S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES

Etchant for controlled etching of Ge and Ge-rich silicon germanium alloys

#2 | 2012-08-09 ✅ Patent 8,436,363 granted on 2013-05-07

US20120199845A1

Metallic carrier for layer transfer and methods for forming the same

#3 | 2012-07-26

US20120190170A1

PRECISE OXIDE DISSOLUTION

#4 | 2012-04-19

US20120091100A1

ETCHANT FOR CONTROLLED ETCHING OF GE AND GE-RICH SILICON GERMANIUM ALLOYS

#5 | 2012-04-05 ✅ Patent 8,133,806 granted on 2012-03-13

US20120083101A1

Systems and methods for forming semiconductor materials by atomic layer deposition

#6 | 2012-03-29 ✅ Patent 8,283,673 granted on 2012-10-09

US20120074427A1

Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride

#7 | 2011-12-15

US20110305835A1

SYSTEMS AND METHODS FOR A GAS TREATMENT OF A NUMBER OF SUBSTRATES

#8 | 2011-11-24 ✅ Patent 8,241,942 granted on 2012-08-14

US20110287571A1

Method of fabricating a back-illuminated image sensor

#9 | 2011-11-24 ✅ Patent 8,377,802 granted on 2013-02-19

US20110284863A1

III-V semiconductor structures and methods for forming the same

#10 | 2011-09-29 ✅ Patent 8,461,018 granted on 2013-06-11

US20110233720A1

Treatment for bonding interface stabilization

#11 | 2011-09-08 ✅ Patent 8,253,170 granted on 2012-08-28

US20110215380A1

Electronic devices with improved OHMIC contact

#12 | 2011-07-07 ✅ Patent 8,871,607 granted on 2014-10-28

US20110163410A1

Method for producing hybrid components

#13 | 2011-06-30 ✅ Patent 8,765,508 granted on 2014-07-01

US20110156212A1

Methods of fabricating semiconductor structures or devices using layers of semiconductor material having selected or controlled lattice parameters

#14 | 2011-05-19 ✅ Patent 8,114,754 granted on 2012-02-14

US20110114965A1

Methods of fabricating semiconductor structures and devices using glass bonding layers, and semiconductor structures and devices formed by such methods

#15 | 2011-05-05 ✅ Patent 8,692,260 granted on 2014-04-08

US20110101373A1

Method of forming a composite laser substrate

#16 | 2011-04-28 ✅ Patent 8,093,686 granted on 2012-01-10

US20110095400A1

Process for obtaining a hybrid substrate comprising at least one layer of a nitrided material

#17 | 2011-03-31 ✅ Patent 8,505,197 granted on 2013-08-13

US20110076849A1

Methods of fabricating multilayer substrates

#18 | 2011-03-03 ✅ Patent 8,062,957 granted on 2011-11-22

US20110053342A1

Semiconductor substrate surface preparation method

#19 | 2011-03-03 ✅ Patent 7,968,909 granted on 2011-06-28

US20110049528A1

Reconditioned substrates for fabricating compound material wafers

#20 | 2011-02-17 ✅ Patent 7,939,428 granted on 2011-05-10

US20110039368A1

Methods for making substrates and substrates formed therefrom

#21 | 2011-02-10 ✅ Patent 8,058,149 granted on 2011-11-15

US20110034006A1

Method for fabricating a semiconductor substrate

#22 | 2011-02-03 ✅ Patent 8,318,612 granted on 2012-11-27

US20110024747A1

Methods for improving the quality of group III-nitride materials and structures produced by the methods

#23 | 2011-01-20 ✅ Patent 8,093,077 granted on 2012-01-10

US20110012128A1

Method for manufacturing a layer of gallium nitride or gallium and aluminum nitride

