Beaverton, Oregon
United States
7
2015-10-22
The entities that hold a legal rights for patent applications filed by inventor TOLCHINSKY Peter:
Peter TOLCHINSKY from Beaverton, US has applied for patents for these inventions. The list has both pending applications and granted patents:
Epitaxial wafer and a method of manufacturing thereof
#2 | 2008-05-01Ultra-thin oxide bonding for S1 to S1 dual orientation bonding
#3 | 2008-04-03Dual crystal orientation circuit devices on the same substrate
#4 | 2006-08-10Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
#5 | 2005-08-11Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
#6 | 2005-06-21Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process
#7 | 2005-03-17Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices
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