233921 ⎘
Apparatus or processes for manufacturing printed circuits; Forming printed elements for providing electric connections to or between printed circuits; Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
Sub-classes:VIA LOSS CONTROL IN A PRINTED CIRCUIT BOARD
#2CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
#3POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DELIVERY APPLICATION
#4PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME
#5CIRCUIT BOARD AND METHOD OF FABRICATING CIRCUIT BOARD
#6ELECTRONIC DEVICE INCLUDING THERMAL INTERFACE MATERIAL
#7METHOD OF PREPARING A HIGH DENSITY INTERCONNECT PRINTED CIRCUIT BOARD INCLUDING MICROVIAS FILLED WITH COPPER
#8CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE
#9PRINTED CIRCUIT BOARD
#10LEVELING AGENT AND ELECTROLYTIC COMPOSITION FOR FILLING VIA HOLE
#11CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
#12ASYMMETRICAL ELECTROLYTIC PLATING FOR A CONDUCTIVE PATTERN
#13METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD HAVING AT LEAST ONE EMBEDDED ELECTRONIC COMPONENT
#14Semi-Additive Process for Printed Circuit Boards
#15DESIGNING A PRINTED CIRCUIT BOARD (PCB) TO DETECT SLIVERS OF CONDUCTIVE MATERIAL INCLUDED WITHIN VIAS OF THE PCB
#16Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
#17Printed circuit board
#18Manufacturing sequences for high density interconnect printed circuit boards and a high density interconnect printed circuit board
#19Method of preparing a high density interconnect printed circuit board including microvias filled with copper
#20ANISOTROPIC CONDUCTIVE SHEET, ELECTRICAL INSPECTION APPARATUS, AND ELECTRICAL INSPECTION METHOD
#21Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
#22PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
#23Method of making interconnect substrate and insulating sheet
#24Hermetic metallized via with improved reliability
#25Memory card and memory card socket
#26Carbon-Based Direct Plating Process
#27Wiring circuit board, producing method thereof, and wiring circuit board assembly sheet
#28Overhang-compensating annular plating layer in through hole of component carrier
#29Designing a printed circuit board (PCB) to detect slivers of conductive material included within vias of the PCB
#30CONDUCTIVE SLURRY AND PLATING METHOD USING THE SAME
#31Method of making flexible printed circuit board and flexible printed circuit board
#32Process for fabrication of a printed circuit board using a semi-additive process and removable backing foil
#33Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule
#34Overhang-compensating annular plating layer in through hole of component carrier
#35Method for forming circuits using seed layer and etchant composition for selective etching of seed layer
#36Coupled via structure, circuit board having the coupled via structure and method of manufacturing the circuit board
#37Hermetic metallized via with improved reliability
#38Method of manufacture for embedded IC chip directly connected to PCB
#39Printed circuit board and method of manufacturing the same
#40Method for manufacturing transfer film including seed layer, method for manufacturing circuit board by selectively etching seed layer, and etching solution composite
#41Memory card and memory card socket
#42UV curable Catalytic Adhesive for Circuit Boards with Traces and Vias
#43Asymmetrical electrolytic plating for a conductive pattern
#44Carbon-based direct plating process
#45Method for making a multi-layer circuit board using conductive paste with interposer layer
#46Hermetic metallized via with improved reliability
#47Implementing customized PCB via creation through use of magnetic pads
#48Coupled via structure, circuit board having the coupled via structure
#49Segmented via for vertical PCB interconnect
#50Implementing customized PCB via creation through use of magnetic pads
#51PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
#52Process for printed circuit boards using backing foil
#53Multi-layer circuit board using interposer layer and conductive paste
#54Printed circuit board having EMI shielding function, method for manufacturing the same, and flat cable using the same
#55METHOD FOR MANUFACTURING TRACES OF PCB
#56CIRCUIT BOARD
#57Methods of fast fabrication of single and multilayer circuit with highly conductive interconnections without drilling
#58CIRCUIT BOARD STRUCTURE AND METHOD FOR FORMING THE SAME
#59Method for manufacturing traces of PCB
#60Method for making a circuit board
#61FORMING METHOD OF CONTACT HOLE PATTERN
#62Method of making a fusion bonded circuit structure
#63Implementing backdrilling elimination utilizing anti-electroplate coating
#64Implementing backdrilling elimination utilizing anti-electroplate coating
#65Implementing backdrilling elimination utilizing anti-electroplate coating
#66Laminate production method
#67Printed wiring board and method of manufacturing the same
#68Method for manufacturing wiring board
#69CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
#70Package substrate comprising surface interconnect and cavity comprising electroless fill
#71Printed circuit board and method of manufacturing same
#72High speed circuit assembly with integral terminal and mating bias loading electrical connector assembly
#73Method of forming a laminate structure having a plated through-hole using a removable cover layer
#74Fabrication process of stepped circuit board
#75Method and structure for forming contact pads on a printed circuit board using zero under cut technology
#76Method of manufacturing a wiring board having via structures
#77Manufacturing method of printed wiring board and printed wiring board
#78Wiring substrate and method for manufacturing wiring substrate