#24 | 2011-01-20 ✅ Patent 9,070,818 granted on 2015-06-30

US20110011450A1

Methods and structures for bonding elements

#25 | 2011-01-13 ✅ Patent 7,981,768 granted on 2011-07-19

US20110008948A1

Method for transferring an epitaxial layer

#26 | 2010-12-23 ✅ Patent 8,153,504 granted on 2012-04-10

US20100323496A1

Process for manufacturing a composite substrate

#27 | 2010-12-16 ✅ Patent 8,049,224 granted on 2011-11-01

US20100314628A1

Process for transferring a layer of strained semiconductor material

#28 | 2010-11-18 ✅ Patent 8,058,158 granted on 2011-11-15

US20100289113A1

Hybrid semiconductor substrate including semiconductor-on-insulator region and method of making the same

#29 | 2010-10-14 ✅ Patent 8,431,964 granted on 2013-04-30

US20100258846A1

Electronic device with controlled electrical field

#30 | 2010-10-07 ✅ Patent 8,076,219 granted on 2011-12-13

US20100255659A1

Reduction of watermarks in HF treatments of semiconducting substrates

#31 | 2010-09-30

US20100244203A1

SEMICONDUCTOR STRUCTURE HAVING A PROTECTIVE LAYER

#32 | 2010-08-26 ✅ Patent 8,153,536 granted on 2012-04-10

US20100216316A1

Transfer of high temperature wafers

#33 | 2010-08-19 ✅ Patent 7,919,393 granted on 2011-04-05

US20100210090A1

Forming structures that include a relaxed or pseudo-relaxed layer on a substrate

#34 | 2010-08-19 ✅ Patent 8,389,380 granted on 2013-03-05

US20100207236A1

Method for making a substrate of the semiconductor on insulator type with an integrated ground plane

#35 | 2010-08-12 ✅ Patent 8,435,897 granted on 2013-05-07

US20100200854A1

Method for reclaiming a surface of a substrate

#36 | 2010-08-05

US20100193899A1

PRECISE OXIDE DISSOLUTION

#37 | 2010-07-29

US20100190416A1

Device for polishing the edge of a semiconductor substrate

#38 | 2010-07-29

US20100190000A1

METHOD OF FABRICATING A COMPOSITE STRUCTURE WITH A STABLE BONDING LAYER OF OXIDE

#39 | 2010-07-15 ✅ Patent 8,153,500 granted on 2012-04-10

US20100178749A1

Method of fabricating an epitaxially grown layer on a composite structure

#40 | 2010-07-15 ✅ Patent 8,003,493 granted on 2011-08-23

US20100176493A1

Method of splitting a substrate

#41 | 2010-07-01

US20100164048A1

METHOD FOR FABRICATING A SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR SUBSTRATE

#42 | 2010-06-17 ✅ Patent 7,977,747 granted on 2011-07-12

US20100148322A1

Composite substrate and method of fabricating the same

#43 | 2010-04-29 ✅ Patent 8,088,671 granted on 2012-01-03

US20100105217A1

Defectivity of post thin layer separation by modification of its separation annealing

#44 | 2010-04-08 ✅ Patent 8,067,298 granted on 2011-11-29

US20100087049A1

Relaxation of a strained material layer with application of a stiffener

#45 | 2010-02-18 ✅ Patent 8,309,437 granted on 2012-11-13

US20100038756A1

(110) oriented silicon substrate and a bonded pair of substrates comprising said (110) oriented silicon substrate

#46 | 2010-02-18 ✅ Patent 7,968,390 granted on 2011-06-28

US20100038682A1

Electronic devices with improved ohmic contact

#47 | 2010-02-11 ✅ Patent 7,736,935 granted on 2010-06-15

US20100035418A1

Passivation of semiconductor structures having strained layers

#48 | 2010-02-11 ✅ Patent 7,981,767 granted on 2011-07-19

US20100032793A1

Methods for relaxation and transfer of strained layers and structures fabricated thereby

