Wolfgang Molzer

METHODS AND APPARATUS TO COOL HOTSPOTS IN INTEGRATED CIRCUIT PACKAGES

THERMAL INTERFACE MATERIAL ON A SURFACE OF A DIE IN A CAVITY

VIAS THROUGH A DIE THAT ARE ELECTRICALLY ISOLATED FROM ACTIVE CIRCUITRY IN THE DIE

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT AND HEAT PATH

SUBSTRATE FOR IMPROVED HEAT DISSIPATION AND METHOD

INTEGRATED CIRCUIT PACKAGES HAVING REDUCED Z-HEIGHT

MICROELECTRONIC ASSEMBLIES INCLUDING STIFFENERS AROUND INDIVIDUAL DIES

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBSTRATE

PACKAGING ARCHITECTURE WITH REINFORCEMENT STRUCTURE IN PACKAGE SUBSTRATE

Semiconductor Package, Semiconductor Die and Method for Forming a Semiconductor Package or a Semiconductor Die

TRANSFORMERS BASED ON BURIED POWER RAIL TECHNOLOGY

BURIED POWER RAILS INTEGRATED WITH DECOUPLING CAPACITANCE

Semiconductor Die, Heat Spreader, Semiconductor Package, Semiconductor Device, and Methods

Back Side Power Supply for Electronic Devices

Stress relief die implementation

Method and device for temperature control in a radio receiver

HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

Methods of forming low noise semiconductor devices

Die edge side connection

Package vias for radio frequency antenna connections

Stacked microelectronic dice embedded in a microelectronic substrate

MULTIPLE LEVEL REDISTRIBUTION LAYER FOR MULTIPLE CHIP INTEGRATION

Low noise semiconductor devices