Method of making a piezoelectric device

Substrate treating apparatus and method for manufacturing semiconductor device

Method of fabricating printed circuit board having embedded multi-layer passive devices

Printed wiring board and method for manufacturing the same

Shielding base member manufacturing method

System for producing flexible circuits

System for information handling system motherboard assembly

Method of making circuitized substrate with signal wire shielding

Simultaneous and selective partitioning of via structures using plating resist

Method of manufacturing a liquid ejection head

Method of manufacturing liquid ejection head

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Circuit board and method for producing the same

Methods for establishing electrical connections by drawing one or both of an element of an electrical connector and a contact toward the other

Multilayer board manufacturing method

Method for assembling tiled detectors for ionizing radiation based image detection

Method of manufacturing wiring board

Method of manufacturing a multilayer wiring board

Method of making multilayered construction for use in resistors and capacitors

Substrate processing device and method of producing substrates

Method of fabricating multi-layered printed circuit board for optical waveguides

Multilayer substrate and method for producing same

Printed-wiring board, printed-circuit board and electronic apparatus

Multi-layer polymeric electronic device and method of manufacturing same

Wired circuit board and producing method thereof

Conductive member, disk drive using same, and conductive member fabricating method

Antenna designs for radio frequency identification tags

Small volume in vitro analyte sensor

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Method of aligning fluidic MST devices to a support member

Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method

Piezoelectric vibrator and fabricating method thereof

Method of making an electronic assembly

Connection substrate, multi-layer wiring board using the connection substrate, substrate for semiconductor package, and methods for manufacturing them

Method for manufacturing pressure detector

Method for providing a power inductor

Power inductor with reduced DC current saturation

Method of fabricating a conducting crossover structure for a power inductor

Thermal bonding structure and manufacture process of flexible printed circuit board

Re-assembly process for MEMS structures

Low profile ball-grid array package for high power

Method of fabricating rigid flexible printed circuit board

Wiring board incorporating components and process for producing the same

Tile-based routing method of a multi-layer circuit board and related structure

Laminated film for mounting a MST device to a support member

MST device for attachment to an adhesive surface

Miniature circuitry and inductive components and methods for manufacturing same

Captive wired test fixture

Method of attaching fluidic MST devices to a support member

Method of sealing a face of a MST device

Method of producing an inkjet printhead for an inkjet printer with a print engine controller

Apparatus for inserting, retaining and extracting a device from a compartment

Fill plated structure of inner via hole and manufacturing method thereof

Mandrel for electroformation of an orifice plate

Coupler resource module

Method for producing a captive wired test fixture and fixture therefor

Printed wiring board and method of manufacturing the same

Electronic device including a substrate structure and a process for forming the same

Method of manufacturing an ink jet head

Multi-layer printed circuit board comprising a through connection for high frequency applications

Laminated member for circuit board, method and apparatus for manufacturing of circuit board

Multi-layer printed wiring board including an alignment mark as an index for a position of via holes

Method of manufacturing wiring substrate to which semiconductor chip is mounted

Stacking method of green sheet and a manufacturing method of multilayer ceramic electronic device

Layer with discontinuity over fluid slot

Heat dissipating semiconductor package and fabrication method thereof

Manufacture method of a flexible multilayer wiring board

Electronic module comprising an element exposed on one surface and method for making same

Method of making circuitized substrate assembly

Wafer-level underfill process making use of sacrificial contact pad protective material

Method of fabricating printed circuit board having thin core layer

Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board

Method of making a circuitized substrate

Thermoplastic polyimide resin film, multilayer body and method for manufacturing printed wiring board composed of same

Method for manufacturing printed wiring board

Method to prevent damage to probe card

Method to prevent damage to probe card

Circuit board and processing method thereof

Wiring board manufacturing method

Holding/convey jig and holding/convey method

Method for manufacturing a surface acoustic wave device

Process for lining a surface using an organic film

Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof

Multilayered circuit substrate, semiconductor device and method of producing same

Circuit board with embedded component and method of manufacturing same

Method of making a printed circuit board

Method of constructing a structural circuit

Socket grid array

Multi-layered flexible print circuit board and manufacturing method thereof

Method of producing inkjet printhead

Method for forming a ceramic laminate

Methods and apparatus for holding circuit boards together

Method of making an electronic device housing

Wiring board and manufacturing method therefor

Semiconductor device and method for manufacture thereof, circuit board, and electronic instrument

Method for producing multilayer printed wiring board, multilayer printed wiring board, and electronic device

