Frank Püschner

CHIP MODULE HAVING CONTACT SURFACE WITH DUAL-LAYER PROTECTIVE COATING

METHOD FOR PRODUCING A SMART CARD INLAY, SMART CARD INLAY AND SMART CARD

ELECTRONIC INHALATION APPARATUS WITH A CHIP MODULE FIXED WITH A FOLDING STRUCTURE

WAFER-LEVEL PACKAGE SENSOR DEVICE

CHIP ASSEMBLY, METHOD FOR FORMING A CHIP ASSEMBLY, AND METHOD FOR USING A CHIP ARRANGEMENT

CHIP ARRANGEMENT

CHIP-INTERCONNECT ARRANGEMENT, METHOD FOR FORMING A CHIP-INTERCONNECT ARRANGEMENT, DOCUMENT STRUCTURE AND METHOD FOR FORMING A DOCUMENT STRUCTURE

SMART CARD MODULE, SMART CARD MODULE ARRANGEMENT AND SMART CARD

PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FORMING A CHIP CARD

Method of electrically isolating shared leads of a lead frame strip

Integrated circuit arrangement

Chip module and chip card

Chipcard with contact areas and method for producing contact areas

Module for contactless chip cards or identification systems

Method for producing laminated smart cards

Chip card module

Chip module

Chip module

Chip card module

Method and system for producing conductive patterns on a substrate

Method for producing a BGA chip module and BGA chip module

Chip card

Module for contactless chip cards or identification systems

Data carrier card