME

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MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD

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2012-09-13

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

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2012-06-14

Plating catalyst and method

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2012-05-31

Circuit board and mounting structure using the same

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2012-05-24

Composition for metal plating comprising suppressing agent for void free submicron feature filling

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2012-05-03

THROUGH WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF