Daniel Delprat

HETEROSTRUCTURE AND METHOD OF FABRICATION

Heterostructure and method of fabrication

METHOD FOR FORMING A HANDLING SUBSTRATE FOR A COMPOSITE STRUCTURE INTENDED FOR RF APPLICATIONS AND HANDLING SUBSTRATE

Heterostructure and method of fabrication

Method for manufacturing a semiconductor on insulator type structure by layer transfer

Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit

Heterostructure and method of fabrication

Heterostructure and method of fabrication

Method for manufacturing a semiconductor on insulator structure having low electrical losses

SYSTEMS AND METHODS FOR MOLECULAR BONDING OF SUBSTRATES

Method for transferring a layer of a semiconductor and substrate comprising a confinement structure

Method for manufacturing a semiconductor-on-insulator structure having low electrical losses

QUANTUM WELL THERMOELECTRIC COMPONENT FOR USE IN A THERMOELECTRIC DEVICE

Semiconductor on glass substrate with stiffening layer

Method for molecular bonding of silicon and glass substrates

Process of making semiconductor on glass substrates with a stiffening layer

Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate

Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure

Method for molecular bonding of silicon and glass substrates

Semiconductor on glass substrate with stiffening layer and process of making the same

Method of bonding two substrates

Bonding interface quality by cold cleaning and hot bonding

Methods for manufacturing compound-material wafers and for recycling used donor substrates

Method of configuring a process to obtain a thin layer with a low density of holes

Methods for preparing a bonding surface of a semiconductor wafer