Electronic part manufacturing method and electronic part

Method for fastening two coplanar edges without a weld

Multilayer core board and manufacturing method thereof

Leadframe-based module DC bus design to reduce module inductance

Capacitive/resistive devices and printed wiring boards incorporating such devices and methods of making thereof

Structure of polymer-matrix conductive film and method for fabricating the same

Method for replacing defective PCB from PCB panel

Frame attaching process

Chip package structure, package substrate and manufacturing method thereof

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

Electronic parts packaging structure and method of manufacturing the same

Method forming split thin film capacitors with multiple voltages

Integrated circuit package

Method of manufacturing circuit board

Manufacturing method of a multi-layer circuit board with an embedded passive component

Encapsulated miniature hard disc drive

Piezoelectric/electrostrictive device

Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies

Manufacturing method of a multi-layer circuit board embedded with a passive component

Surface acoustic wave device

Method of fabricating a printed circuit board including an embedded passive component

Circuit board and method of manufacturing the same

Manufacturing process for a power distribution assembly of an electrical system

Method for producing a piezoelectric film actuator

Method for manufacturing inkjet head

Lamination-type piezoelectric element and manufacturing method thereof

Cooling of substrate using interposer channels

Wired circuit board

Multi-layer board manufacturing method

Method for making a microelectronic interposer

Method of electrically connecting a microelectronic component

Precise multi-pole magnetic component

Method for mounting electronic components on a substrate

Method for manufacturing single sided substrate

Printed wiring board without traces on surface layers enabling PWB's without solder resist

Connection structures for microelectronic devices and methods for forming such structures

Printed circuit board including embedded capacitors and method of manufacturing the same

Manufacturing process for a surface-mount metal-cavity package for an oscillator crystal blank

Methods of forming a contact array in situ on a substrate

Structure for controlled shock and vibration of electrical interconnects

Micro-bumps to enhance LGA interconnections

Method for processing a base that includes connecting a first base to a second base with an insulating film

Leadframe-based module DC bus design to reduce module inductance

Method for forming metal contacts on a substrate

Hot bar soldering method for soldering two circuit boards together

Electronic component embedded substrate and method for manufacturing the same

Method for producing ink-jet head and ink-jet head

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Printhead assembly with a laminated stack of ink distribution layers

Substrates including alignment fences

Multilayer printed wiring board and production method therefor

Method of fabricating high density printed circuit board

Slotted substrates and techniques for forming same

Method for manufacturing double-sided printed circuit board

Piezoelectric composite apparatus and a method for fabricating the same

Method for forming an element substrate

Method for manufacturing a liquid ejection element

Thermally isolated via structure

Method of manufacturing a wiring board

Multilayer circuit board and method for manufacturing the same

Piezoelectric/electrostrictive device

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Chip package substrate having soft circuit board and method for fabricating the same

Method of making a circuit board

Manufacturing method of a multi-layer circuit board with an embedded passive component

Method of forming printed circuit card

Modular method for manufacturing circuit board

Method for manufacturing tape wiring board

Micro-electromechanical fluid ejection device with an array of nozzle assemblies incorporating fluidic seals

Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions

Electronic assembly having multi-material interconnects

Method for fabricating electrical connection structure of circuit board

Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same

Modular board device, high frequency module, and method of manufacturing same

Components with posts and pads

Double-sided printed circuit board without via holes and method of fabricating the same

Method of fabricating a circuit board

Circuit board

Fabrication process circuit board with embedded passive component

Production method of suspension board with circuit

Wiring board, magnetic disc apparatus, and production method of wiring board

Small volume in vitro analyte sensor

Method for production of semiconductor package

Assembling structure of electronic apparatus and assembling method thereof

System and method for retaining cards in an information handling system

Method for increasing a production rate of printed wiring boards

Method for manufacturing a comb teeth type piezoelectric actuator

Wiring board and production method thereof, and semiconductor apparatus

Apparatus for forming modular sockets using flexible interconnects and resulting structures

Plating buss and a method of use thereof

Method of patterning wall and phosphor well matrix utilizing glass

Layered board and manufacturing method of the same, electronic apparatus having the layered board

Method for manufacturing circuit device

Circuit board assembly employing solder vent hole

Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board

Electronic and optoelectronic component packaging technique

Method and apparatus for carrying circuit assemblies

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Method for forming printed circuit board

Electronic component with shielding case and method of manufacturing the same

Piezoelectric/electrostrictive element and piezoelectric/electrostrictive device

Fabrication method for printed circuit board

Multilayer wiring board, manufacturing method therefor and test apparatus thereof

