Suwon-Si
South Korea
19
2019-10-24
The entities that hold a legal rights for patent applications filed by inventor JO Eun Jung:
Eun Jung JO from Suwon-Si, KR has applied for patents for these inventions. The list has both pending applications and granted patents:
Fan-out semiconductor package including stacked chips
#2 | 2019-08-29Fan-out semiconductor package
#3 | 2019-06-20Fan-out semiconductor package and package on package including the same
#4 | 2019-06-20Semiconductor package
#5 | 2019-05-30SEMICONDUCTOR PACKAGE
#6 | 2018-08-16Fan-out semiconductor package
#7 | 2018-07-05Fan-out semiconductor package
#8 | 2018-04-19Manufacturing method of an electronic component module
#9 | 2018-03-15Fan-out semiconductor package
#10 | 2016-01-21Semiconductor package and method of manufacturing the same
#11 | 2015-08-13SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#12 | 2015-08-06Electronic component module and manufacturing method thereof
#13 | 2015-06-25SEMICONDUCTOR PACKAGE MODULE
#14 | 2015-06-11NESTED MODULE PACKAGE, AND METHOD FOR MANUFACTURING SAME
#15 | 2015-06-04MICRO ELECTRO MECHANICAL SYSTEMS SENSOR MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#16 | 2015-05-14Electronic component module and manufacturing method thereof
#17 | 2015-05-14ELECTRONIC COMPONENT MODULE AND MANUFACTURING METHOD THEREOF
#18 | 2015-04-02External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same
#19 | 2015-04-02EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL AND METHOD OF MANUFACTURING THE SAME
1115910 ⎘