Michael Haverty

SELECTIVE DEPOSITION OF LINER LAYER

ELECTRON-WITHDRAWING FUNCTIONAL GROUPS ON SI-CHALCOGEN PRECURSORS

TITANIUM NITRIDE GAPFILL PROCESSES FOR SEMICONDUCTOR DEVICES

METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS

METHODS OF FORMING INTERCONNECT STRUCTURES

METHODS OF FORMING INTERCONNECT STRUCTURES

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

TANTALUM DOPED RUTHENIUM LAYERS FOR INTERCONNECTS

Metal Surface Blocking Molecules for Selective Deposition

Methods for depositing blocking layers on conductive surfaces

CONDUCTIVE OXIDE SILICIDES FOR RELIABLE LOW CONTACT RESISTANCE

SILICIDES, ALLOYS AND INTERMETALLICS TO MINIMIZE RESISTANCE

LOW CONTACT RESISTANCE UNSILICIDES FOR SEMICONDUCTOR APPLICATIONS

Chalcogen precursors for deposition of silicon nitride

DOPED TANTALUM-CONTAINING BARRIER FILMS

Integrated contact silicide with tunable work functions

NOVEL OXIDANTS AND STRAINED-RING PRECURSORS

Methods for depositing blocking layers on conductive surfaces

Chalcogen precursors for deposition of silicon nitride

Crested barrier device and synaptic element

Ruthenium film deposition using low valent metal precursors

LOW TEMPERATURE ALD OF METAL OXIDES

COMPOSITE MATERIALS FOR USE IN SEMICONDUCTOR COMPONENTS

Polymer interlayer dielectric and passivation materials for a microelectronic device

METAL INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES

REDUCING RESISTIVITY IN METAL INTERCONNECTS USING INTERFACE CONTROL

REDUCING RESISTIVITY IN METAL INTERCONNECTS BY COMPRESSIVE STRAINING

Reducing internal film stress in dielectric film