Munich
Germany
59
2022-10-20
The entities that hold a legal rights for patent applications filed by inventor Meyer-Berg Georg:
Georg Meyer-Berg from Munich, DE has applied for patents for these inventions. The list has both pending applications and granted patents:
Semiconductor device
#2 | 2022-04-07Semiconductor device
#3 | 2020-12-17Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier
#4 | 2020-08-20Semiconductor device
#5 | 2019-09-19Chip package with cross-linked thermoplastic dielectric
#6 | 2019-07-18Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#7 | 2019-04-25Semiconductor device
#8 | 2019-04-11Semiconductor die attach system and method
#9 | 2019-04-04Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement
#10 | 2018-12-06Method for handling a product substrate and a bonded substrate system
#11 | 2018-06-07Chip package and a wafer level package
#12 | 2017-08-17Semiconductor device including an antenna
#13 | 2017-08-03Attaching chip attach medium to already encapsulated electronic chip
#14 | 2016-12-08Arrangement of multiple power semiconductor chips and method of manufacturing the same
#15 | 2016-07-28Device comprising a ductile layer and method of making the same
#16 | 2016-07-28Method for handling a product substrate, a bonded substrate system and a temporary adhesive
#17 | 2016-06-30Chip package and a wafer level package
#18 | 2016-05-05Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module
#19 | 2015-07-16Semiconductor device
#20 | 2015-06-04Electronic component with sheet-like redistribution structure
#21 | 2015-04-30Redistribution layer and method of forming a redistribution layer
#22 | 2015-01-29Chip package with passives
#23 | 2015-01-29Chip package with embedded passive component
#24 | 2015-01-01Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery
#25 | 2014-12-04Packaged semiconductor device having an embedded system
#26 | 2014-09-18Chip arrangement and a method of manufacturing a chip arrangement
#27 | 2014-06-05Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
#28 | 2014-05-29Device comprising a ductile layer and method of making the same
#29 | 2014-05-22Method for fabricating an electronic component
#30 | 2014-05-22Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit
#31 | 2014-05-08Packaged nano-structured component and method of making a packaged nano-structured component
#32 | 2014-05-01Semiconductor device with encapsulant
#33 | 2014-01-30Electric device package comprising a laminate and method of making an electric device package comprising a laminate
#34 | 2014-01-23Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
#35 | 2013-12-19Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package
#36 | 2013-05-16Sensor device and method
#37 | 2013-04-25Semiconductor device and method
#38 | 2013-04-04Integrated circuit package and a method for manufacturing an integrated circuit package
#39 | 2013-03-21Device including a semiconductor chip and metal foils
#40 | 2012-12-20Semiconductor device and manufacturing of the semiconductor device
#41 | 2012-11-15Integrated circuit package and packaging methods
#42 | 2012-11-15Integrated circuit package and packaging methods
#43 | 2012-10-18Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
#44 | 2012-05-24Sensor device having a structure element
#45 | 2012-03-15Die structure, die arrangement and method of processing a die
#46 | 2011-12-08Semiconductor package with integrated inductor
#47 | 2011-09-29Encapsulated semiconductor chip with external contact pads and manufacturing method thereof
#48 | 2011-09-22SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#49 | 2011-08-11Manufacturing of a device including a semiconductor chip
#50 | 2010-08-12Chip assembly
#51 | 2010-06-03Device including a semiconductor chip and metal foils
#52 | 2010-05-27Device including a semiconductor chip
#53 | 2010-04-01METHOD OF PRODUCING SEMICONDUCTOR DEVICES
#54 | 2009-11-05Semiconductor device package interconnections
#55 | 2009-07-02SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#56 | 2007-10-04Ball grid array housing having a cooling foil
#57 | 2007-05-10Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same
#58 | 2007-04-12Semiconductor module having a coupling substrate, and methods for its production
#59 | 2005-12-08Ball grid array housing having a cooling foil
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