Michael Bauer

ENCAPSULANT WITH ORGANIC CONSTITUENT AND INORGANIC CONSTITUENT HAVING ADJUSTED RELATIVE DIELECTRIC CONSTANT

Chip package, method of forming a chip package and method of forming an electrical contact

Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Ion manipulation methods and related apparatuses and systems for semiconductor encapsulation materials

Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package

Method for handling a product substrate and a bonded substrate system

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound

Chip package and method of forming a chip package

Method for handling a product substrate, a bonded substrate system and a temporary adhesive

Method for attaching a semiconductor die to a carrier

Method for fabricating a semiconductor package and semiconductor package

Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages

CHIP PACKAGES, CHIP ARRANGEMENTS, A CIRCUIT BOARD, AND METHODS FOR MANUFACTURING CHIP PACKAGES

Chip arrangement and method for producing a chip arrangement

Method for fabricating a semiconductor device

SEMICONDUCTOR COMPONENT HAVING A STACK OF SEMICONDUCTOR CHIPS AND METHOD FOR PRODUCING THE SAME

Chip arrangement and method for producing a chip arrangement

Semiconductor component and production method

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor device having a semiconductor chip, and method for the production thereof

Method of applying an adhesive layer on thincut semiconductor chips of a semiconductor wafer

Semiconductor device having a semiconductor chip, and method for the production thereof

Semiconductor component having a stack of semiconductor chips and method for producing the same

Electronic device and method of manufacturing same

Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material

Device including a housing for a semiconductor chip including leads extending into the housing

Semiconductor device including electronic component coupled to a backside of a chip

Semiconductor device with leadframe including a diffusion barrier

Semiconductor device with semiconductor chip and method for producing it

Semiconductor device having a sensor chip, and method for producing the same

Semiconductor device including a stress buffer

Semiconductor device having through contacts through a plastic housing composition and method for the production thereof

METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Lead structure for a semiconductor component and method for producing the same

Semiconductor component and production method

Chip arrangement and method for producing a chip arrangement

Sensor component with a cavity housing and a sensor chip and method for producing the same

Semiconductor module with at least two substrates

Module with carrier element

Component arrangement comprising a carrier

LAYER FOR CHIP CONTACT ELEMENT

Module with a shielding and/or heat dissipating element

MULTI-CHIP ASSEMBLY

Semiconductor component with plastic housing, and process for producing the same

Plastic housing and semiconductor component with said plastic housing

Method for producing a module with components stacked one above another

Integrated circuit component with a surface-mount housing

Electronic Device and Method For Producing the Same

Electronic component of VQFN design and method for producing the same

Electronic circuit in a package-in-package configuration and production method

Electronic circuit in a package-on-package configuration and method for producing the same

Method for manufacturing an electronic component and corresponding electronic component

Semiconductor device stack and method for its production

Circuit Arrangement, System Carrier and Methods for Producing Same

Electronic module with a semiconductor chip and a component housing and methods for producing the same

Semiconductor module having discrete components and method for producing the same

Semiconductor device having an adhesion promoting layer and method for producing it

Semiconductor chip comprising a metal coating structure and associated production method

Layer between interfaces of different components in semiconductor devices

Wiring substrate of a semiconductor component comprising rubber-elastic pads embedded in said wiring substrate and method for producing the same

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same

Semiconductor component including semiconductor chip and method for producing the same

Semiconductor device with a wiring substrate and method for producing the same

Electronic structure with components connected by way of solderable connecting elements and method

Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereof

Method for coating a structure comprising semiconductor chips

Method for producing through-contacts and a semiconductor component with through-contacts

Method for applying a structure of joining material to the back surfaces of semiconductor chips

Semiconductor device having a semiconductor chip, and method for the production thereof

Power semiconductor device in lead frame employing connecting element with conductive film

Semiconductor device with semiconductor chip and adhesive film and method for producing the same

External contact material for external contacts of a semiconductor device and method of making the same

Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition

Support with solder ball elements and a method for populating substrates with solder balls

Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip

Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same

Semiconductor device with semiconductor device components embedded in a plastics composition

Panel and semiconductor component having a composite board with semiconductor chips and plastic package molding compound and method for the production thereof

Package for an electronic component and method for its production

Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof

Panel and semiconductor device having a composite plate with semiconductor chips

Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material

Electronic module and method for the production thereof

Semiconductor device with a recessed bond pad

Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite

Plastic package and semiconductor component comprising such a plastic package, and method for its production

Electronic component with cavity fillers made from thermoplast and method for production thereof

Semiconductor component with plastic housing, and process for producing the same

Biosensor with smart card configuration

Semiconductor component and sensor component for data transmission devices

Semiconductor component with electromagnetic shielding device

Electronic module, panel having electronic modules which are to be divided up, and process for the production thereof