Jens POHL

RADIATION SOURCE DEVICE

METHOD FOR PRODUCING A SMART CARD INLAY, SMART CARD INLAY AND SMART CARD

ELECTRONIC INHALATION APPARATUS WITH A CHIP MODULE FIXED WITH A FOLDING STRUCTURE

DOCUMENT STRUCTURE FORMATION

ANNULAR DEVICE FORMATION

CHIP ASSEMBLY, METHOD FOR FORMING A CHIP ASSEMBLY, AND METHOD FOR USING A CHIP ARRANGEMENT

SEMICONDUCTOR DEVICE FOR PARTICLE MEASUREMENT AND METHOD FOR OPERATING THE SEMICONDUCTOR DEVICE

CHIP-INTERCONNECT ARRANGEMENT, METHOD FOR FORMING A CHIP-INTERCONNECT ARRANGEMENT, DOCUMENT STRUCTURE AND METHOD FOR FORMING A DOCUMENT STRUCTURE

SMART CARD MODULE, SMART CARD MODULE ARRANGEMENT AND SMART CARD

Radiation source device

PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FORMING A CHIP CARD

METHOD FOR CREATING A DOCUMENT STRUCTURE, AND DOCUMENT STRUCTURE

CHIP CARD BIOMETRIC SENSOR COMPONENT

ELECTRONIC CIGARETTE DEVICE, ELECTRONIC CIGARETTE, METHOD OF FORMING AN ELECTRONIC CIGARETTE DEVICE AND METHOD OF FORMING AN ELECTRONIC CIGARETTE

SET OF DEVICES FOR AN ELECTRONIC CIGARETTE, PACKAGING FOR ACCOMMODATING SEVERAL DEVICES FOR AN ELECTRONIC CIGARETTE, BASE ELEMENT FOR AN ELECTRONIC CIGARETTE AND ELECTRONIC CIGARETTE SYSTEM

Chip card body, method for forming a chip card body and chip card

Package, method for forming a package, carrier tape, chip card and method for forming a carrier tape

Electronic inhalation apparatus with a chip module fixed with a folding structure

Sensor device, method for forming a sensor device, carrier tape, chip card and method for forming a chip card

Sensor device, method of forming a sensor device, chip card and method of forming a chip card

Tank apparatus for an electronic inhalation device, electronic inhalation device and method for authenticating a tank apparatus of an electronic inhalation device

Method and device for trimming an antenna applied on a carrier, method for producing a carrier structure, carrier structure and chip card

Smart card module, method for producing a smart card module, smart card and method for testing a smart card module

Chip carrier and method thereof

Chip card module, chip card, chip card arrangement, method of forming a chip card module, and method of forming a chip card

Electronic identification document

Chip card module and method for producing a chip card module

SMART CARD AND METHOD FOR PRODUCING A SMART CARD

Chip card and method of forming a chip card

Chip carrier, a device and a method

Semiconductor device including at least one element

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Chip card module arrangement, chip card arrangement and method for producing a chip card arrangement

Smart card module, smart card, and method for producing a smart card module

Smart card module, smart card body, smart card and smart card production method

Smart card module arrangement, smart card, method for producing a smart card module arrangement and method for producing a smart card

On-chip RF shields with backside redistribution lines

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

SEMICONDUCTOR DEVICE INCLUDING AT LEAST ONE ELEMENT

Semiconductor package and method for fabricating the same

Chip card module

Semiconductor structure and method for making same

Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips

Semiconductor structure and method for making same

On-chip RF shields with backside redistribution lines

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor structure and method for making same

Semiconductor structure and method for making same

Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package

Device fabricated using an electroplating process

Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chip

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Reconfigured wafer alignment

Semiconductor device including conductive element

On-chip RF shields with backside redistribution lines

On-chip RF shields with through substrate conductors

Semiconductor device including adhesive covered element

Semiconductor device

Through substrate via semiconductor components

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

Stackable semiconductor package with encapsulant and electrically conductive feed-through

Base semiconductor component for a semiconductor component stack and method for the production thereof

Semiconductor device including covering a semiconductor with a molding compound and forming a through hole in the molding compound

Structure for electrostatic discharge in embedded wafer level packages

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Integrated circuit with re-route layer and stacked die assembly

Semiconductor component with plastic housing, and process for producing the same

Plastic housing and semiconductor component with said plastic housing

Method for producing a module with components stacked one above another

Electronic circuit in a package-on-package configuration and method for producing the same

Semiconductor device stack and method for its production

Semiconductor device having a chip stack on a rewiring plate

Sensor component and panel used for the production thereof

Electronic structure with components connected by way of solderable connecting elements and method

Method for coating a structure comprising semiconductor chips

Coupling substrate for semiconductor components and method for producing the same

Method for applying a structure of joining material to the back surfaces of semiconductor chips

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Package for an electronic component and method for its production

Semiconductor device having a through contact through a housing composition and method for producing the same

Smart card, smart card module, and a method for production of a smart card module

Method for populating a substrate with electronic components

Semiconductor wafer, an electronic component, and a component carrier for producing the electronic component

Electronic component and a panel

Placement system for populating a substrate with electronic components

Semiconductor component with plastic housing, and process for producing the same

Connection of integrated circuits

Integrated circuit with re-route layer and stacked die assembly

Semiconductor module with a semiconductor stack, and methods for its production

Electronic component with flexible contacting pads and method for producing the electronic component

Method for connecting circuit devices

Electronic component with flexible contacting pads and method for producing the electronic component

Electronic module having plug contacts and method for producing it

Encasing arrangement for a semiconductor component