METHOD FOR DETACHABLY ATTACHING A DEVICE TO A SUBSTRUCTURE

Method of manufactuing an electrical connector

Method of bonding terminal

Method and apparatus for fastening two coplanar edges without a weld

Method and apparatus for coupling a drive to a chassis

Method for fabricating three-dimensional all organic interconnect structures

Method for manufacturing an electronics module

Printed wiring board and its manufacturing method

Method for forming stacked via-holes in a multilayer printed circuit board

Part cartridge for mounter device

Apparatus for making circuitized substrates in a continuous manner

Method of manufacturing build-up printed circuit board

Method for forming a MEMS

Printed circuit board

Circuit apparatus and method of fabricating the apparatus

Substrate processing method and apparatus

Method for manufacturing a medical device having integral traces and formed electrodes

Composite wiring structure having a wiring block and an insulating layer with electrical connections to probes

Methods of manufacturing printed circuit boards with stacked micro vias

Manufacture of printed circuit boards with stubless plated through-holes

Process to open connection vias on a planarized surface

A METHOD AND SYSTEM FOR PLATED THRU HOLE PLACEMENT IN A SUBSTRATE

Probe interposers and methods of fabricating probe interposers

Method of manufacturing coreless substrate

Overmolded semiconductor package with a wirebond cage for EMI shielding

Multilayer printed wiring board and component mounting method thereof

Method of manufacturing printed circuit board including embedded capacitors

Probe interposers and methods of fabricating probe interposers

METHOD AND APPARATUS FOR FORMING MULTI-LAYERED CIRCUITS USING LIQUID CRYSTALLINE POLYMERS

METHOD AND APPARATUS FOR FORMING MULTI-LAYERED CIRCUITS USING LIQUID CRYSTALLINE POLYMERS

Room temperature metal direct bonding

Piezoelectric/electrostrictive device

Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member

Multilayer printed circuit board

Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member

Connection Method of Conductive Articles, and Electric or Electronic Component with Parts Connected By the Connection Method

PIEZOELECTRIC RESONATOR, PIEZOELECTRIC FILTER, DUPLEXER, COMMUNICATION APPARATUS, AND METHOD FOR MANUFACTURING PIEZOELECTRIC RESONATOR

Method for manufacturing inkjet head

Processes for manufacturing printed wiring boards

Method and device for manufacturing a conductive member for non-contact type data carrier

Method for manufacturing inkjet head, and inkjet head

Liquid ejection head and image forming apparatus including liquid ejection head

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Small form factor PCBA process carrier

Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same

Methods of making microelectronic assemblies

Ceramic multi-layer component and method for the production thereof

Inspecting circuit layout for LCD panel and fabricating method for LCD panel

Method for attaching a flexible structure to a device and a device having a flexible structure

Semiconductor package

Housing comprising a liquid-tight electric bushing

Printed circuit board having inner via hole and manufacturing method thereof

Method for manufacturing electronic components, mother substrate, and electronic component

Method for making a multilayered circuitized substrate

Component built-in wiring board and manufacturing method of component built-in wiring board

Method to reduce module inductance

Method for machining a board

Method of manufacturing circuit device

Electron attachment assisted formation of electrical conductors

Method of manufacturing small volume in vitro analyte sensors

Method of manufacturing composite electronic component

Nozzle arrangement with pairs of actuators

Method of forming a printhead

Injection molded energy harvesting device

Method and process for embedding electrically conductive elements in a dielectric layer

Method for manufacturing multilayer wiring board incorporating carbon fibers and glass fibers

Circuit board structure and method for fabricating the same

Method for fabricating circuit board with conductive structure

Method of forming a thin film capacitor

Multilayered piezoelectric element and method of manufacturing the same

Method of assembling a hearing aid

Method of manufacturing multi-layer wiring board

Power inductor with reduced DC current saturation

Methods for fabricating fences on interposer substrates

Methods of fabricating substrates including one or more conductive vias

Method of manufacturing a circuit board

Method for manufacturing a surface acoustic wave element having an interdigital transducer (IDT) electrode

Method for manufacturing an electronic module in an installation base

Method of fabricating conductor crossover structure for power inductor

MULTILAYER WIRING BOARD CAPABLE OF REDUCING NOISE OVER WIDE FREQUENCY BAND WITH SIMPLE STRUCTURE

Multilayer board with built-in chip-type electronic component and manufacturing method thereof

Method for manufacturing a film bulk acoustic resonator

Article having metal impregnated within carbon nanotube array

Thermally enhanced coreless thin substrate with embedded chip and method for manufacturing the same

Multilayer printed wiring board

Manufacturing method of flexible printed wiring board

Droplet discharging head and manufacturing method for the same, and droplet discharging device