#49 | 2010-01-21 ✅ Patent 7,972,939 granted on 2011-07-05

US20100015780A1

Transfer method with a treatment of a surface to be bonded

#50 | 2010-01-14 ✅ Patent 7,863,650 granted on 2011-01-04

US20100006857A1

Multilayer structure and fabrication thereof

#51 | 2009-12-31 ✅ Patent 7,977,705 granted on 2011-07-12

US20090321873A1

Low-cost substrates having high-resistivity properties and methods for their manufacture

#52 | 2009-12-31 ✅ Patent 8,013,417 granted on 2011-09-06

US20090321872A1

Low cost substrates and method of forming such substrates

#53 | 2009-12-31 ✅ Patent 8,035,163 granted on 2011-10-11

US20090321829A1

Low-cost double-structure substrates and methods for their manufacture

#54 | 2009-12-24 ✅ Patent 7,956,436 granted on 2011-06-07

US20090315140A1

Method of forming a device wafer with recyclable support

#55 | 2009-12-03 ✅ Patent 8,091,601 granted on 2012-01-10

US20090294072A1

Equipment for bonding by molecular adhesion

#56 | 2009-11-26 ✅ Patent 7,839,001 granted on 2010-11-23

US20090289332A1

Methods for making substrates and substrates formed therefrom

#57 | 2009-11-12 ✅ Patent 8,232,130 granted on 2012-07-31

US20090280595A1

Process for assembling wafers by means of molecular adhesion

#58 | 2009-10-22 ✅ Patent 7,968,911 granted on 2011-06-28

US20090261344A1

Relaxation of a strained layer using a molten layer

#59 | 2009-09-17 ✅ Patent 8,093,138 granted on 2012-01-10

US20090229743A1

Method of fabricating an epitaxially grown layer

#60 | 2009-08-20 ✅ Patent 8,545,628 granted on 2013-10-01

US20090205563A1

Temperature-controlled purge gate valve for chemical vapor deposition chamber

#61 | 2009-07-30 ✅ Patent 7,851,330 granted on 2010-12-14

US20090191719A1

Methods for fabricating compound material wafers

#62 | 2009-07-16 ✅ Patent 8,012,289 granted on 2011-09-06

US20090179299A1

Method of fabricating a release substrate

#63 | 2009-04-30 ✅ Patent 7,892,951 granted on 2011-02-22

US20090111243A1

SOI substrates with a fine buried insulating layer

#64 | 2009-04-09 ✅ Patent 7,732,306 granted on 2010-06-08

US20090091002A1

Methods for producing improved epitaxial materials

#65 | 2009-03-05 ✅ Patent 7,749,908 granted on 2010-07-06

US20090061545A1

Edge removal of silicon-on-insulator transfer wafer

#66 | 2009-02-05 ✅ Patent 7,939,427 granted on 2011-05-10

US20090035920A1

Process for fabricating a substrate of the silicon-on-insulator type with reduced roughness and uniform thickness

#67 | 2009-02-05 ✅ Patent 7,939,387 granted on 2011-05-10

US20090032911A1

Patterned thin SOI

#68 | 2009-01-15 ✅ Patent 7,799,651 granted on 2010-09-21

US20090014720A1

Method of treating interface defects in a substrate

#69 | 2008-12-11 ✅ Patent 7,902,045 granted on 2011-03-08

US20080303118A1

Process for fabricating a structure for epitaxy without an exclusion zone

#70 | 2008-12-11 ✅ Patent 7,767,545 granted on 2010-08-03

US20080303061A1

Substrate production method and substrate including amorphization and recrystallizing a top region

