Method for fabricating wiring board provided with passive element

Methods to prevent mechanical flexure related BGA failure

Monolithic ceramic substrate and method for making the same

Method and device for through-hole plating of substrates and printed circuit boards

Manufacturing methods for printed circuit boards

System, method and apparatus for optimizing power delivery and signal routing in printed circuit board design

Securing solid-matrix panels for cutting using a tooling fixture

Wiring layout of auxiliary wiring package and printed circuit wiring board

Multi-layer circuit board and method for fabricating the same

Method for forming metal wires by microdispensing pattern

Device for coupling PCB sheet

Method to generate electrical current using a plurality of masses attached to piezoceramic supports

Large area alumina ceramic heater

Method for manufacturing a wiring board

Method of producing piezoelectric ceramic device

Method for manufacturing a piezoelectric resonator

Package substrate for integrated circuit and method of making the substrate

Process for producing a printed wiring board for mounting electronic components

Method for forming a microelectromechanical fluid ejection device

Method for manufacturing a sequential backplane

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

Duplexer using an embedded PCB and method of fabricating the same

Method of developing an electronic module

Bimorph MEMS devices

Method of producing a micro-actuator

Frame attaching process

Process for producing laminated ceramic capacitor

Method for manufacturing a matrix type actuator

Hyperbga buildup laminate

System for assembling computers to provide a favorable import classification

Printer having an inert gas supply arrangement

Bumped chip carrier package using lead frame and method for manufacturing the same

Manufacturing method of a multilayer printed wiring board

Solderless electronics packaging and methods of manufacture

Vibrating beam accelerometer two-wafer fabrication process

Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts

Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts

Method of fabricating an RF substrate with selected electrical properties

Method of fabricating a mandrel for electroformation of an orifice plate

Method of manufacturing LED light string

Robust interlocking via

Method for forming metal contacts on a substrate

Method of electrically connecting a microelectronic component

Packaging structure of a driving circuit for a liquid crystal display device and packaging method of driving circuit for a liquid crystal display device

Apparatus and method for improving coupling across plane discontinuities on circuit boards

Robust interlocking via

Formation of multisegmented plated through holes

Circuit board and liquid discharging apparatus

Film bulk acoustic resonator and method for manufacturing the same

Contact for semiconductor components

Method of manufacturing substrate for circuit board and smart label having the substrate

Solder paste stencil manufacturing system

Method for forming an electronic device in multi-layer structure

Method of producing an ink-jet printing head

Method of manufacturing a module

Method of making an interposer with contact structures

Method for fabricating anisotropic conductive substrate

Method of manufacturing a piezoelectric/electrostrictive device

Method for producing metal/ceramic bonding circuit board

Method for manufacturing medical device having embedded traces and formed electrodes

Method to prevent damage to probe card

Double-sided etching technique for semiconductor structure with through-holes

Multi-layered interconnect structure using liquid crystalline polymer dielectric

Connector sheet and wiring board, and production processes of the same

Method for manufacturing a surface acoustic wave device with a piezoelectric substrate

Electrical gripping testing and installation device

Method of fabricating a micro-electromechanical fluid ejection device

Method for manufacturing a piezoelectric oscillator

Coupler resource module

Method of making a circuitized substrate

Composite laminate circuit structure

Electronic part mounting substrate and method for producing same

Multi-device holding structure

Manufacturing method for precise multi-pole magnetic components

Probe card for use with microelectronic components, and methods for making same

Method of fabricating a substantially zero signal degradation electrical connection on a printed circuit broad

Method and device for forming an interposer for a glass and plate

Thermally actuated printhead unit having inert gas operating environment

System and method for processing capacitive signals

Back-to-back semiconductor device assemblies

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Method for making conductive circuits using powdered metals

Method of manufacturing optical modulator

Method of manufacturing a touch screen

Method of producing a piezoelectric/electrostrictive device

Circuit board design

Method for fabricating a film bulk acoustic resonator

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Methods for securing vertically mountable semiconductor devices in back-to back relation

Method of manufacturing an ink-jet head

Printed wiring board having impedance-matched differential pair signal traces

Process for manufacturing multilayer flexible wiring boards

Methods for retaining an electrical connector in a receptacle on an electrical component in a computer

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Information handling system utilizing circuitized substrate

Method for making a flat flex cable

Printed circuit board with a heat dissipation element and package comprising the printed circuit board

Computer enclosure

Method of a supporting a CGA integrated package on a circuit board with improved shock and vibration isolation

Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus

Multilayered substrate for semiconductor device and method of manufacturing same

Electronic device carrier and manufacture tape

Inverted microvia structure and method of manufacture

Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Wiring substrate for intermediate connection and multi-layered wiring board and their production

Circuit board with embedded components and method of manufacture

Bridge clip with reinforced stiffener

Method, system, and apparatus for transfer of dies using a pin plate

Extension mechanism and method for assembling overhanging components

Method for making liquid ejection head

Power inductor with reduced DC current saturation

Multilayer wiring board and manufacture method thereof

Multi-layer printed circuit board, and method for fabricating the same

Alternating voided areas of anti-pads

Circuitized substrate assembly and method of making same

Methods for filling holes in printed wiring boards

Multi-layer integrated circuit package

Method, system, and apparatus for transfer of dies using a die plate having die cavities

Method, system, and apparatus for authenticating devices during assembly

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Circuit board with built-in electronic component and method for manufacturing the same

Method for producing a circuit board

Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof

Coupling of conductive vias to complex power-signal substructures

Method of testing spacings in pattern of openings in PCB conductive layer

Method, system, and apparatus for high volume transfer of dies

Flexible substrate and a connection method thereof that can achieve reliable connection

Method of producing a multi-layered wiring board

Method for fabricating a substrate, including a plurality of chip package substrates

Manufacturing method for a printed circuit board

Panel-molded electronic assemblies

Panel-molded electronic assemblies

Orthogonal cross-connecting of printed circuit boards without a midplane board