High speed interconnect

Method of making circuitized substrate with split conductive layer and information handling system utilizing same

Composite circuit board and method for manufacturing the same

Manufacturing method of ink jet head

Circuit board having a multi-signal via

Method of making a thermally isolated via structure

METHOD FOR MANUFACTURING WIRING BOARD

Method for the production of a circuit board element

Method for manufacturing IC-embedded substrate

Method of making capacitive/resistive devices

Dielectric device and method of manufacturing the same

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Multilayer print circuit board

METHOD OF FORMING A NON-CONTINUOUS CONDUCTIVE LAYER FOR LAMINATED SUBSTRATES

Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member

Circuitry for printer

Printed circuit board

Method of fabricating inkjet printhead

Electrical interconnect with maximized electrical contact

Method of fabricating electrical connection terminal of embedded chip

Circuit substrate manufacturing method

Method of manufacturing printed circuit board having landless via hole

Circuit board module and forming method thereof

Method of Manufacturing A Probe Card

Angular encapsulation of tandem stacked printed circuit boards

Dielectric lamination structure, manufacturing method of a dielectric lamination structure, and wiring board including a dielectric lamination structure

Rigid flex interconnect via

Method for fabricating a printed circuit board having a coaxial via

CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

Method of manufacturing wiring substrate

Method of manufacturing wiring substrate and method of manufacturing electronic component mounting structure

Method for fabricating embedded thin film resistors of printed circuit board

Method of manufacturing a touch screen

Multilayered wiring board and method for fabricating the same

Method for producing parts for passive electronic components and parts produced

Method of manufacturing a laminated leadframe

Method of fabricating an RF substrate with selected electrical properties

High density printed circuit board and method of manufacturing the same

Circuit board and its manufacturing method

Thermally conductive interface

Method of improving the stability of a circuit board

Circuit board and method of manufacture thereof

Wafer scale heat slug system

Computer enclosure

Method of manufacturing circuit board

Ink-jet printing head

Method of manufacturing a monolithic ink-jet printhead

Optimizing power delivery and signal routing in printed circuit board design

Circuit board

Method of coating contacts on a surface of a flip chip

Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate

Frame packaged array electronic component

Printed wiring board

Multilayered printed circuit board and method for manufacturing the same

Methods for forming connection structures for microelectronic devices

Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument

Interposer and method for fabricating the same

Circuit board having a multi-signal via

Circuit board having a backdrilled multi-signal via

Electronic part mounting substrate and method for producing same

Method of making a printed circuit board with low cross-talk noise

Piezoelectric/electrostrictive device and method of manufacturing same

Printed wiring board and method of suppressing power supply noise thereof

Method of manufacturing actuator device for ink jet head

Composite electronic component

Circuit substrate

Method of fabricating inkjet nozzles having associated ink priming features

Encapsulated miniature hard disc drive

METHOD OF PRODUCING CIRCUIT CARRIERS WITH INTEGRATED PASSIVE COMPONENTS

Thermal contact arrangement

Interposer and electronic device fabrication method

Contact carriers (tiles) for populating larger substrates with spring contacts

Production method of suspension board with circuit

Method of constructing a membrane probe

Method of producing circuit board

Method and system for manufacturing a wireless communication device

CONNECTOR CHIP AND MANUFACTURING METHOD THEREOF

Method for structural enhancement of compression system board connections

Gel package structural enhancement of compression system board connections

High-speed flex printed circuit and method of manufacturing

Method of electrically connecting a microelectronic component

Embedded capacitor core having a multiple-layer structure

Selective consolidation methods for fabricating semiconductor device components and conductive features thereof

Manufacturing method for a wireless communication device and manufacturing apparatus

Modular sockets using flexible interconnects

Method of forming a conductive through hole for a piezoelectric substrate

Electronic component embedded board and its manufacturing method

Bonding structure with buffer layer and method of forming the same

Cable modem device and method of assembling the same

Method of manufacturing a micromachined polymer beam structure

Friction heating for joining dissimilar materials

Method of manufacturing wiring board

Apparatus for manufacturing a wiring board

Electronic component and method of manufacturing the same

Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrate

Built-up printed circuit board with stack type via-holes

Method for manufacturing a tamper-proof cap for an electronic module

Process of forming socket contacts

Cross-over of conductive interconnects and a method of crossing conductive interconnects

Multilayer capacitor and method for manufacturing multilayer capacitor

Multilayer printed wiring board and production method therefor

Method of producing a wiring board

Apparatus for making electronic devices

Method of manufacturing piezoelectric element and method of manufacturing liquid-jet head

High voltage over-current protection device and manufacturing method thereof

Circuit board and circuit apparatus using the same

Electronic parts packaging structure

Method of making an interposer with contact structures

Method and apparatus for forming multi-layered circuits using liquid crystalline polymers

