Inventor profile of:

Daniel J. Woodruff

City:

Kalispell, Montana

Country:

United States

Published Applications:

62

Last publication date:

2022-01-06

Top Assignees for applications by Daniel J. Woodruff

The entities that hold a legal rights for patent applications filed by inventor Woodruff Daniel J.:

Recent patent applications by Woodruff Daniel J.

Daniel J. Woodruff from Kalispell, US has applied for patents for these inventions. The list has both pending applications and granted patents:

#1 | 2022-01-06
US20220004104A1
Physics

Method and apparatus for post exposure processing of photoresist wafers

#2 | 2019-06-20
US20190187563A1
Physics

Method and apparatus for post exposure processing of photoresist wafers

#3 | 2018-10-18
US20180298513A1
Chemistry; metallurgy

Microelectronic substrate electro processing system

#4 | 2017-12-21
US20170363960A1
Physics

Method and apparatus for post exposure processing of photoresist wafers

#5 | 2017-06-01
US20170154797A1
Electricity

Method and apparatus for post exposure processing of photoresist wafers

#6 | 2016-12-01
US20160348263A1
Chemistry; metallurgy

Electroplating apparatus

#7 | 2015-03-19
US20150075976A1
Chemistry; metallurgy

ELECTROPLATING PROCESSOR WITH GEOMETRIC ELECTROLYTE FLOW PATH

#8 | 2014-12-18
US20140367267A1
Chemistry; metallurgy

Electroplating tool with feedback of metal thickness distribution and correction

#9 | 2014-09-18
US20140266219A1
Physics

DETECTING ELECTROLYTE MENISCUS IN ELECTROPLATING PROCESSORS

#10 | 2014-09-18
US20140262795A1
Chemistry; metallurgy

ELECTROPLATING PROCESSOR WITH VACUUM ROTOR

#11 | 2014-06-05
US20140151218A1
Chemistry; metallurgy

Electroplating processor with thin membrane support

#12 | 2013-11-14
US20130299343A1
Chemistry; metallurgy

Electroplating processor with geometric electrolyte flow path

#13 | 2013-03-28
US20130075265A1
Chemistry; metallurgy

APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROFEATURE WAFERS

#14 | 2013-03-14
US20130061875A1
Chemistry; metallurgy

Component cleaning in a metal plating apparatus

#15 | 2012-03-15
US20120060869A1
Chemistry; metallurgy

Single workpiece processing chamber

#16 | 2012-02-16
US20120037495A1
Chemistry; metallurgy

Deplating contacts in an electrochemical plating apparatus

#17 | 2011-02-24
US20110042224A1
Chemistry; metallurgy

Apparatus and methods for electrochemical processing of microfeature wafers

#18 | 2010-04-01
US20100078334A1
Chemistry; metallurgy

Electro-chemical processor

#19 | 2008-07-31
US20080181758A1
Electricity

Microfeature workpiece transfer devices with rotational orientation sensors, and associated systems and methods

#20 | 2008-07-31
US20080179180A1
Chemistry; metallurgy

Apparatus and methods for electrochemical processing of microfeature wafers

#21 | 2008-07-31
US20080178460A1
Electricity

Protected magnets and magnet shielding for processing microfeature workpieces, and associated systems and methods

#22 | 2008-07-01
US10733807
-

Integrated microfeature workpiece processing tools with registration systems for paddle reactors

#23 | 2008-04-15
US10234638
-

Electroplating apparatus with segmented anode array

#24 | 2008-02-28
US20080048306A1
Electricity

Electro-chemical processor

#25 | 2008-02-26
US10194939
-

End-effectors for handling microelectronic wafers

#26 | 2008-01-17
US20080011334A1
Electricity

Single side workpiece processing

#27 | 2008-01-03
US20080003781A1
Chemistry; metallurgy

Electro-chemical processor

#28 | 2007-10-16
US10195137
-

End-effectors for handling microelectronic workpieces

#29 | 2007-07-05
US20070151844A1
Chemistry; metallurgy

Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces

#30 | 2007-06-28
US20070144912A1
Chemistry; metallurgy

Linearly translating agitators for processing microfeature workpieces, and associated methods

#31 | 2007-05-31
US20070121123A1
Electricity

End point detection in workpiece processing

#32 | 2007-05-17
US20070110895A1
Electricity

SINGLE SIDE WORKPIECE PROCESSING

#33 | 2007-05-10
US20070104559A1
Electricity

End-effectors for handling microelectronic workpieces

#34 | 2007-01-18
US20070014656A1
Electricity

End-effectors and associated control and guidance systems and methods

#35 | 2007-01-11
US20070009344A1
Electricity

Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces

#36 | 2007-01-04
US20070000527A1
Electricity

Workpiece support for use in a process vessel and system for treating microelectronic workpieces

#37 | 2006-10-12
US20060226019A1
Chemistry; metallurgy

Die-level wafer contact for direct-on-barrier plating

#38 | 2006-10-10
US10154426
-

Electroplating reactor

#39 | 2006-08-08
US8680067
-

Plating system for semiconductor materials

#40 | 2006-07-11
US10157762
-

Modular semiconductor workpiece processing tool

#41 | 2006-06-29
US20060141809A1
Electricity

Single side workpiece processing

#42 | 2006-02-23
US20060037855A1
Chemistry; metallurgy

Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces

#43 | 2006-02-21
US10721057
-

Semiconductor processing apparatus having lift and tilt mechanism

#44 | 2006-01-31
US10080914
-

Apparatus for manually and automatically processing microelectronic workpieces

#45 | 2005-12-20
US10620326
-

End-effectors and transfer devices for handling microelectronic workpieces

#46 | 2005-09-15
US20050199503A1
Chemistry; metallurgy

Single workpiece processing chamber with tilting load/unload upper rim

#47 | 2005-09-08
US20050193537A1
Electricity

Modular semiconductor workpiece processing tool

#48 | 2005-09-01
US20050189213A1
Electricity

Method and apparatus for copper plating using electroless plating and electroplating

#49 | 2005-07-28
US20050161336A1
Chemistry; metallurgy

Electroplating apparatus with segmented anode array

#50 | 2005-07-28
US20050161320A1
Chemistry; metallurgy

Electroplating apparatus with segmented anode array

#51 | 2005-07-26
US9882293
-

Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces

#52 | 2005-07-21
US20050155864A1
Electricity

Adaptable electrochemical processing chamber

#53 | 2005-07-12
US9875365
-

Adaptable electrochemical processing chamber

#54 | 2005-05-26
US20050109612A1
Chemistry; metallurgy

Electroplating apparatus with segmented anode array

#55 | 2005-05-26
US20050109611A1
Chemistry; metallurgy

Electroplating apparatus with segmented anode array

#56 | 2005-05-26
US20050109088A1
Electricity

Integrated tool with automated calibration system and interchangeable wet processing components for processing microfeature workpieces

#57 | 2005-05-10
US10167763
-

Reactor vessel having improved cup, anode and conductor assembly

#58 | 2005-03-22
US9998142
-

Methods and apparatus for processing the surface of a microelectronic workpiece

#59 | 2005-02-17
US20050034809A1
Electricity

Integrated tool with interchangeable wet processing components for processing microfeature workpieces and automated calibration systems

#60 | 2005-02-01
US10338200
-

Electroplating reactor including back-side electrical contact apparatus

#61 | 2005-01-13
US20050006241A1
Chemistry; metallurgy

Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces

#62 | 2005-01-06
US20050000817A1
Chemistry; metallurgy

Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods

InventorID:

133101 ⎘