H05K3/428 - CPC Classification Index

ClassID:

233924 ⎘

H05K3/428 - CPC Classification

Classification description:

Apparatus or processes for manufacturing printed circuits; Forming printed elements for providing electric connections to or between printed circuits; Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Recent Application in this class:

20250203776

2025-06-19

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

20250142736

2025-05-01

Stamping Surface Profile in Design Layer and Filling an Indentation With Metallic Base Structure and Electroplating Structure

20230081618

2023-03-16

Connection method for chip and circuit board, and circuit board assembly and electronic device

20220338347

2022-10-20

Wiring substrate and method for manufacturing wiring substrate

20220312595

2022-09-29

Substrate, method for manufacturing substrate, and electronic device

20220240375

2022-07-28

CO-AXIAL VIA STRUCTURE AND MANUFACTURING METHOD OF THE SAME

20210407896

2021-12-30

Hermetic metallized via with improved reliability

20210298175

2021-09-23

Wired circuit board and imaging device

20210259107

2021-08-19

Wiring substrate

#10

20210068266

2021-03-04

GLASS WIRING SUBSTRATE AND COMPONENT-MOUNTED GLASS WIRING SUBSTRATE

#11

20210029836

2021-01-28

Methods of manufacturing a high impedance surface (HIS) enhanced by discrete passives

#12

20200288575

2020-09-10

Method of producing a wired circuit board

#13

20200205284

2020-06-25

Printed circuit board

#14

20200178398

2020-06-04

WIRING BOARD

#15

20200170102

2020-05-28

Printed circuit board and manufacturing method for the same

#16

20200165160

2020-05-28

Hermetic metallized via with improved reliability

#17

20200163229

2020-05-21

CIRCUIT BOARD AND METHOD OF MAKING CIRCUIT BOARD

#18

20200051461

2020-02-13

Microcontroller board for the learning and practice of coding

#19

20200037461

2020-01-30

Substrate connecting structure

#20

20200004154

2020-01-02

Forming conductive vias using a light guide

#21

20190313524

2019-10-10

Hermetic metallized via with improved reliability

#22

20190288398

2019-09-19

Printed wiring board

#23

20190254161

2019-08-15

Method for manufacturing flexible printed circuit board

#24

20190223286

2019-07-18

Circuit board and method for production thereof

#25

20190104615

2019-04-04

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#26

20180279474

2018-09-27

Printed wiring board

#27

20180279473

2018-09-27

Methods of forming blind vias for printed circuit boards

#28

20180139841

2018-05-17

Flexible printed circuit board, printed circuit board structure and method for manufacturing flexible printed circuit board

#29

20180062054

2018-03-01

Method of manufacturing support structures for lighting devices and corresponding device

#30

20160192490

2016-06-30

Printed circuit board and method of manufacturing the same

#31

20160155716

2016-06-02

Package substrate, semiconductor package and method of manufacturing the same

#32

20160081187

2016-03-17

Circuit board formation using organic substrates

#33

20160057857

2016-02-25

Circuit board formation using organic substrates

#34

20150163908

2015-06-11

Circuit board and manufacturing method thereof

#35

20140304977

2014-10-16

Fabrication process of stepped circuit board

#36

20140069705

2014-03-13

Printed circuit board and method for manufacturing the same

#37

20140054075

2014-02-27

Method for manufacturing printed circuit board

#38

20140000109

2014-01-02

Manufacturing method of substrate structure

#39

20130212877

2013-08-22

Manufacturing method of circuit board

#40

20130199035

2013-08-08

CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CARRIER

#41

20130062112

2013-03-14

FABRICATION METHOD FOR CARRIER SUBSTRATE, PRINTED CIRCUIT BOARD USING THE SAME, AND FABRICATION METHOD THEREOF

#42

20130000968

2013-01-03

1-Layer Interposer Substrate With Through-Substrate Posts

#43

20120302054

2012-11-29

Conductive structures for microfeature devices and methods for fabricating microfeature devices

#44

20120199389

2012-08-09

Method for manufacturing printed wiring board and printed wiring board

#45

20120174391

2012-07-12

Process for fabricating wiring board

#46

20120073865

2012-03-29

CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME

#47

20110155429

2011-06-30

Carrier substrate, fabrication method thereof, printed circuit board using the same, and fabrication method thereof

#48

20110088930

2011-04-21

Printed circuit board and manufacturing method thereof

#49

20110057324

2011-03-10

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#50

20100252303

2010-10-07

Circuit board and manufacturing method thereof

#51

20100236822

2010-09-23

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

#52

20100132876

2010-06-03

Manufacturing method of printed circuit board

#53

20100078213

2010-04-01

Method for manufacturing printed wiring board

#54

20100065319

2010-03-18

Wiring board and process for fabricating the same

#55

20100044876

2010-02-25

Conductive structures for microfeature devices and methods for fabricating microfeature devices

#56

20100018633

2010-01-28

Method of manufacturing printed circuit board

#57

20090308647

2009-12-17

Circuit board with buried conductive trace formed thereon and method for manufacturing the same

#58

20090288861

2009-11-26

CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHOD FOR MANUFACTURING THE SAME

#59

20090282674

2009-11-19

Electrical interconnect structure and process thereof and circuit board structure

#60

20090242255

2009-10-01

Wiring board with built-in electronic component and method of manufacturing same

#61

20090205852

2009-08-20

Circuit board and manufacturing method thereof

#62

20090199399

2009-08-13

Method for manufacturing board with built-in electronic elements

#63

20090101510

2009-04-23

Method of manufacturing high density printed circuit board

#64

20090098478

2009-04-16

Method of manufacturing multi-layer circuit board

#65

20090019693

2009-01-22

Method of manufacturing printed wiring board

#66

20080301936

2008-12-11

Method for interconnecting tracks present on opposite sides of a substrate

#67

20080264684

2008-10-30

Carrier member for transmitting circuits, coreless printed circuit board using the carrier member, and method of manufacturing the same

#68

20080209722

2008-09-04

Method for forming via hole having fine hole land

#69

20080196934

2008-08-21

Circuit board process

#70

20080136041

2008-06-12

Structure and method of making interconnect element having metal traces embedded in surface of dielectric

#71

20080128288

2008-06-05

Method of manufacturing a multi-layer wiring board using a metal member having a rough surface

#72

20080003414

2008-01-03

Printed circuit board

#73

20070243422

2007-10-18

METHOD FOR PRODUCING PRINTED CIRCUIT BOARD STRUCTURES COMPRISING VIA HOLES, ELECTRONIC DEVICE UNIT, AND USE OF A FLEXIBLE STRIP CONDUCTOR FILM IN THIS DEVICE

#74