Method for manufacturing multi-layered ceramic electronic component

Method of adjusting at least one optional setting of a process characteristic of a component placement device, as well as a component placement device and an electronic key

Flex-rigid wiring board

Method of selling integrated circuit dies for multi-chip packages

Board supporting mechanism, board supporting method, and component mounting apparatus and component mounting method using the same mechanism and method

Light emitting diode package and method for making same

Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same

Method of making mutilayered circuitized substrate assembly having sintered paste connections

Method for manufacturing a piezoelectric vibration device

Method and apparatus for marking a printed circuit board

Methods for assembling computers

Method for forming multilayer substrate

Apparatus and method for an embedded air dielectric for a package and a printed circuit board

Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriers

Method and structures for implementing customizable dielectric printed circuit card traces

Electronic circuit board assembly fixturing device and method of making electronic circuit board assemblies

Method of preparing an antenna

Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus

Split thin film capacitor for multiple voltages

Method for fluid injector

Film bulk acoustic resonator (FBAR) process using single-step resonator layer deposition

Interposers with alignment fences and semiconductor device assemblies including the interposers

Method of producing a piezoelectric actuator

Method for manufacturing a midplane

Closed loop backdrilling system

Electronic circuit protection device

Wiring board and method for manufacturing the same

Wiring board and manufacturing method of wiring board

Method of fabricating wiring board and method of fabricating semiconductor device

Soldermask opening to prevent delamination

Methods for assembling computers

Method of manufacturing a wiring substrate for ejection head

Power module package structure

Method of manufacturing glass substrate for magnetic disk

Thermally conductive interface

Method of installing a plug and play device driver and software

Interposer, method of fabricating the same, and semiconductor device using the same

Land grid array structures and methods for engineering change

Manufacturing method for wiring circuit substrate

Method for manufacturing an electronic part

Bank structure, wiring pattern forming method, device, electro-optical device, and electronic apparatus

Multilayer substrate and the manufacturing method thereof

Plating buss and a method of use thereof

Technique for accommodating electronic components on a multilayer signal routing device

Substrate precursor structures

Method for fabricating wiring board provided with passive element, and wiring board provided with passive element

Method for a low profile multi-IC chip package connector

Structure of flexible printed circuit board

Method for fabricating structure of polymer-matrix conductive film

Circuit board and process for producing the same

Anisotropic conductive coatings and electronic devices

Method of making circuitized substrate with filled isolation border

Method for manufacturing a composite layer for an electronic device

METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD

Method of forming an antenna on a circuit board

Circuit board with built-in electronic component and method for manufacturing the same

Structure of polymer-matrix conductive film and method for fabricating the same

Method for producing circuit-forming board and material for producing circuit-forming board

Method of manufacturing a metal-ceramic circuit board

Method of making a circuitized substrate

Apparatus and method for making circuitized substrates in a continuous manner

Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner

Method of manufacturing printed circuit board using imprinting process

Semiconductor package

Method for forming a conductive pattern and a wired board

Method for fabricating a monolithic fluid injection device

Method for manufacturing printed wiring board

Conductive elements

Modular sockets using flexible interconnects

Production method of a multilayer ceramic substrate

Multilayer printed wiring board

Methods of producing a composite substrate

Support board separating apparatus, and support board separating method using the same

Method of manufacturing wiring substrate having terminated buses

Assembly identification by mounting configuration

Plating buss and a method of use thereof

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Precasting multi-layer PCB process

Method of fabricating semiconductor chip assemblies

System and method for insertion and retention of a daughter card in a motherboard

Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface

Alignment fences and devices and assemblies including the same

Circuit device and manufacturing method thereof

Multilayer wiring board and its manufacturing method

Method for fabricating double-sided wiring board

Direct backlight module

Multilayer circuit board with embedded components and method of manufacture

Encapsulated miniature hard disc drive

Single or multi-layer printed circuit board with improved edge via design

Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof

Process for manufacturing printed circuit boards and a machine for this purpose

Method of production of multilayer ceramic electronic device

Apparatus and method of application and development

Method of forming an interconnection element

Re-assembly process for MEMS structures

Method of manufacturing a wiring board

Method for the manufacture of a piezoelectric element

Method and manufacturing a piezoelectric thin film element

Wiring board and method of manufacturing the same

Capacitor-embedded PCB having blind via hole and method of manufacturing the same

Holder for electronic component, holding sheet for electronic component, electronic module using holder, electronic module using holding sheet, lamination of electronic modules, method for manufacturing electronic module, and method for testing electronic module

Wiring board manufacturing method

METHOD FOR LAMINATING CHIPS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME