COATED ARTICLE AND METHOD FOR MANUFACTURING SAME

Mixed Composition Interface Layer and Method of Forming

Article, an intermediate product, and a method of making an article

LABELS

Metal-coated vertically aligned carbon nanofibers

Lightweight electronic device for automotive applications and method

Multilayer printed wiring board with filled viahole structure

FLEXIBLE CIRCUIT CHEMISTRY

LIGHTWEIGHT CIRCUIT BOARD WITH CONDUCTIVE CONSTRAINING CORES

INTEGRATED MICRO-OPTICAL SYSTEMS AND CAMERAS INCLUDING THE SAME

Electroless deposition of platinum on copper

Method of manufacturing conductive structures

COATED ARTICLE AND METHOD OF MAKING THE SAME

PAINT FINISH INCORPORATING DECORATIVE EFFECTS

Embedded structure

REINFORCED WOOD PRODUCT AND REINFORCEMENT COMPONENT

Production method of workpiece and workpiece with three-dimensional pattern

Foil laminate intermediate and method of manufacturing

Method of manufacturing a radio frequency identification device

Method of fabricating circuit board structure

Method for making short run radio frequency identification tags and labels

Ink composition for continuous deflected jet printing, especially on wet glass

SPLIT WAVE COMPENSATION FOR OPEN STUBS

Magnetic blocks with images thereon, systems and methods of making the same

Printed circuit board

LABELS

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Ceramic chip assembly

Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition

Article including a sol-gel coating equipped with a functional design and process for producing such an article

Biolaminate composite assembly including polylactic acid and natural wax laminate layer, and related methods

Ceramic metallic interlocked components and methods of making and using the same

Plating apparatus, plating method and multilayer printed circuit board

Flexible board

Aluminum-plastic composite structure

DECORATION FILM

Solventless laminating adhesive for flexible packaging laminations and laminated structures made with the adhesive

Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member

Method and apparatus for reliably laser marking articles

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USING THE CONDUCTIVE CONNECTING MATERIAL, AND METHOD FOR PRODUCING A CONNECTING TERMINAL

RECYCLING PROGRAM AND METHOD OF ENCOURAGING RECYCLING OF TARGET WASTE MATERIALS BY USE OF PRECIOUS METALS

Printed wiring board, electronic device, and printed wiring board manufacturing method

Ceramic coating systems and methods

Light control material for displaying color, information, and images

Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using same

LASER PARAMETER ADJUSTMENT

Method for producing wiring board and wiring board

Metallized polymeric film reflective insulation material

Aqueous ink composition and recorded article formed by using the same

Metallized polymeric film reflective insulation material

Decorative member

METHOD AND APPARATUS FOR REDUCING HEAT RELEASE AND SMOKE DENSITY

Method for Producing Sintered Magnet and alloy for sintered magnet

COMPOSITE COMPONENT HAVING A COVER LAYER

Method of Producing Laminated Body, and Laminated Body

CONTROL PANEL, KEYBOARD MODULE AND METHOD FOR THE MANUFACTURE THEREOF

Power module

Flip chip interconnection structure

Surface metal film material, method of producing surface metal film material, method of producing metal pattern material, and metal pattern material

Highly dielectric film

Dual surface treated injection molding article and method of manufacturing the same

LOCALIZATION OF NEAR-FIELD RESONANCES IN BOWTIE ANTENNAE: INFLUENCE OF ADHESION LAYERS

METHOD OF FABRICATING INJECTION-MOLDED PRODUCT

DEPOSITION OF NANOWIRES AND OTHER NANOSCALE OBJECTS ON SURFACES

Solar control coatings with discontinuous metal layer

Bonding with adhesive beads or plots

Cooling device

Method of attaching die to circuit board with an intermediate interposer

Flexible printed board

Reducing thermal expansion effects in semiconductor packages

Conductive layer including implanted metal ions

Ferroelectric component and manufacturing the same

Multi layer circuit board and manufacturing method of the same

Liquid barrier and method for making a liquid barrier

ARTICLE WITH A CERAMIC COATING AND METHOD FOR PRODUCING SUCH AN ARTICLE USING A LASER

Method for forming conductive patterns using microwave

Method of producing metal plated material

Materials and methods for immobilization of catalysts on surfaces and for selective electroless metallization

Flexible circuits

Multi-layer high moisture barrier polylactic acid film

LAMINATE AND COMPOSITE LAYER COMPRISING A SUBSTRATE AND A COATING, AND A PROCESS AND APPARATUS FOR PREPARATION THEREOF

Insert sheet and method for manufacturing the same

LABELS

Dyeing method of aluminum-based member, and aluminum-based member

LABELS

RUSTPROOF STEEL SHEET AND METHOD FOR MANUFACTURING THE SAME

Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the same

Metal nanowire thin-films

Phase-separated, epitaxial composite cap layers for electronic device applications and method of making the same

Decorating material with cubic effect

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

LABELS

METHOD FOR MAKING DEVICE HOUSING, AND DEVICE HOUSING

METHOD FOR MAKING A DESIRED PATTERN OF A METALLIC NANOSTRUCTURE OF A METAL

SHELL FOR ELECTRONIC DEVICE, METHOD OF FORMING THE SHELL AND ELECTRONIC DEVICE HAVING THE SAME

Photolithographic Patterning of Polymeric Materials

Method for surface treatment of copper and copper

Apparatus, a method for establishing a conductive pattern on a planar insulating substrate, the planar insulating substrate and a chipset thereof

Printed wiring board

Formed body with curved surface shape, method of producing the formed body, front cover for vehicle lighting device, and method of producing the front cover

Metal base circuit board

Hybrid structure of multi-layer substrates and manufacture method thereof

Hybrid structure of multi-layer substrates and manufacture method thereof

CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD

Barrier coatings for polymeric substrates

Etching piezoelectric material

Circuit board, its manufacturing method, and joint box using circuit board

Method of manufacturing heat radiation substrate having metal core

ELECTRODEPOSITING A METAL IN INTEGRATED CIRCUIT APPLICATIONS

Method of manufacturing printed circuit board

DEVICE HOUSING AND METHOD FOR MAKING THE SAME

Methods of making and using ceramic metallic interlocked components

Composite material for electrical/electronic part and electrical/electronic part using the same

Composite material for electric/electronic part, production method thereof, and electric/electronic part

Method of fabricating a solder pad structure

Complex sheet structure and cover lens assembly

Lightweight high stiffness composites having class A surface finish

Printed circuit board and method of manufacturing the same

Soldering work piece, soldering method and heat exchanger

Pressure sensor and boxing machine using the same

Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

Manufacturing method of flexible semiconductor device and flexible semiconductor device

Laminate and composite layer comprising a substrate and a coating, and a process and apparatus for preparation thereof

Precious metal thin-film laminate (PMTL)

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

Paint film composites and methods of making and using the same

COVERING TESSERA AND TESSERAE MANUFACTURING PROCESS

Labels

Resin sheet with copper foil, multilayer printed wiring board, method for manufacturing multilayer printed wiring board and semiconductor device

Self-aligned wafer bonding

Method for producing a lens pattern on roll

Silver alloy, sputtering target material thereof, and thin film thereof

Method for producing a film element

Method of manufacturing printed circuit board having metal bump

Paper Board and Making Method Thereof

METHODS FOR PREPARING METAL FILM-CARRYING SUBSTRATES, METAL FILM-CARRYING SUBSTRATES, METHODS FOR PREPARING METAL PATTERN MATERIALS, AND METAL PATTERN MATERIALS

Transparent conductor thin film formation

Lightweight circuit board with conductive constraining cores

Multi-layer composite materials comprising a plastic or metal foil, corresponding method of production and use thereof

Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto

Copper interconnect structure with amorphous tantalum iridium diffusion barrier

On-press development of imaged elements

Marking COlaser-transparent materials by using absorption-material-assisted laser processing

Method for Selective Adsorption of Noble Metal Onto Surface of Polymer

Method for producing highly mechanically demanded pieces and specially tools from low cost ceramics or polymers

Ceramic substrate part and electronic part comprising it

Vehicular oil pans

Pattern exposure method, conductive film producing method, and conductive film

METHOD OF PATTERNING MOLECULES ON A SUBSTRATE USING A MICRO-CONTACT PRINTING PROCESS

Anisotropic conductive joint package

Nanostructures including a metal

Multi-layer article for flexible printed circuits

Data carrier having identifiers

Method for manufacturing power module substrate, power module substrate, and power module

Tantalum carbide, method for producing tantalum carbide, tantalum carbide wiring and tantalum carbide electrode

Method for fabricating a laminated structure

Method of forming an interconnect joint

Biomaterial, joint prosthesis using the biomaterial and method of producing the same

MICRODEVICES CONTAINING PHOTORECOGNIZABLE CODING PATTERNS AND METHODS OF USING AND PRODUCING THE SAME

Optical article having anti-theft feature and a system and method for inhibiting theft of same

Organosilicon copolymer composites, method of manufacture, and articles formed therefrom

DEEP ANODIZATION

METALLIZATION PROCESS AND PRODUCT PRODUCED THEREBY

Copper clad laminate, prepreg and method of reducing signal loss

NOVEL COPOLYMER, NOVEL COPOLYMER-CONTAINING COMPOSITION, LAMINATE BODY, METHOD OF PRODUCING METAL FILM-COATED MATERIAL, METAL FILM-COATED MATERIAL, METHOD OF PRODUCING METALLIC PATTERN-BEARING MATERIAL AND METALLIC PATTERN-BEARING MATERIAL

Substrate warpage-reducing structure

Breathable low-emissivity metallized sheets

Erosion barrier for thermal barrier coatings

Organic polymer coating for protection against creep corrosion

LIGHT EMITTING DEVICE INCLUDING SEMICONDUCTOR NANOCRYSTALS

Exterior member, method of manufacturing exterior member, and electronic equipment casing

Substrate processing method

Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material

Pulsed laser micro-deposition pattern formation

Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board

EPOXY RESIN COMPOSITION, PREPREG USING THE EPOXY RESIN COMPOSITION, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate

Composite circuit substrate structure

ALUMINUM ALLOY SUBSTRATES HAVING A MULTI-COLOR EFFECT AND METHODS FOR PRODUCING THE SAME

Wiring board and method of manufacturing the same

Circuit board and structure using the same

Surface ornamental structure of an article and a method for ornamentally working the surface structure of the article

METHODS FOR PRODUCING PATTERN-FORMING BODY

Surface modifying agent, laminated structure and transistor including the same, and method of manufacturing the laminated structure

Method of forming metal wiring and metal wiring formed using the same

Security element

Metallized cutlery and tableware and method therefor

Substrates having voltage switchable dielectric materials

Thin films of conjugated polymers containing inorganic nanoparticles and process for the manufacture thereof

Metal-Plastic-Hybrid Casing Component

Randomized circular grids for low-scatter EM shielding of a sensor window

Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package

Polymer substrate for flexible display having enhanced flexibility

COATED NON-METALLIC SHEET HAVING A BRUSHED METAL APPEARANCE, AND COATINGS FOR AND METHOD OF MAKING SAME

Method of manufacturing a circuit board

Multi-layer embedded capacitance and resistance substrate core

Mobile phone shell and method of manufacturing the same

Ultrasonic injection molding on a web

Deposition of nanocrystalline calcite on surfaces by a tissue and cellular biomineralization

Flip chip mounting process and flip chip assembly

METAL STRUCTURAL BODY-CONTAINING POLYMER FILM, METHOD FOR MANUFACTURING METAL STRUCTURAL BODY-CONTAINING POLYMER FILM, AND METHOD FOR MANUFACTURING PATTERNED STRUCTURAL BODY

INKS AND COATINGS FOR THE PRODUCTION OF OXYGEN SENSITIVE ELEMENTS WITH IMPROVED PHOTOSTABILITY

High aspect ratio electroplated metal feature and method

OXYGEN SENSITIVE MATERIAL, SENSORS, SENSOR SYSTEMS WITH IMPROVED PHOTOSTABILITY

Thermosetting composition and printed circuit board using the same

Thermoplastic polyhydroxy polyether resin and resin composition comprising the same

Photosensitive resin composition, dry film, and processed product made using the same

Printed circuit board with multiple metallic layers and method of manufacturing the same

Barrier coatings for polymeric substrates

Process for manufacturing a ceramic element for a watch case and element obtained by this process

Resin composition for forming insulating layer of printed wiring board

METHOD TO DECREASE WARPAGE OF MULTI-LAYER SUBSTRATE AND STRUCTURE THEREOF

Foam-like structures based on reactive composite materials

Device housing and manufacturing method for fabricating the same

Multilayer printed wiring board with filled viahole structure

Wiring material, wiring substrate and manufacturing method thereof, display panel, fine particle thin film material, substrate including thin film layer and manufacturing method thereof

Methods utilizing scanning probe microscope tips and products therefor or produced thereby

MICROPARTS AND APPARATUS FOR SELF-ASSEMBLY AND ALIGNMENT OF MICROPARTS THEREOF

Monolithic electronic component and method for manufacturing monolithic electronic component

COATING FOR MICROWAVABLE FOOD PRODUCT

VEHICLE DECORATIVE TRIM

Method for producing a ceramic compact

Sealing glass composition and article

Multifunctional radiation-hardened laminate

METHOD FOR MOUNTING ELECTRONIC-COMPONENT MODULE, METHOD FOR MANUFACTURING ELECTRONIC APPARATUS USING THE SAME, AND ELECTRONIC-COMPONENT MODULE

Photosensitive resin composition, dry film, and processed product made using the same

Ceramic compact, ceramic part, method for producing ceramic compact, and method for producing ceramic part

Multilayer circuit board and method for manufacturing the same

In mold lamination of decorative products

METHOD FOR METALLIZING A COMPONENT

Electrocast Sticker

Laminate

Preparation of a component for use in a joint

Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device

Multi-layer chip carrier and process for making

Multi-layer embedded capacitance and resistance substrate core

Method of nickel-gold plating and printed circuit board

Method for producing an LTCC substrate

PRINTING APPARATUS, PRINTING METHOD, PROGRAM AND PRINTED PRODUCT

Machine Readable Code Comprising Ultra-Violet Curable Gellant Inks

Electroless Deposition of Platinum on Copper

ANODES WITH CORNER AND EDGE MODIFIED DESIGNS

HEAT-RADIATING PATTERN

Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board

Multilayer-wired substrate

Photonic crystal security device

Prepreg, printed wiring board, multilayer circuit board, and process for manufacturing printed wiring board

Formation method of metal layer on resin layer, printed wiring board, and production method thereof

NANO MATERIAL CLUSTER STRUCTURE

Methods utilizing scanning probe microscope tips and products therefor or produced thereby

Patterned inorganic film, piezoelectric device, and process for producing the same

Method for making embedded circuit structure

Electrodeposited copper foil, its manufacturing method, surface-treated electrodeposited copper foil using the electrodeposited copper foil, and copper-clad laminate and printed wiring board using the surface-treated electrodeposited copper foil

Plated article having metal thin film formed by electroless plating, and manufacturing method thereof

DECORATIVE FOIL

Interlayer dielectric film with carrier material and multilayer printed circuit board therewith

Ink composition for inkjet printing by the continuous deflected jet technique

Circuit board and method of manufacturing the same

Laminated Decorative Strip and Method for the Producion of a Laminated Decorative Strip

Organic silver complex compound used in paste for conductive pattern forming

Flexible heated planar element

Method of manufacturing printed circuit board

Decorative article having a white coating

BIOLAMINATE COMPOSITE ASSEMBLY AND RELATED METHODS

Circuit materials, circuits laminates, and method of manufacture thereof

Manufacturing method of flexible semiconductor device and flexible semiconductor device

Devices having vertically-disposed nanofabric articles and methods of making the same

Method for the production of structured layers of titanium and nickel

Method for coating a metallic substrate with a powder coating composition and an autodepositable coating composition

Multilayer ceramic substrate and method for manufacturing the same

CIRCUIT BOARD STRUCTURE

ULSI wiring and method of manufacturing the same

Curable resin composition, halogen-free resin substrate, and halogen-free build-up printed wiring board

Metal films, methods for production thereof, methods for production of laminated electronic components, and laminated electronic components

Process for preparing light transmissive electromagnetic wave shielding material, light transmissive electromagnetic wave shielding material and display filter

Photonic crystal security device

Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit

Graphene pattern and process of preparing the same

Manufacturing method of metal structure in multi-layer substrate and structure thereof

ARTICLES AND METHODS INCLUDING PATTERNED SUBSTRATES FORMED FROM DENSIFIED, ADHERED METAL POWDERS

Curable resin films

Cover for camouflage against electromagnetic radiation

Metal Composite Laminate for Producing Flexible Wiring Board and Flexible Wiring Board

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF

HIGHLY DIELECTRIC FILM

Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices

Electromagnetically transparent bright resin products and processes for production

Conductive ink formulations

Process for making self-patterning substrates and the product thereof

Heat radiation substrate having metal core and method of manufacturing the same

Metal compositions, thermal imaging donors and patterned multilayer compositions derived therefrom

Multilayer ceramic substrate, method for producing same, and electronic component

Braze join

SYNTHETIC CERAMIC TILE AND METHOD FOR PRODUCING THE SAME

Methods for improving selectivity of electroless deposition processes

Coating methods and apparatus using pre-formed ceramic mask

Electromechanical memory array using nanotube ribbons and method for making same

Method for forming metal pattern, metal pattern and printed wiring board

ELECTRICALLY CONDUCTIVE PASTE AND MULTILAYER CERAMIC SUBSTRATE

Method of producing metal plated material, metal plated material, method of producing metal pattern material, and metal pattern material