Structure for fixing printed circuit board and method of fixing thereof

Method for manufacturing a fluid ejection device

Method and structures for implementing customizable dielectric printed circuit card traces

Method of laminating low temperature co-fired ceramic (LTCC) Material

Board for printed wiring, printed wiring board, and method for manufacturing them

Laminate ceramic circuit board and process therefor

Circuit board device and method for board-to-board connection

Fusion bonded assembly with attached leads

Printed circuit board defective area transplant repair method

Selective area solder placement

Piezo-electric/electrostrictive device and method of manufacturing same

Flip-chip type semiconductor devices and conductive elements thereof

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Image forming apparatus and method of manufacturing electronic circuit using the same

Method to prevent damage to probe card

Method of embedding passive component within via

Method of fabricating electrical connection terminal of embedded chip

Electronic package with optimized lamination process

Wiring board and production method of wiring board

Method of manufacturing a contact sheet and socket including same

Bonding an interconnect to a circuit device and related devices

Method for manufacturing a high-efficiency thermal conductive base board

Method for making a microcircuit card

MICRO-BUMPS TO ENHANCE LGA INTERCONNECTIONS

Carrier substrates and conductive elements thereof

Electromagnetic shield assembly with opposed hook flanges

Multilayer wiring board incorporating carbon fibers and glass fibers

Method for manufacturing wiring substrate

Aluminum bonding member and method for producing same

Electronic device housing and systems and methods for forming same

Device for contacting patterned electrodes on porous substrates

Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module

Method of forming a slotted substrate with partially patterned layers

Method for manufacturing a potassium niobate deposited body

Microelectronic assembly formation with releasable leads

Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus

Flexible substrate, multilayer flexible substrate and process for producing the same

Method of attaching optical waveguide component to printed circuit board

Circuit board and method for manufacturing the same

Method of fabricating multilayer ceramic substrate

Method of manufacturing circuit forming board

Method for fabricating embedded thin film resistors of printed circuit board

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Multilayer printed wiring board and method of manufacturing the same

Method of manufacturing electronic device

Circuit board sub-assemblies, methods for manufacturing same, electronic signal filters including same, and methods, for manufacturing electronic signal filters including same

Inductor and method for producing the same

Chip package sealing method

Method of manufacturing multi-layer printed circuit board

Inductor and method for producing the same

Method for manufacturing multi-layer printed circuit board

Method for manufacturing an ink-jet head

Connection member and mount assembly and production method of the same

Method for manufacturing an inkjet head

Method for producing pH probes

Surface mounting structure for surface mounting an electronic component

Backup board for machining process

Method of producing printed circuit board with embedded resistor

Methods for manufacturing monolithic ink-jet printheads

Socket grid array

Electromagnetic shield with vee-slot panel joints

Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same

Method of fixing macro-objects to an electricity conducting- or semi-conducting surface by means of electrografting, surfaces thus obtained and applications thereof

Method for manufacturing a piezoelectric resonator

Wafer-level seal for non-silicon-based devices

Method for producing an integral ceramic circuit board

Method of manufacturing flexible wiring board

Production of via hole in flexible circuit printable board

Method for interconnecting an integrated circuit multiple die assembly

Room temperature metal direct bonding

Vibrating beam accelerometer

Apparatus for replacing defective PCB from PCB panel

Mounting system for high-mass heatsinks

Low profile multi-IC chip package connector

Routing element for use in semiconductor device assemblies

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel

Circuit substrate manufacturing method

Method of embedding components in multi-layer circuit boards

Methods and arrangements for hardware casing media to store data

Organic dielectric electronic interconnect structures and method for making

Methods of fabricating substrates including at least one conductive via

Method of forming a dielectric substrate having a multiturn inductor

System for reducing noise induced from reference plane currents

Conductive material and method for filling via-hole

Capacitor device and method of manufacturing the same

Method of manufacturing a probe card

Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same

Modular sockets using flexible interconnects

Method of manufacturing multilayer wiring substrate using temporary metal support layer

Method of manufacturing a structure body bonding with a glass substrate and semiconductor substrate

Multi-layer printed circuit board and method for manufacturing the same

Structure and method for laminating and fixing thin plate parts and method for fabricating ink-jet printer head

Wired circuit board holding sheet and production method thereof

Method of manufacturing a metal-ceramic circuit board

Printed circuit board with low cross-talk noise

Method for making a multilayer circuit

Device for coupling PCB sheet having position deciding jig part

Device for coupling PCB sheet

Closed loop backdrilling system