238912 ⎘
Adhesive bonding and miscellaneous chemical manufacture; Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide; Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer; Peeling away backing with poking during delaminating, e.g. jabbing release sheet backing to remove wafer
Detaching a die from an adhesive tape by air ejection
#2Apparatus for separating a window and method for separating a window using the same
#3Semiconductor manufacturing apparatus and method of manufacturing semiconductor device
#4Chip ejecting apparatus
#5Apparatus for separating a window and method for separating a window using the same
#6System and method for peeling a semiconductor chip from a tape using a multistage ejector
#7Separation device and pickup system
#8Method for thermal-slide debonding of temporary bonded semiconductor wafers
#9Wafer-related data management method and wafer-related data creation device
#10Die eject assembly for die bonder
#11Method for detaching a semiconductor chip from a foil
#12Die bonding apparatus, die picking up apparatus and die picking up method
#13Device for releasing an interconnect layer that provides connection between a carrier and a wafer
#14Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same
#15Method for detaching a semiconductor chip from a foil
#16Method and apparatus for peeling protective tape
#17Substrate separating apparatus, load lock apparatus, substrate bonding apparatus, substrate separating method, and manufacturing method of a semiconductor apparatus
#18Pick-up method of die bonder and die bonder
#19Device for stripping a wafer from a carrier
#20METHOD AND APPARATUS FOR PEELING PROTECTIVE TAPE
#21Control and monitoring system for thin die detachment and pick-up
#22Apparatus for temporary wafer bonding and debonding
#23Apparatus for thermal-slide debonding of temporary bonded semiconductor wafers
#24Device for centering wafers
#25Apparatus for mechanically debonding temporary bonded semiconductor wafers
#26Device for thin die detachment and pick-up
#27Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method
#28System for peeling semiconductor chips from tape
#29System for peeling semiconductor chips from tape
#30Driving mechanism for chip detachment apparatus
#31Method and apparatus for picking up work piece and mounting machine