#71 | 2008-11-27 ✅ Patent 7,622,330 granted on 2009-11-24

US20080293217A1

Semiconductor substrates having useful and transfer layers

#72 | 2008-11-27 ✅ Patent 7,655,537 granted on 2010-02-02

US20080293185A1

Semiconductor substrates having useful and transfer layers

#73 | 2008-10-30 ✅ Patent 7,803,694 granted on 2010-09-28

US20080265261A1

Process for transferring a layer of strained semiconductor material

#74 | 2008-10-23 ✅ Patent 7,605,054 granted on 2009-10-20

US20080261377A1

Method of forming a device wafer with recyclable support

#75 | 2008-10-23 ✅ Patent 8,093,687 granted on 2012-01-10

US20080258265A1

Methods for forming an assembly for transfer of a useful layer using a peripheral recess area to facilitate transfer

#76 | 2008-10-16 ✅ Patent 7,807,482 granted on 2010-10-05

US20080254596A1

Method for transferring wafers

#77 | 2008-10-09 ✅ Patent 7,645,684 granted on 2010-01-12

US20080248631A1

Wafer and method of producing a substrate by transfer of a layer that includes foreign species

#78 | 2008-10-09 ✅ Patent 7,741,678 granted on 2010-06-22

US20080248251A1

Semiconductor substrates having useful and transfer layers

#79 | 2008-09-04 ✅ Patent 7,646,038 granted on 2010-01-12

US20080210975A1

Method of fabricating heteroepitaxial microstructures

#80 | 2008-08-21 ✅ Patent 7,645,682 granted on 2010-01-12

US20080200008A1

Bonding interface quality by cold cleaning and hot bonding

#81 | 2008-08-14 ✅ Patent 7,452,785 granted on 2008-11-18

US20080194084A1

Method of fabrication of highly heat dissipative substrates

#82 | 2008-08-14 ✅ Patent 7,611,974 granted on 2009-11-03

US20080191239A1

Multilayer structure and fabrication thereof

#83 | 2008-08-07 ✅ Patent 7,666,758 granted on 2010-02-23

US20080188060A1

Process for fabricating a substrate of the silicon-on-insulator type with thin surface layer

#84 | 2008-07-24 ✅ Patent 7,807,548 granted on 2010-10-05

US20080176382A1

Process of forming and controlling rough interfaces

#85 | 2008-07-24 ✅ Patent 8,268,703 granted on 2012-09-18

US20080176381A1

Surface roughening process

#86 | 2008-07-24 ✅ Patent 7,736,994 granted on 2010-06-15

US20080176380A1

Method for manufacturing compound material wafers and corresponding compound material wafer

#87 | 2008-06-26 ✅ Patent 7,531,430 granted on 2009-05-12

US20080153313A1

Method for producing a semiconductor-on-insulator structure

#88 | 2008-06-26 ✅ Patent 7,615,466 granted on 2009-11-10

US20080153257A1

Method for producing a semiconductor-on-insulator structure

#89 | 2008-06-26 ✅ Patent 7,422,958 granted on 2008-09-09

US20080153251A1

Method of fabricating a mixed substrate

#90 | 2008-06-19 ✅ Patent 7,544,976 granted on 2009-06-09

US20080142844A1

Semiconductor heterostructure

#91 | 2008-06-05 ✅ Patent 7,459,374 granted on 2008-12-02

US20080132031A1

Method of manufacturing a semiconductor heterostructure

#92 | 2008-05-29 ✅ Patent 7,635,670 granted on 2009-12-22

US20080124938A1

Chromium-free etching solution for si-substrates and uses therefor

#93 | 2008-05-29 ✅ Patent 7,524,739 granted on 2009-04-28

US20080124899A1

Method of improving a surface of a semiconductor substrate

#94 | 2008-05-01 ✅ Patent 7,833,877 granted on 2010-11-16

US20080102601A1

Method for producing a semiconductor substrate

#95 | 2008-05-01 ✅ Patent 7,579,309 granted on 2009-08-25

US20080099718A1

Methods for characterizing defects on silicon surfaces and etching composition and treatment process therefor

#96 | 2008-02-14 ✅ Patent 8,062,564 granted on 2011-11-22

US20080038564A1