Inventor profile of:

David E. Lazovsky

City:

Los Gatos, California

Country:

United States

Published Applications:

30

Last publication date:

2016-02-11

Top Assignees for applications by David E. Lazovsky

The entities that hold a legal rights for patent applications filed by inventor Lazovsky David E.:

Recent patent applications by Lazovsky David E.

David E. Lazovsky from Los Gatos, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2016-02-11
US20160042991A1
Electricity

Molecular self-assembly in substrate processing

#2 | 2015-10-29
US20150310910A1
Physics

Multi-level memory array having resistive elements for multi-bit data storage

#3 | 2015-10-08
US20150287616A1
Electricity

Methods for Discretized Processing and Process Sequence Integration of Regions of a Substrate

#4 | 2015-08-20
US20150236260A1
Electricity

Creating an embedded ReRAM memory from a high-k metal gate transistor structure

#5 | 2015-06-25
US20150179500A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#6 | 2015-02-26
US20150056723A1
Electricity

Processing Substrates Using Site-Isolated Processing

#7 | 2015-01-22
US20150021774A1
Electricity

Molecular self-assembly in substrate processing

#8 | 2014-10-30
US20140319449A1
Electricity

Creating an embedded ReRAM memory from a high-k metal gate transistor structure

#9 | 2014-08-21
US20140230955A1
Performing operations; transporting

Systems for Discretized Processing of Regions of a Substrate

#10 | 2014-08-14
US20140227871A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#11 | 2014-06-26
US20140177315A1
Physics

Multi-level memory array having resistive elements for multi-bit data storage

#12 | 2014-03-13
US20140070213A1
Electricity

Methods for discretized processing and process sequence integration of regions of a substrate

#13 | 2013-09-19
US20130244425A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#14 | 2013-04-25
US20130099363A1
Electricity

Molecular self-assembly in substrate processing

#15 | 2013-03-21
US20130072026A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#16 | 2013-03-07
US20130056101A1
Electricity

Methods for discretized processing and process sequence integration of regions of a substrate

#17 | 2012-10-11
US20120258595A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#18 | 2012-09-06
US20120225553A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#19 | 2012-03-01
US20120048829A1
Electricity

Methods for discretized processing and process sequence integration of regions of a substrate

#20 | 2012-02-23
US20120043298A1
Electricity

Methods for discretized processing and process sequence integration of regions of a substrate

#21 | 2012-01-26
US20120021553A1
Electricity

Methods for discretized processing and process sequence integration of regions of a substrate

#22 | 2011-11-17
US20110281402A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#23 | 2011-07-21
US20110177236A1
Electricity

Molecular self-assembly in substrate processing

#24 | 2011-07-21
US20110175228A1
Electricity

Molecular self-assembly in substrate processing

#25 | 2011-07-07
US20110163424A1
Electricity

Molecular self-assembly in substrate processing

#26 | 2011-05-05
US20110101536A1
Performing operations; transporting

Methods for discretized formation of masking and capping layers on a substrate

#27 | 2011-01-27
US20110021015A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric regions

#28 | 2008-10-09
US20080246150A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#29 | 2006-11-23
US20060264020A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

#30 | 2006-11-23
US20060261434A1
Electricity

Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region

InventorID:

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